• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 춘계학술대회 논문집
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• pp.521-527
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• 2002

This paper presents a dynamic modeling and a robust PID controller design process for the wire bonder head assembly. For the modeling elements, the system is divided into electrical system, magnetic system, and mechanical system. Each system is modeled by using the bond graph method. The PID controller is used for high speed/high accuracy position control of the wire bonder assembly. The Taguchi method is used to evaluate the more robust PID gain combinations than conventional one. This study makes use of an L18 array with three parameters varied on three levels. Computer simulations and experimental results show that the designed PID controller provides more improved signal to noise ratio and reduced sensitivity than the conventional PID controller.