Direct Bonding Characteristics of 2 inch 3C-SiC Wafers for MEMS in Hash Environments (극한환경 MEMS용 2 inch 3C-SiC 기판의 직접접합 특성)
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- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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- 2002.11a
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- pp.387-390
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- 2002