• Analytical Science and Technology
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• v.14 no.1
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• pp.88-93
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• 2001

To measure the levels of dioxins in food selling at local markets, meat was analyzed by high resolution gas chromatography/high resolution ass spectrometry (HRGC/HRMS). The food samples were obtained from 5 large cities of Seoul, Chunchon, Daejon, Kwangju and Busan in Korea. All the samples were minced and extracted with Soxhlet extractor for 18 hours. After extraction, extracts were cleaned up by sulfuric acid impregnated silica gel, purified on a series of silica gel, alumina, carbon column chromatography and then analyzed by HRGC/HRMS. The contaminated levels were calculated as the TEQs by multiplying with the corresponding WHO-TEFs for each congeners. The overall recoveries were ranged from 80% to 153% and the limit of detection was about 0.01 ppt at S/N>3. The levels of PCDD/Fs for beef, pork and chicken were 0.018, 0.008 and <0.001 pgTEQ/g, respectively. In addition, the levels of non-ortho-co-planar PCBs for beef, pork and chicken were 0.008, 0.002 and 0.001 pgTEQ/g, respectively. Among food samples analyzed, chicken showed the lowest level of dioxin-like compounds. Regarding congener pattern, OCDD and PCB #77 were the highest contributing congeners.

• Journal of Korean Society of Environmental Engineers
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• v.32 no.9
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• pp.870-878
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• 2010

We investigated the concentration and the sources of ubiquitous persistent organic pollutants [i.e., 17 toxic polychlorinated dibenzo-p-dioxins and dibenzofurans (PCDD/Fs), 12 coplanar polychlorinated biphenyls (Co-PCBs), and 16 priority polycyclic aromatic hydrocarbons (PAHs)] in waste papers and lumbers from industrial complexes. The total concentrations in waste papers and lumbers ranged from 9.69~176.77 pg/g-dry and 0.14~0.25 pg/g-dry for 17 PCDD/Fs, 109.95~4097.25 pg/g-dry and 28.23~59.88 pg/g-dry for 12 Co-PCBs and 9.30~52.18 ng/g-dry and 0.82~1.82 ng/g-dry for 16 PAHs respectively. Generally, the concentration of these pollutants in waste papers was higher than those in waste lumbers. OCDD was dominant in waste papers and lumbers and the PCDD/F patterns of these samples were similar with that of stack gas. The distribution patterns of Co-PCBs in wastes were related with commercial PCB products, indicating the effect of commercial PCB products on ubiquitous environment. The diagnostic ratios of several PAH compounds in waste paper showed that they were related with pyrogenic sources.

• Journal of Electrical Engineering and Technology
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• v.13 no.4
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• pp.1638-1643
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• 2018

Multi-layer ceramic capacitors as decoupling capacitor were fabricated by dielectric composition with a high dielectric constant. The fabricated decoupling capacitors were embedded in the PCB of the 10G RF transceiver module and evaluated for the characteristics of electrical noise by the level of AC input voltage. In order to further improve the electrical properties of the $BaTiO_3$ based composite, glass frit, MgO, $Y_2O_3$, $Mn_3O$, $V_2O_5$, $BaCO_3$, $SiO_2$, and $Al_2O_3$ were used as additives. The electrical properties of the composites were determined by various amounts of additives and optimum sintering temperature. As a result of the optimized composite, it was possible to obtain a density of $5.77g/cm^3$, a dielectric constant of 1994, and an insulation resistance of $2.91{\times}10^{12}{\Omega}$ at an additive content of 5wt% and a sintering temperature of $1250^{\circ}C$. After forming a $2.5{\mu}m$ green sheet using the doctor blade method, a total of 77 layers were laminated and sintered at $1180^{\circ}C$. A decoupling capacitor with a size of $0.6mm(W){\times}0.3mm(L){\times}0.3mm(T)$ (width, length and thickness, respectively) and a capacitance of 100 nF was embedded using a PCB process for the 10G RF Transceiver modules. In the range of AC input voltage 400mmV @ 500kHz to 2200mV @ 900kHz, the embedded 10G RF Transceiver modules evaluated that it has better electrical performance than the non-embedded modules.

• Proceedings of the Korean Institute of Resources Recycling Conference
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• 2005.05a
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• pp.73-77
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• 2005

• Analytical Science and Technology
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• v.19 no.3
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• pp.263-271
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• 2006

The levels of total PCBs, Co-PCBs and PCDD/Fs in the transformer insulation oil samples obtained using GC/ECD and HRGC/HRMS were ranged from N.D. to 77.3 ppm, from 0.0863 to 2.49 ppm and from N.D. to 0.00241 ppm, respectively. In terms of WHO-TEQ values, Co-PCBs and PCDD/Fs were ranged from 23.3 to 600 pgTEQ/g and from N.D. to 128 pgTEQ/g, respectively (${\Sigma}Co$-PCBs+PCDD/Fs concentration was calculated 24.4~728 pgTEQ/g). Although, the contribution of PCDD/Fs was below 12% in total TEQ concentration, it is suggested contamination of PCDD/Fs in transformer insulation oils. Among 10 samples, 4 samples showed higher concentration than 2 ppm (specific waste criterion of Korea) and Aroclor 1242, 1248, 1254 and 1260 was detected in samples as a single or mixture of Aroclor. It was shown reliable relationship between concentration of Co-PCBs and those of PCDD/Fs (p<0.003), however, was not shown between production year of transformer and concentration of PCBs. The distribution pattern of Co-PCB congeners showed that the ratios of mono-ortho substituted congeners were higher than non-ortho substituted congeners. Among that, PCB-118 congener was predominant. In addition, the OCDD congener was predominated in PCDD/Fs congeners as above 53%. Moreover, the congener pattern of Co-PCBs was similar to that of Aroclor as well as ambient air, which suggested that PCBs volatilization from transformer insulation oil affected the pattern of Co-PCBs in ambient air.

• Journal of Environmental Science International
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• v.13 no.5
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• pp.469-478
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• 2004

Atmospheric bulk (wet and dry) samples were monthly collected in an urban environment (Daeyeon-dong) of Busan over a year, to assess the deposition flux and seasonality of dioxin-like polychlorinated biphenyls (DLPCBs) using stainless steel pots. Deposition fluxes of DLPCBs in bulk samples were determined using high resolution gas chromatography coupled to high resolution mass spectrometry (HRGC/HRMS). Particle deposition fluxes in the urban environment varied from 23 to 98 $mg^2$/year (mean 41 $gm^2$/year). DLPCB deposition fluxes in atmospheric bulk samples ranged from 0.09 to 0.77 ng-$TEQ/m^2$/year (mean 0.35 ng-$TEQ/m^2$/year). Seasonal atmospheric deposition fluxes of DLPCBs were high in winter and low in summer. Atmospheric deposition fluxes of particles and DLPCBs in this study were comparable to or slightly lower values than those of different locations in the world. Monthly DLPCB profiles in deposition bulk samples were similar over a year. Non-ortho PCBs were higher contributions to the total DLPCBs fluxes than mono-ortho PCBs. In particular, PCB 126 had the highest concentrartion (>75%) in all deposition samples, followed by PCB 169 and PCB 156. A highly positive correlation was found among the deposition fluxes of DLPCB species, suggesting the possibility of that the DLPCB contamination originated from one source. The deposition fluxes of DLPCBs were not significantly correlated with temperature and the amount of precipitation even though the summer season with the highest temperature and the largest amount of precipitation showed the lowest DLPCB deposition flux.

• Korean Journal of Metals and Materials
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• v.50 no.1
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• pp.71-77
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• 2012

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.29 no.10
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• pp.758-765
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• 2018

This paper presents a 24-GHz frequency-modulated continuous wave(FMCW) radar transceiver with two Rx and one Tx channels in 65-nm complementary metal-oxide-semiconductor(CMOS) process and implemented it on a radar system using the developed transceiver chip. The transceiver chip includes a $14{\times}$ frequency multiplier, low-noise amplifier, down-conversion mixer, and power amplifier(PA). The transmitter achieves >10 dBm output power from 23.8 to 24.36 GHz and the phase noise is -97.3 GHz/Hz at a 1-MHz offset. The receiver achieves 25.2 dB conversion gain and output $P_{1dB}$ of -31.7 dBm. The transceiver consumes 295 mW of power and occupies an area of $1.63{\times}1.6mm^2$. The radar system is fabricated on a low-loss Duroid printed circuit board(PCB) stacked on the low-cost FR4 PCBs. The chip and antenna are placed on the Duroid PCB with interconnects and bias, gain blocks and FMCW signal-generating circuitry are mounted on the FR4 PCB. The transmit antenna is a $4{\times}4$ patch array with 14.76 dBi gain and receiving antennas are two $4{\times}2$ patch antennas with a gain of 11.77 dBi. The operation of the radar is evaluated and confirmed by detecting the range and azimuthal angle of the corner reflectors.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.77-86
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• 2008

The reliability of leaded and lead-free solders of BGA type packages on a printed circuit board was investigated by employing the standard drop test and 4-point bending test. Tested solder joints were examined by optical microscopy to identify associated failure mode. Three-dimensional finite element analysis(FEM) with ANSYS Workbench v.11 was carried out to understand the mechanical behavior of solder joints under the influence of bending or drop impact. The results of numerical analysis are in good agreement with those obtained by experiments. Packages in the center of the PCB experienced higher stress than those in the perimeter of the PCB. The solder joints located in the outermost comer of the package suffered from higher stress than those located in center region. In both drop and bending impact tests, the lead-free solder showed better performances than the leaded solders. The numerical analysis results indicated that stress and strain behavior of solder joint were dependent on various effective parameters.

• Journal of Welding and Joining
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• v.17 no.1
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• pp.77-81
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• 1999

Through-hole PCB(Printed Circuit Board) was soldered by flow soldering process using cleaning or noncleaning fluxes. Preheating temperature and conveyor speed were changed in the range of 323∼413K and 0.3∼2m/min respectively. The soldered joints were tensile tested in order to evaluated bonding strength. As experimental results, relatively high tensile fracture load, 120∼140N, were obtained in case of preheating temperature of 383K, and conveyor speed was 0.6∼1.0 m/min. Fractured surfaces of higher tensile strength show some dimple area, while those of lower tensile fracture load show brittle fracture.