• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.14-15
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• 2006

Application of the parallel Build-up is increasing continuously. This report presents about the PCB Build-up technology since 2000. Among the parallel build-up technologies, PALAP application - after making the via, filling the via with electric conductive paste, then expose to make wiring pattern and put them by layer without any glue or middle - is actively developing, especially DENSO company.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.8
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• pp.702-707
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• 2002

This paper presents a micro fluxgate sensor in printed circuit board (PCB). The fluxgate sensor consists of five PCB stack layers including one layer magnetic core and four layers of excitation and pick-up coils. The center layer as a magnetic core is made of a micro patterned amorphous magnetic ribbon and the core has a rectangular-ring shape. The amorphous magnetic core is easily saturated due to the low coercive field and closed magnetic path for the excitation field. Four outer layers as an excitation and pick-up coils have a planar solenoid structure. The chip size of the fabricated sensing element is 7.3$\times$5.7$\textrm{mm}^2$. Excellent linear response over the range of -100$\mu$T to +100$\mu$T is obtained with 540V/T sensitivity at excitation square wave of 3 $V_{p-p}$ and 360kHz. The very low power consumption of ~8mW was measured. This magnetic sensing element, which measures the lower fields than 50$\mu$T, is very useful for various applications such as: portable navigation systems, military research, medical research, and space research.h.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.151-155
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• 2002

This paper presents a micro fluxgate magnetic sensor in printed circuit board (PCB). The fluxgate sensor consists of five PCB stack layers including one layer magnetic core and four layers of excitation and pick-up coils. The center layer as a magnetic core is made of a micro patterned amorphous magnetic ribbon with extremely high DC permeability of ∼100,000 and the core has a rectangular-ring shape. The amorphous magnetic core is easily saturated due to the low coercive field and closed magnetic path for the excitation field. Four outer layers as an excitation and pick-up coils have a planar solenoid structure. The chip size of the fabricated sensing element is 7.3${\times}$5.7m㎡. Excellent linear response over the range of -100${\mu}$T to +100${\mu}$T is obtained with 540V/T sensitivity at excitation square wave of 3V$\_$P-P/ and 360kHz. The very low power consumption of ∼8mW was measured. This magnetic sensing element which measures the lower fields than 50${\mu}$T, is very useful for various applications such as: portable navigation systems, military research, medical research, and space research.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.6
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• pp.91-98
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• 2004

This paper proposes a PCB plane model for generic SPICE circuit simulators. The proposed model reflects two frequency-dependent losses, namely skin and dielectric losses. After power/ground plane pair is divided into arrays of unit-cells, each unit-cell is modeled using a transmission line and two loss models. The loss model is composed of a resistor for DC loss, series HL ladder circuit for skin loss and series RC ladder circuit for dielectric loss. To verify the validity of the proposed model, it is compared with SPICE ac analysis using frequency-dependent resistors. Also, we show that the estimation results using the proposed model have a good correlation with that of VNA measurement for the typical PCB stack-up structure of general desktop PCs. With the proposed model, not only ac analysis but also transient analysis can be easily done for circuits including various non-linear/linear devices since the model consists of passive elements onl.

• ETRI Journal
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• v.41 no.5
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• pp.670-683
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• 2019

In this paper, we analyzed the signal integrity of a system interconnection module for a proposed high-density server. The proposed server integrates several components into a chassis. Therefore, the proposed server can access multiple computing resources. To support the system interconnection, among the highly integrated computing resources, the interconnection module, which is based on Serial RapidIO, has been newly adopted and supports a bandwidth of 800 Gbps while routing 160 differential signal traces. The module was designed for two different stack-up types on a printed circuit board. Each module was designed into 12- (version 1) and 14-layer (version 2) versions with thicknesses of 1.5T and 1.8T, respectively. Version 1 has a structure with two consecutive high-speed signal-layers in the middle of two power planes, whereas Version 2 has a single high-speed signal placed only in the space between two power planes. To analyze the signal integrity of the module, we probed the S-parameters, eye-diagrams, and crosstalk voltages. The results show that the high-speed signal integrity of Version 2 has a better quality than Version 1, even if the signal trace length is increased.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2007.06a
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• pp.276-280
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• 2007

점차 고성능화 되어가는 Display 제품들을 더욱 저렴하고 일반화하기 위해 제품 공정수를 줄이고 설계 기간을 단축하여야 한다. PCB(Printed Circuit Board) 층수(Stack-up)를 줄이고 회로개발 면에서는 회로를 간략히 하고 부품소자를 최소화하여야 한다. 그리고 기구개발 면에서는 공정을 최소화하고 견고하게 하는 것이 시장 추세이다. 불량 없으면서 초단납기 설계와 대량 생산을 위해 일원화를 추진하고 있다. 곧, 어떤 Customer에게 나가도 A/S 문제가 발생되지 않도록 초기부터 적용하는 최적설계가 필요하다. 본 연구는 Display의 대표라 할 수 있는 PDP(Plasma Display Panel)를 CAE(Computer Aided Engineering)를 이용해 설계함으로써 PDP 회로 최적설계를 하는데 CAE의 활용 사례를 알 수 있다.

• Journal of Sensor Science and Technology
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• v.12 no.2
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• pp.72-78
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• 2003

To observe the effect of excitation coil pitch on the micro fluxgate magnetic sensor, two sensors are fabricated using multi layer board process and the pitch distance of excitation coil are $260\;{\mu}m$ and $520\;{\mu}m$, respectively. The fluxgate sensor consists of five PCB stack layers including one layer of magnetic core and four layers of excitation and pick-up coils. The center layer as magnetic core is made of a Co-based amorphous magnetic ribbon with extremely high DC permeability of ${\sim}100,000$ and has a rectangular-ring shape to minimize the magnetic flux leakage. Four outer layers as excitation and pick-up coils have a planar solenoid structure and are made of copper foil. In case of the fluxgate sensor having the excitation coil pitch of $260\;{\mu}m$, excellent linear response over the range of $-100\;{\mu}T$ to $+100\;{\mu}T$ is obtained with sensitivity of 780 V/T at excitation sine wave of $3V_{p_p}$ and 360 kHz. The chip size of the fabricated sensing element is $7.3\;{\times}\;5.7\;mm^2$. The very low power consumption of ${\sim}8\;mW$ is measured. This magnetic sensor is very useful for various applications such as: portable navigation systems, telematics, VR game and so on.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.19-23
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• 2002

This paper presents a micro fluxgate magnetic sensor in printed circuit board (PCB). In order to observe the effect of the closed magnetic path, the magnetic cores of rectangular-ring and two bars were each fabricated. Each fluxgate sensor consists of five PCB stack layers including one layer magnetic core and four layers of excitation and pick-up coils. The center layer as a magnetic core is made of a Co-based amorphous magnetic ribbon with extremely high DC permeability of ~100,000. Four outer layers as an excitation and pick-up coils have a planar solenoid and are made of copper foil. In case of the fluxgate sensor having the rectangular-ring shaped core, excellent linear response over the range of -100 $\mu$T to ＋ 100 $\mu$T is obtained with 540 V/Tsensitivity at excitation square wave of 3 $V_{p-p}$ and 360 KHz. The chip size of the fabricated sensing element is $7.3 \times 5.7\textrm{mm}^2$. The very low power consumption of ~8 mW was measured. This magnetic sensor is very useful for various applications such as: portable navigation systems, telematics, VR game and so on.n.