• Proceedings of the KWS Conference
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• 2009.11a
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• pp.81-81
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• 2009

최근 휴대폰, 노트북 등과 같은 소형 멀티미디어 기기의 사용이 증가함에 따라 전자 패키징 산업은 경박단소화를 요구하고 있습니다. 더불어 전기적 신호의 손실을 줄이기 위해 전기, 전자산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(Flexible Printed Circuit Board, FPCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(Rigid Printed Circuit Board, RPCB)의 전극간 접합에 많은 관심을 보이고 있습니다. 기존에 연성인쇄회로기판과 경성인쇄회로기판을 접합하는 방식으로는 connector를 이용한 체결법이 사용되고 있지만 완성품의 부피가 커지고 자동화 공정이 힘들며 I/O 개수가 제한적이어서 신호전달에 취약한 단점이 있습니다. 또한, 최근 FPCB를 RPCB에 접합하는데 interconnection으로 이방성 도전 필름(Anisotropic conductive film, ACF) 또는 비전도성 필름(Non-conductive film)이 널리 사용되고 있습니다. 하지만 필름의 가격이 비싸고, 낮은 전기 전도도를 보이며, 신뢰성 특성이 낮다는 단점을 가지고 있습니다. 본 실험에서는 기존의 connector 방식과 접착 필름을 이용한 방식을 대체하기 위하여 솔더를 interlayer로 이용하여 열과 압력으로 접합하는 방법에 대하여 연구하였습니다. 실험에 사용된 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)이고, RPCB와 FPCB의 표면처리는 ENIG로 하였습니다. 접합 온도와 접합 시간에 따라 최적의 접합 조건을 도출하고자 하였고, 접합된 시편을 가지고 신뢰성 테스트를 진행하였습니다. $85^{\circ}C$/85% 고온고습 시험과 고온 방치 시험을 통하여 접합부의 신뢰성을 테스트 하였고, 90도 Peel test로 기계적 접합 강도를 측정하였고, 파괴 단면을 Scanning Electron Microscopy (SEM), Energy-dispersive spectroscopy (EDS), X-ray photoelectron spectroscopy (XPS)로 분석하였습니다.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.95-103
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• 2021

Sn-58Bi-xRu composite solders were prepared by adding Ru nanoparticles to Sn-58Bi, a typical low-temperature solder, and the interfacial reaction and solder joint reliability were analyzed by reacting with Cu/OSP and ENIG surface treated PCB boards. The Cu₆Sn₅ IMC formed by the reaction with Cu/OSP had little change in thickness depending on the Ru content, and ductile fracture occurred inside the solder during the high-speed shear test without any significant change even after 100 hr aging. In reaction with ENIG, the Ni₃Sn₄ IMC thickness tended to decrease as the Ru content increased, and ENIG-specific brittle fracture was found in some specimens. Since Ru element is not found near the interface, it is judged not to be significantly involved in the interfacial reaction, and it is analyzed that it mainly exists together with the Bi phase.

• Journal of Welding and Joining
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• v.25 no.2
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• pp.82-88
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• 2007

Sn-3.0Ag-0.5Cu lead fee solder was generally utilized in electronics assemblies. But it is insufficient to research about activation energy(Q) that is applying to evaluate the solder joint reliability of environmental friendly electronics assemblies. Therefore this study investigated Q values which are needed to IMC formation and growth of Sn-3.0Ag-0.5Cu/Cu and Sn-40pb/Cu solder joints during aging treatment. We bonded Sn-3.0Ag-0.5Cu and Sn-40Pb solders on FR-4 PCB with Cu pad$(t=80{\mu}m)$. After reflow soldering, to observe the IMC formation and growth of the solder joints, test specimens were aged at 70, 150 and $170^{\circ}C$ for 1, 2, 5, 20, 60, 240, 960, 15840, 28800 and 43200 min, respectively. SEM and EDS were utilized to analysis the IMCS. From these results, we measured the total IMC$(Cu_6Sn_5+Cu_3Sn)$ thickness of Sn-3.0Ag-0.5Cu/Cu and Sn-40Pb/Cu interface, and then obtained Q values for the IMC$(Cu_6Sn_5,\;Cu_3Sn)$ growth of the solder joints.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.63-69
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• 2019

Soldering technology has been used in electronic industry for a long time. However, due to solder fatigue characteristics, automotive electronics are searching the semi-permanent interconnection technology such as press-fit method. Press fit interconnection is a joining technology that mechanically inserts a press fit metal terminal into a through hole in a board, and induces a strong bonding by closely contacting the inner surface joining of the through hole by plastic deformation of press-fit terminal. In this paper, the bonding properties of press-fit interconnection are investigated with PCB hole size and surface finishes. In order to compare interconnection reliability between the press fit and soldering, the change in resistance of the press-fit and soldering joints was observed during thermal shock test. After thermal cycling, the failure modes are investigated to reveal the degradation mechanism both press-fit and soldering technology.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.55-61
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• 2010

An impact bending test method was used to evaluate the reliability for the solder joint of lead-free solder ball. In order to standardize the test method, the four point impact bending test was applied under the conditions of various frequencies and amounts of +/-amplitude respectively. Effects on the results were analysed. The optimum condition for impact bending test achieved in this study was the frequency of 10 Hz, and the amplitude of (+12/-1)~(+15/-1). 3 kinds of surface finishes Cu-OSP (Organic Solderability Preservative), ENIG (Electroless Nickel Immersion Gold), and ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) were used. Fracture surface showed that cracks were initiated and fractured along the intermetallic layer in the case of surface finishes of Cu-OSP and ENIG, while in the case of ENEPIG the cracks were initiated and propagated in the solder region.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.57-64
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• 2012

Ball shear test was performed by test variables such as loading speed and annealing time in order to investigate the effect of surface finishes on the bonding strength of Sn-1.2Ag-0.7Cu-0.4In Pb-free solder. The shear strength increased and the ductility decreased with increasing shear speed. With increasing shear speed, the electroless nickel immersion gold (ENIG) finish showed dominant brittle fracture mode, while organic solderability preservative (OSP) finish showed pad open fracture mode. The shear strength and toughness for both surface finishes decreased with increasing annealing time under the high-speed shear test of 500 mm/s. Typically, the thickness of intermetallic compound increased with increasing annealing time, which means that exposure of brittle fracture became much easier. With increasing annealing time, the both ENIG and OSP finishes exhibited the pad open fracture mode. Overall, ENIG finish showed higher shear strength rather than OSP finish due to its superior barrier stability.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.412-412
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• 2008

ENIG(Electroless Nickel Immersion Gold)is a surface treatment method that is used most widely at fine pitch's SMT and BGA packaging process. ENIG has good diffusion barrier of Ni against solder and good wettability due to Au finish. But when the discoloration occurred on the Au finish of ENIG, some key characteristics related to the quality and reliability of PCB such as bondability, solderability and electrical flowing of packaging process could be deteriorated. In this paper, we have performed the water dip test ($88^{\circ}C$ purified water) which accelerates the galvanic corrosion of Ni diffused from the Ni-P layer. That is, the excessive oxidation of the Ni layer could result in non-wetting of the solder because the flux may not be able to remove excessive oxides. Though Au discoloration have been reported to be caused by Ni oxides in many literature, it is still open to verify and discuss The microstructures and chemical compositions have been investigated using FE-SEM, TEM, FIB, EDS and XPS. As a result, authors have found that the Au discoloration in ENIG type is severely caused by the oxidation of the Ni and the mechanism of Au discoloration can be confirmed through the experiment result of water dip test.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.7
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• pp.63-71
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• 2018

A flower support was developed for real flower decoration automation production system using an ultrasonic wave sealer to automatically produce a system. Because a flower support for real flower decoration that was produced manually could not meet the needs of the consumers, this study developed an automated manufacturing system to increase productivity. A flower support for real flower decoration was constructed using a cap consisting of plastic and plate made from non-woven fabric. The guide was designed to transport the cap to the ultrasonic wave sealer and optimal guide was developed from the test according to the material and shape. To produce the entire system, the guides and accessories were weighed and appropriate motors and pulleys were calculated. Control of the automation production system was based on a PCB board, which increased the reliability and security, and a remote controller with manual and automatic modes was prepared. After development, tests of the transfer precision and repetition accuracy revealed an X-axis of 2.7mm, a Y-axis of 1 mm, and a repetition of 0 mm. The productivity was also checked. The automated machine worked 8 hours/day to make 35 supports and 70 Therefore, the automatic system produces 200% more output than manual work

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.23 no.12
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• pp.1045-1055
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• 2013

It is true that the dependency on import is currently high in case of the safety checkup system of domestic airplanes, and it is at the point of time that localization of HUMS for small airplanes is required. In this study, the design factors were selected for the lightweight of HUMS for small airplanes by using Pro-Engineer which is a design tool and Abaqus. 9 models were made through experiment plans with Taguchi method for this, and the each model for weight lightening was selected through vibration analysis and shock analysis while in operation with experiment profile values. After fabricating HUMS, it was verified that as a result of experiment with the same profile values as the analysis, there was similarity between the analyzed values and values of the experiment. As a result of performing weight lightening which is the purpose of the study, electronic performance for small airplanes is assured and a design plan reducing 15 % weight compared to the targeted weight was deduced. Besides, it could be verified that the light weight model satisfied the maximum allowable displacement value of PCB[printed circuit board] and accordingly satisfied electronic properties of HUMS. In this study, the reliability of a product was certified through the result of an experiment on ground. If the reliability of HUMS were verified through a test flight in the future, it is considered that it would make a big contribution to localization of aerospace electronic equipment.

• Korean Journal of Materials Research
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• v.15 no.8
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• pp.528-535
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• 2005

It is inclined to increase that use of hazardous substances such as lead(Pb), mercury (Hg), cadmium(Cd) etc. are prohibited in the electronics according to environmental friendly policies of an advanced nation for protecting environment of earth. As this reasons, many researches for ensuring the reliability were proceeding in Pb free soldering process. n the flux remains on the PCB(printed circuit board) in the soldering process or the electronics exposed to corrosive environment, it becomes the reasons of breakdown or malfunction of the electronics caused by corrosion. Therefore in this studies we researched the polarization and Tafel properties of Sn40Pb and SnCu system solders based on the electrochemical theory. The experimental polarization curves were measured in distilled ionized water and 1 mole $3.5 wt\%$ NaCl electrolyte of $40^{\circ}C$, pH 7.5. Ag/AgCl and graphite were utilized by reference and counter electrodes, respectively. To observe the electrochemical reaction, polarization test was conducted from -250mV to +250mV. From the polarization curves composed of anodic and cathodic curves, we obtained Tafel slop, reversible electrode potential(Ecorr) and exchange current density((cow). In these results, we compared the corrosion rate of SnPb and SnCu solders.