• 벤처창업연구
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• 제8권4호
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• pp.57-66
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• 2013

국내의 PCB산업은 수요업체의 주문생산 구조로 형성이 되어, 고부가가치 기술개발과 정보교류 등의 혁신기반은 대단히 취약한 편이다. 국내에서 생산하는 PCB제품의 소재 대부분을 해외로부터 수입에 의존하고 있어 대외 시장환경 변화에 취약한 편이다. 또한, 산업 전반에 대한 부정적 인식(3D), 낮은 처우(특히 중소기업)로 인해 PCB분야로 전문인력 진입 회피 등으로 인해 고용 여건도 좋지 않은 편이다. 이러한 상황에서 PCB산업이 휴대폰, 태블릿PC 등 일부 수요시장에 완전 종속되어 수요시장 변동시 이에 대한 대응력도 역시 취약한 편이다. 이러한 PCB 산업에 있어서, PCB 산업혁신포럼 운영을 통해 기업간 정보 공유를 실현하고(정보혁신), 중소기업 지원 플랫폼 구축 및 품질향상 지원(기술혁신), 그리고 PCB Open Lab을 활용한 소재-공정-장비 기업간 협업 공정지원(구조혁신) 등을 목표로, 2013년부터 2017년까지 총 사업기간 5년 동안 <표 1>과 같이 정부에서 매년 13억씩, 민간에서 4.34억씩 총 86.7억원의 사업비를 투입하여 PCB 산업기술 기반구축사업을 추진하려 하고 있다. 이에 본 연구에서는 이 사업에 대하여 AHP 분석을 이용하여 사업타당성을 분석하였으며, 그 결과 AHP 종합평점이 0.841로 평가되었으므로, 종합평점이 0.55이상이 되어 이 사업이 타당성이 있는 것으로 판단되었다.

• 한국정밀공학회지
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• 제24권5호
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• pp.89-96
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• 2007

Inkjet printing has become one of the most attractive manufacturing techniques in industry. Especially inkjet printing technology will soon be part of the PCB (Printed Circuit Board) fabrication processes. Traditional printing on PCB includes screen printing and photolithography. These technologies involve high costs, time-consuming procedures and several process steps. However, by inkjet technology manufacturing time and production costs can be reduced, and procedures can be more efficient. PCB manufacturers therefore willingly accept this inkjet technology to the PCB industry, and are quickly shifting from conventional to inkjet printing. To produce the printed circuit board by the inkjet technology, it must be harmonized with conductive nano ink, printing process, system, and inkjet printhead. In this study, micro patterning of conductive line has been investigated using the piezoelectric printhead driven by a bipolar voltage signal is used to dispense 20-40 ${\mu}m$ diameter droplets and silver nano ink which consists of 1 to 50 nm silver particles that are homogeneously suspended in an organic carrier. To fabricate a conductive line used in PCB with high precision, a printed line width was calculated and compared with printing results.

• 산업경영시스템학회지
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• 제16권28호
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• pp.1-8
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• 1993

Electrical or electronic products have been becoming smaller and high integrated recently, with printed circuit boards(PCB's) being the key components for these products. The introduction of new technology of surface mounted devices(SMD) opens new ways towards high integration on the PCB. Many plants in eletronical industry which produce high variety of PCB's to meet the demands of customer orders require flexibility in PCB's production lines. This survey paper describes the related optimization problems and solution methods to the automated surface mount technology(SMT) assembly lines, and provides with the research direction for improving flexibility.

• International Journal of Quality Innovation
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• 제4권1호
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• pp.160-174
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• 2003

This study researched an enterprise resources planning (ERP) implementation project at a printed circuit board (PCB) manufacturer. In depth research was achieved by participating and observing in an implementation project at an actual PCB manufacturer. It is hoped that this study will contribute a valuable reference resource for future PCB manufacturers that wish to select or implement ERP systems. The first step in implementing ERP software is to set a clear target. At the same time, the tasks of each department and the system of cooperation between departments must be clearly defined. In this way, the cycle time of each flow and the accuracy of data will both be improved. In order to ensure smooth implementation of an ERP project, the followings are key factors: (1) an ERP system that suits the PCB industry; (2) effective project management; (3) effective project cost/budget control; (4) project problem management system; (5) comprehensive implementation method and information technology (IT), etc. By keeping to these principals, Company A achieved rapid transactions, and lower total cycle times and inventory levels, and other such benefits that had been predicted.

• 반도체디스플레이기술학회지
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• 제23권2호
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• pp.1-5
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• 2024

In the electronics industry, a lot of research and development is being conducted on electronic component supply, component alignment and insertion, and automation of soldering on the back side of the PCB for automatic PCB assembly. Additionally, as the use of electronic components increases in the automotive component field, there is a growing need to automate the alignment and insertion of components with leads such as transistors, coils, and fuses on PCB. In response to these demands, the types of PCB and parts used have been more various, and as this industrial trend, the quantity and placement of automation equipment that supplies, aligns, inserts, and solders components has become important in PCB manufacturing plants. It is also necessary to reduce the pre-setting time before using each automation equipment. In this study, we propose a method in which a vision system recognizes the type of component and simultaneously corrects alignment errors during the process of aligning and inserting various types of electronic components. The proposed method is effective in manufacturing various types of PCBs by minimizing the amount of automatic equipment inserted after alignment with the component supply device and omitting the preset process depending on the type of component supplied. Also the advantage of the proposed method is that the structure of the existing automatic insertion machine can be easily modified and utilized without major changes.

• 방사선산업학회지
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• 제9권3호
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• pp.153-159
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• 2015

Reliability of printed circuit board (PCB), which is based on high integrated circuit technology, is having been important because of development of electric and self-driving car. In order to answer these demand, automated X-ray inspection (AXI) is best solution for PCB non-destructive test. PCB is consist of plastic, copper, and, lead, which have low to high Z-number materials. By using dual energy X-ray imaging, these materials can be inspected accurately and efficiently. Dual energy X-ray imaging, that have the advantage of separating materials, however, need some solution such as energy separation method and enhancing efficiency because PCB has materials that has wide range of Z-number. In this work, we found out several things by analysis of X-ray energy spectrum. Separating between lead and combination of plastic and copper is only possible with energy range not dose. On the other hand, separating between plastic and copper is only with dose not energy range. Moreover the copper filter of high energy part of dual X-ray imaging and 50 kVp of low energy part of dual X-ray imaging is best for efficiency.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1853-1856
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• 2003

Multi-layer printed circuit board(PCB) is being used widely for the product with relatively complex circuits such as TV, VTR and FAX. With the rapid enlargement of electronic and IT industry, the hole machining technology on multi-layer PCB is increasingly required to improve. Thus, the micro drilling with ultrasonic vibration can be a good method for hole machining. Unlike conventional drilling, ultrasonic vibration applied drilling introduces less wear and fracture of not only tool but also internal surface of workpiece due to little cutting resistance, thus, machinability can be improved. The experiment is conducted through the comparison between the results of conventional drilling and ultrasonic micro drilling as well as among each results by the variation according to not only feed rate of drill but also amplitude and frequency of ultrasonic vibration. The multi-layer PCB consists of 6 layers and ${\Phi}$0.3 diameter drill was used. As a result, it was found that the state of internal surfaces of holes on multiple layer PCBs is improved by the application of ultrasonic vibration.

• 동력기계공학회지
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• 제18권6호
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• pp.159-165
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• 2014

On this work, the importance of industrial ventilation was investigated and examined the theoretical point and problems about general ventilation of factory exposed on high temperature during summer. As a case study, the ventilation planning of the printed circuit board (PCB) etching process for an electronic company was carried out and each of those characteristics were compared by installing actual ventilation systems and measuring the changing state of the working environment in accordance with ventilation method during summer. The purpose of the study is to present an efficient ventilation method for a factory with a closed structure under high temperature environment. In summary, for a factory with a sealed structure such as the target PCB manufacturing factory in this study, the forced supply and exhaust method was the most appropriate ventilation method for maintaining a low.

• 마이크로전자및패키징학회지
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• 제19권3호
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• pp.1-7
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• 2012

Electroplating technology is widely used in semiconductor microelectronic industry. With the development of semiconductor integrated circuit to high density and light-small scale, Extremely high quality and plated uniformity of the deposited metals are needed. Simulation technique can help to obtain better plating results. Although a few plating simulation softwares have been commercialized, plating simulation is not widely prevalent in Korea. In this paper, principle of electroplating and mathematical modeling of plating simulation are discussed. Also introduced are some cases enhancing plating thickness uniformity on leadframe, PCB and wafer by using plating simulation.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 춘계학술대회 논문집
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• pp.57-57
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• 2015

전해동박(Electrodeposited Copper Foil)은 전기도금 공정으로 제조되는 얇은 구리 포일로서, 주로 TV, PC, 스마트폰 등 전자제품의 인쇄회로기판에서 전기신호를 전달하는 회로소재로 사용이 되며, 최근에는 모바일 IT, 전기자동차, 지능형 로봇, 그린 에너지 산업 등에서 필수적으로 적용되는 소재로 이용이 급증하고 있는 핵심소재이다. FPCB/PCB용 전해동박은 최근 휴대폰, PC와 더불어 전 세계적으로 열풍이 불고 있는 스마트폰, 태블릿 등의 최신 전자 모바일기기의 보급이 가속화됨에 따라 해당 제품들의 다기능화, 고집적화가 진행되고 있으며, 5G 이후의 Mobile 기기를 중심으로 하는 차세대 전자기기의 소재 분야의 선점을 위해서 광폭(600 mm 이상) 제품 제조가 가능한 전해 동박으로 다양한 표면처리의 $18{\sim}2{\mu}m$ 급의 얇은 두께를 갖는 경제성이 확보된 고특성 동박이 필요로 되는 상황이다. 이와 더불어 PCB/FPCB에서 요구하는 동박기술의 소개 및 현재 연구 개발 Trend를 소개하고자 한다.