• Journal of Institute of Control, Robotics and Systems
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• v.12 no.3
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• pp.241-247
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• 2006

We propose a character recognition system to extract the component reference names from printed circuit boards (PCBs) automatically. The names are written in horizontal, vertical, reverse-horizontal and reverse-vertical directions. Also various symbols and figures are included in PCBs. To recognize the character and orientation effectively, we divide the recognizer into two stages: character classification stage and orientation classification stage. The character classification stage consists of two sub-recognizers and a verifier. The rotaion-invarint features of input pattern are then used to identify the character independent of orientation. Each recognizer is implemented as a neural network, and the weight values of verifier are obtained by genetic algorithm. In the orientation classification stage, the input pattern is compared with reference patterns to identify the orientation. Experimental results are presented to verify the usefulness of the proposed system.

• Journal of Korean Society for Quality Management
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• v.25 no.1
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• pp.135-141
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• 1997

The Copper-Clad Laminate (CCL) is a main electronic component of specialtype printed circuit boards (PCBs) such as Silver Through Hole PCB. This CCL should have high reliability under the aging test, and usually the test is done at a higher temperature (110-$150^{\circ}C$) than the normal. Then, this test condition of high temperature may cause such quality problems as hole eccentricity and reduction of distance between part holes. After measuring the CCL shrinkage affected by temperature, the correction factor of a press mold was a, pp.ied to solve these problems. The results showed that the tolerance of hole pitch(${\pm}$$100{\mu}m$) was satisfactory and the internal and external failure costs were reduced by 55%.

• Journal of international Conference on Electrical Machines and Systems
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• v.3 no.3
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• pp.248-251
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• 2014

As more vehicles become equipped with advanced electronic control systems, more consideration is needed with regards to automotive safety issues related to the effects of electromagnetic waves. Unwanted electromagnetic waves from the antenna, electricity and other electronic devices cause the performance and safety problem of automotive components. In general, Power Integrity and Signal Integrity analysis have been widely used, but these analyses have stayed PCB level. PCB base analysis is different from radiated emission TEST condition so its results are used just for reference. This paper proposes EMC optimization technology using module level 3-dimensional radiation simulation process closed to fundamental test conditions. If module level EMC analysis, which is proposed in this study, is applied to all automotive electronics systems, unexpected EMC noise will be prevented.

• Journal of the Korean institute of surface engineering
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• v.46 no.4
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• pp.158-161
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• 2013

Recently, the weight reduction and miniaturization of the electronics have placed great emphasis. The miniaturization of PCB (Printed Circuit Board) as main component among the electronic components has also become progressed. The use of acid copper plating process for Via-Filling effectively forms interlayer connection in build-up PCBs with high-density interconnections. However, in the case of copper-via filled in a bath, which is greatly dependent on the effects of additives. This paper discusses effects of Cl ion on the filling of PCB vias with electrodeposited copper based on both electrochemical experiment and practical observation of cross sections of vias.

• Proceedings of the KIPE Conference
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• 2017.07a
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• pp.7-11
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• 2017

This paper describes a design concept of NPC1 power stack for 1500VDC megawatt level solar inverter. This stack uses three latest half-bridge IGBT modules with highest power density and operation junction temperature, which enable realization of power level beyond 1MW without paralleling. Critical design concept on loop inductance is explained. Dynamic characteristics are verified by double-pulse test. Thermal characteristics and output power limits are verified by thermal test. Temperature-sensitive component on PCB as output power constraint is identified. Different PCB repositioning solutions are tested to give the overall output power thermal derating curves, which enable output power of 1.15MW at $T_A=55^{\circ}C$ with $15^{\circ}C$ thermal margin. The power stack characteristic and performance change under different thermal environment is further analyzed.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.2
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• pp.225-230
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• 2009

We propose a template matching method for component inspection of SMD assembly system. To discriminate wrong assembled components, the input image of component is matched with its standard image by template matching algorithm. For a fast inspection system, the calculation time of matching algorithm should be reduced. Since the standard images of all components located in a PCB are stored in computer, it is desirable to reduce the memory size of standard image. We apply the discrete wavelet transformation to reduce the image size as well as the calculation time. Only 7% memory of the BMP image is used to discriminate goodness or badness of components assembly. Comparative results are presented to verify the usefulness of the proposed method.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.167-174
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• 2005

Smaller size and higher integration of electronic components make smaller gap between metal conducting layers in electronic package. Under harsh environmental conditions (high temperature/humidity), electronic component respond to applied voltages by electrochemically ionization of metal and metal filament formation, which lead to short failure and this phenomenon is termed electrochemical migration(ECM). In this work, printed circuit board(PCB) is used for determination of ECM characteristics. Copper leads of PCB are soldered by eutectic solder alloys. Insulation breakdown time is measured at $85^{\circ}C,\;85{\%}RH$. CAF is the main mechanism of ECM at PCB. Pb is more susceptible to CAF rather than Sn, which corresponds well to the corrosion resistance of solder materials in aqueous environment. Polarization tests in chloride or chloride-free solutions fur pure metal and eutectic solder alloys are performed to understand ECM characteristics. Lifetime results show well defined log-normal distribution which resulted in biased voltage factor(n=2) by voltage scaling. Details on migration mechanism and lifetime statistics will be presented and discussed.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.11
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• pp.6863-6869
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• 2014

A SMT machine is used to place electronic components on a PCB precisely. To place it precisely, after a component inspection, it finds an offset value using a vision camera, and places the precise position on the PCB. In general, to inspect the components with a vision camera, the components stop in front of the camera for inspection, then move to the placement position. On the other hand, if they do not stop in front of a camera, the inspection time will be shortened and the productivity would be increased. In this thesis, when inspecting without stopping in front of a camera, the fastest way among various routes is described. For the gantry passing over a vision camera, both the distance and speed of a gantry moving trajectory were studied, and there was approximately 5% speed increment when using the method suggested in this thesis.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.39A no.8
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• pp.481-487
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• 2014

In this paper, we have proposed gigabit serial transceiver based on backplane architecture at the satellite communication digital transponder. The transponder supports the full combinational switching function with broadband multi-channel using programmable device - Xilinx space-grade Virtex-5 FPGA. In order to implement the switching function, GTX transceiver solution inside Virtex-5 FPGA is used. Also hardware implementation is simple because of no additional component. In order to use a GTX transceiver, signal integrity(SI) simulation of PCB design is essential. We investigate the characteristics of the S-parameter, eye diagram, channel jitter of GTX transmission line and conform that GTX Transceiver operates without error. Finally the proposed PCB design will be utilized at satellite communication digital transponder EQM-2(Engineering Qualification Model-2).

• Journal of the Korea Institute of Information and Communication Engineering
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• v.15 no.3
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• pp.521-527
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• 2011

POWER PC series are common to the Central Processing Unit for Military Single Board Computer. Among them, G4 group, which contains the 74xx series supported by Freescale manufacturer is mainly used in the Military applications. We focus on the Interface between memory and controller. PCB stacking method, component routing, impedance matching and harsh environment for Military spec are the main constraints for implementation. Also, we developed memory as a module for the consideration of Military environments. The overall type of SBC should be designed by the form of 6U VME or 3U VME. Therefore this study suggests the electrically optimum Interface matching, Artwork technology based on the signal cross over and PCB stacking method on the harsh environment.