• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.43-55
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• 2003

As the development of If industries and their electronic device manufacturing technology have been accelerated recently, the request for electronic devices with small size, light weight, and high performance has been inducing that electronic package and substrate (PCB) companies have to develop substrates with low cost, high dense I/O, excellent thermal properties and electrical properties. Therefore, world-wide chip makers have been setting their own severe reliability standards and requiring their suppliers to keep specification and to develop green, high frequency and high-performing substrates. Because properties of substrates are dependent mainly on their constituent materials, the application of them showing superior properties is expected to satisfy the customer's requirement. Therefore, substrate companies should ensure the superiority of materials and assure their competitive capability of substrates by analyzing the latest trends of technology and properties of the materials.

• International Journal of Internet, Broadcasting and Communication
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• v.7 no.2
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• pp.161-167
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• 2015

The performance of high power LEDs highly depends on the junction temperature. Operating at high junction temperature causes elevation of the overall thermal resistance which causes degradation of light intensity and lifetime. Thus, appropriate thermal management is critical for LED packaging. The main goal of this research is to improve thermal resistance by optimizing and comparing nano-pore silicon-based thermal substrate to insulated metal substrate and direct bonded copper thermal substrate. The thermal resistance of the packages are evaluated using computation fluid dynamic approach for 1 W single chip LED module.

• Journal of the Semiconductor & Display Technology
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• v.8 no.2
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• pp.15-21
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• 2009

Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.4.1-4.1
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• 2011

Recently, circuit printing technology has been considered as a promising alternative to conventional PCB fabrication, for it can greatly reduce the manufacturing costs. Even though printed circuit has many advantages over typical subtractive technology such as fewer processes, it has some disadvantages. The major problems are low adhesion and poor resolution. Efforts to overcome these problems have been mainly focused on ink developments with a limited success. And surface treatments showed some improvements. Therefore, various plasma treatments and primer coatings on plastic substrates have been tested. Plasma treatments using hydrocarbon gases including methane and propane improved the pattern quality of the inkjet printed circuit, which are further improved upon heating of substrate. On the other hand, there is little effect on the adhesion, which is improved only by a special primer coating. The adhesion of inkjet printed circuit has been increased more than 10 times upon treatment. As for the screen printed circuits, the overall effects are less significant since there is some organic binder in the ink. Nonetheless, the treatment has strong positive effects on pattern quality and adhesion. The adhesion of 1 kgf/cm2, which is comparable with those of the conventional PCB circuits, is possible through primer coating for both screen and inkjet printed circuits. The resulting circuit also showed good thermal, mechanical and electrical properties.

• Korean Journal of Materials Research
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• v.17 no.8
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• pp.402-407
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• 2007

In electronics manufacturing processes, soldering process has generally been used in surface mounting technology. Because of environmental restriction, lead free solders as like a SnAgCu ternary system are being used widely. After soldering process, the formation and growth of intermetalic compounds(IMCs) are formed in the interface between solder and Cu substrate as follows isothermal temperature and time. In this studies, therefore, we investigated the effects of the Cu substrate thickness on the IMC formation and growth of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu solder joints, respectively. The effect of the Cu thickness in PCB Cu pad and pure Cu plate was analyzed as measuring of thickness of each IMC. After solder was soldered on PCB and Cu plate which have different Cu thickness, we measured the IMC thickness in solder joints respectively. Also we compared with the effectiveness of Cu thickness on the IMC growth. From these results, we calculated the activation energy.

• ETRI Journal
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• v.33 no.3
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• pp.335-343
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• 2011

The pad pitch of modern radio frequency integrated circuits is in the order of few tens of micrometers. Connecting a large number of high-speed I/Os to the outside world with good signal fidelity at low cost is an extremely challenging task. To cope with this requirement, we need reflection-free transmission lines from an on-chip pad to on-board SMA connectors. Such a transmission line is very hard to design due to the difference in on-chip and on-board feature size and the requirement for extremely large bandwidth. In this paper, we propose the use of narrow tracks close to chip and wide tracks away from the chip. This narrow-to-wide transition in width results in impedance discontinuity. A step change in substrate thickness is utilized to cancel the effect of the width discontinuity, thus achieving a reflection-free microstrip. To verify the concept, several microstrips were designed on multilayer FR4 PCB without any additional manufacturing steps. The TDR measurements reveal that the impedance variation is less than 3 ${\Omega}$ for a 50 ${\Omega}$ microstrip and S11 better than -9 dB for the frequency range 1 GHz to 6 GHz when the width changes from 165 ${\mu}m$ to 940 ${\mu}m$, and substrate thickness changes from 100 ${\mu}m$ to 500 ${\mu}m$.

• Journal of electromagnetic engineering and science
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• v.10 no.3
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• pp.179-182
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• 2010

This paper proposed a novel compact bandpass filter with folded half mode substrate integrated waveguide (FHMSIW) cavities using two-layer printed circuit board(PCB) process. The area of the FHMSIW filter is reduced by nearly 50 % and 75 % compared with half mode substrate integrated waveguide(HMSIW) filter and substrate integrated waveguide(SIW) filter, respectively. A four-pole Chebyshev FHMSIW bandpass filter at C-band has been designed, simulated and fabricated. Measured results are presented and found to agree with the full-wave simulated results by using Ansoft HFSS. The filter shows good performance and compact size.

• Design & Manufacturing
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• v.15 no.4
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• pp.65-71
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• 2021

In the early days of laser invention, it was simply used as a measuring tool, but as lasers became more common, they became an indispensable processing tool in the industry. Short-wavelength lasers are used to make patterns on wafers used in semiconductors depending on the wavelength, such as CO2 laser, YAG laser, green laser, and UV laser. At first, the hole of the PCB board mainly used for electronic parts was not thin and the hole size was large, so a mechanical drill was used. However, in order to realize product miniaturization and high integration, small hole processing lasers have become essential, and pattern exposure for small hole sizes has become essential. This paper intends to analyze the characteristics through patterns by exposing the PCB substrate through DMD and polygon scanner, which are different optical systems. Since the optical systems are different, the size of the patterns was made the same, and exposure was performed under the optimal conditions for each system. Pattern characteristics were analyzed through a 3D profiler. As a result of the analysis, there was no significant difference in line width between the two systems. However, it was confirmed that dmd had better pattern precision and polygon scanner had better productivity.

• Journal of Microbiology
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• v.44 no.1
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• pp.23-28
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• 2006

We investigated the effects of halogenated aromatic compounds (HACs) including naturally occurring ones (L-thyroxine, 3-chloro-L-tyrosine, 5-chloroindole, 2-chlorophenol, 4-chlorophenol and chlorobenzene) on polychlorinated biphenyl (PCB) dechlorination in sediment cultures. A PCB-dechlorinating enrichment culture of sediment microorganisms from the St. Lawrence River was used as an initial inoculum. When the culture was inoculated into Aroclor 1248 sediments amended with each of the six HACs, the extent of dechlorination was not enhanced by amendment with HACs. The dechlorination patterns in the HAC-amended sediments were nearly identical to that of the HAC-free sediments except the 3-chloro-L-tyrosine-amended ones where no dechlorination activity was observed. When these sediment cultures were transferred into fresh sediments with the same HACs, the dechlorination specificities remained the same as those of the initial inoculations. Thus, in the present study, the substrate range of the highly selected enrichment culture could not be broadened by the HACs. It appears that HACs affect PCB dechlorination mainly through population selection rather than enzyme induction of single population.

• Journal of Microbiology
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• v.41 no.4
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• pp.349-352
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• 2003

Recent studies have shown that some of the PCB (polychlorinated biphenyl)-degraders are able to effectively degrade PCB in the presence of monoterpenes, which act as inducers for the degradation pathway. Rhodococcus sp. T104, an effective PCB degrader, has been shown to induce the degradation pathway by utilizing limonenes, cymenes, carvones, and pinenes as sole carbon sources which can be found in the natural environment. Moreover, the strain T104 proved to possess three separate oxidation pathways of limonene, biphenyl, and phenol. Of these three, the limonene can also induce the biphenyl degradation pathway. In this work, we report the presence of three distinct genes for aromatic oxygenase, which are putatively involved in the degradation of aromatic substrates including biphenyl, limonene, and phenol, through PCR amplification and denaturing gradient gel electrophoresis (DGGE). The genes were differentially expressed and well induced by limonene, cymene, and plant extract A compared to biphenyl and/or glucose. This indicates that substrate specificity must be taken into account when biodegradation of the target compounds are facilitated by the plant natural substrates.