• Journal of the Microelectronics and Packaging Society
• /
• v.27 no.1
• /
• pp.67-73
• /
• 2020

In this paper, we used FEM technique to perform warpage and von Mises stress analysis on PCB according to the cavity structures of embedded PCB for FCCSP and the types of prepreg material. One-half substrate model and static analysis are applied to the FEM. According to the analysis results of the warpage, as the gap between the cavity and the chip increased, warpage increased and warpage increased when prepreg material with higher modularity and thermal expansion coefficient was applied. The analysis results of the von Mises stress show that the effect of the gap between the cavity and the chip varies depending on prepreg material. In other words, when material whose coefficient of thermal expansion is significantly higher than that of core material, the stress increased as the gap between the cavity and the chip increased. When the prepreg with the coefficient of thermal expansion lower than the core material is applied, the result of stress is opposite. These results indicate that from a reliability perspective, there is a correlation between the structure of the cavity where embedded chips are loaded and prepreg material.

• Journal of Microbiology and Biotechnology
• /
• v.9 no.6
• /
• pp.804-810
• /
• 1999

There is a possibility that carvone, a monoterpene from spearmint (Mentha spicata), could induce the bph degradative pathway and genes in Alcaligenes eutrophus H850, which is a known Gram-negative PCB degrader with a broad substrate specificity that was thoroughly investigated with Arthrobacter sp. BIB, a Gram-positive PCB degrader. The strains BIB and H850 were unable to utilize and grow on the plant terpene [(R)-(-)-carvone] (50ppm) to be recognized as a sole carbon source. Nevertheless, the carvone did induce 2,3-dihydroxybiphenyl 1,2-dioxygenase (encoded by bphC) in the strain B lB, as observed by a resting cell assay that monitors accumulation of a yellow meta ring fission product from 4,4'-dichlorobiphenyl (DCBp). The monoterpene, however, did not appear to induce the meta cleavage pathway in the strain H850. Instead, an assumption was made that the strain might be using an alternative pathway, probably the ortho-cleavage pathway. A reverse transcription (RT)-PCR system, utilizing primers designed from a conserved region of the bphC gene of Arthrobacter sp. M5, was employed to verify the occurrence of the alternative pathway. A successful amplification (182bp) of mRNA transcribed from the N-terminal region of the bphC gene was accomplished in H850 cells induced by carvone (50ppm) as well as in biphenyl-growth cells. It is, therefore, likely that H850 possesses a specific PCB degradation pathway and hence a different substrate specificity compared with B1B. This study will contribute to an elucidation of the dynamic aspects of PCB bioremediation in terms of roles played by PCB degraders and plant terpenes as natural inducer substrates that are ubiquitous and environmentally compatible.

• The Korean Journal of Mycology
• /
• v.30 no.2
• /
• pp.99-103
• /
• 2002

The suitable sterilization conditions in pot cultivation of varieties of Chunchunutari-2-ho and Suhannutari-1-ho Pleurotus ostreatus were investigated. The substrate formulations for the cultivation consisted of 40% poplar sawdust, 40% waste cotton and 20% beet pulp (PWB), and 40% poplar sawdust, 40% cotton seed hull and 20% beet pulp (PCB). The increase in the sterilization temperature caused decrease in the pH of the substrate. The moisture content of PWB substrate increased by 1.8%, but that of PCB substrate decreased by 4.1 % after low temperature sterilization ($12hr\;at\;60^{\circ}C$). However, a little change in the sterilization at higher temperature ($6hr\;at\;100^{\circ}C\;and\;90min\;at\;121^{\circ}C$) did not alter the moisture content of both substrate appreciably. The duration of mycelial growth was longest and its density was lowest in low temperature sterilization ($12hr\;at\;60^{\circ}C$). The high pressure sterilization ($90min\;at\;121^{\circ}C$) of PCB substrate produced high yield (236.6 g/pot) and the highest biological efficiency (96.6%) for Chunchunutari-2-ho. On the contrary the high temperatures sterilization ($6hr\;at\;100^{\circ}C$) of PCB substrate resulted in the yield of 259.1 g/pot with the biological efficiency 94.9% for Suhannutari-2-ho.

• Journal of Electrical Engineering and Technology
• /
• v.7 no.4
• /
• pp.582-588
• /
• 2012

In this paper, a highly miniaturized and performed UWB bandpass filter has been newly designed and implemented by embedding all the passive elements into a multi-layered PCB substrate with high dielectric $SrTiO_3$ composite film for 3.1 - 4.75 GHz compact UWB system applications. The high dielectric composite film was utilized to increase the capacitance densities and quality factors of capacitors embedded into the PCB. In order to reduce the size of the filter and avoid parasitic EM coupling between the embedded filter circuit elements, it was designed by using a $3^{rd}$ order Chebyshev circuit topology and a capacitive coupled transformation technology. Independent transmission zeros were also applied for improving the attenuation of the filter at the desired stopbands. The measured insertion and return losses in the passband were better than 1.68 and 12 dB, with a minimum value of 0.78 dB. The transmission zeros of the measured response were occurred at 2.2 and 5.15 GHz resulting in excellent suppressions of 31 and 20 dB at WLAN bands of 2.4 and 5.15 GHz, respectively. The size of the fabricated bandpass filter was $2.9{\times}2.8{\times}0.55(H)mm^3$.

• Journal of Microbiology
• /
• v.40 no.4
• /
• pp.340-343
• /
• 2002

A PCB degrader, Ralstonia eutropha H850 was shown to induce bphC gene encoding 2,3-dihydroxy-biphenyl-1,2-dioxygenase in a carvone-amended pure culture in our previous study (Park et al.,1999). The present study was carried out to examine how plant terpenes, as natural substrates, would cause an expression of a PCB degradative gene in soil that was amended with terpenes. The population of Ralstonia eutropha H850 was maintained at least around 10$\^$8/ (CFU/g fresh soil) in the soil amended with carvone or limonene in the presence of succinate as a growth substrate at 50 th day. The gene expression was monitored by RT-PCR using total RNA directly extracted from each soil and bphC gene primers. The bphC gene expression of the seeded strain H850 was observed in the soil amended with biphenyl (4 days) but not with succinate, carvone and limonene. These results indicate that terpenes widely distributed in nature could be a potential inducing substrate for effective PCB biodegration in the soil but their bioavailability and specific induction behavior should be taken into account before PCB bioremediation implementation.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.41 no.12
• /
• pp.1-6
• /
• 2004

In this study, heat and discharge treatments are arbitrary simulated for finding out the initiations and processes of surface degradation on the surface of polymer for using as a PCB substrate. Thermal-treatment changed the surface to the hydrophobic one with the increase of contact angle and surface potential decay, respectively. The XPS spectrum showed that the increased hydrophobicity in thermal treatment was originated from the continuous decrease of side-chains caused by secessions of oxygen groups and the increase of unsaturated double bond in carbon chains. Also, thermal-treatment caused the discoloration on the point of treated surface. These phenomena were attributed to the generation of ether group. In the chemical change by discharge treatment, a lot of side-chains occurred on the treated surface, and so the hydrophilicity increased as time elapsed.

• Proceedings of the IEEK Conference
• /
• 2004.06a
• /
• pp.269-272
• /
• 2004

Printed circuit boards (PCB) replaced conventional wiring in most electronic equipment I, reducing the size and weight of electronic equipment while improving reliability, uniformity, precision and performance. PCB is used in all kinds of electronic products because they can be mass-produced with very high circuit density and also enable easier trouble-shooting. This paper presents the analyses of the patent information of Build-up PCB which is seen as the most promising solution, as its substrate supports multi-level packaging, thinner board profiles and smaller pitches.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2006.02a
• /
• pp.1-14
• /
• 2006

[ $\blacklozenge$ ] PCB에 있어서 Embedded passive 는chip을 직접 내장하는 방법과 특별한 특성을 갖는 재료 및 공법을 사용하여 chip 응 대치하는 방법이 있다. $\blacklozenge$ Embedded passive PCB가 적용될 수 있는 유력한 적용 분야는 소형화가가 요구되는 분야와 고속 특성이 요구되는 분야를 들 수 있고, 따라서, Module, SOP/SIP, Package substrate 등이 우선적으로 적용될 수 있는 분야다. $\blacklozenge$ Embedded capacitor를 적용한 경우, 일반적인 chip capacitor를 적용한 경우보다 더 좋은 전기적인 특성(SRF, Q)을 얻을 수 있으며, solder joint 등의 영향을 포함하면 더욱 좋은 특성이 얻어질 수 있다. $\blacklozenge$ Embedded passive 의 상용화를 위해서, 공차를 관리하는 방법의 개발과 공차에 대한 합리적인 규격을 설정하는 것이 우선 과제이다. $\blacklozenge$ Embedded resistor 의 경우, Laser trim을 적용하여 ${\pm}\;5\%$ 또는 그 이하의 공차를 실현할 수 있고, $30\;K\Omega/sq$. 의 고저항의 적용까지 가능하다. $\blacklozenge$ 고속 신호에서의 noise 감소, module, SIP/SOP 의 소형화를 실현하는데 Embedded passive(혹은 active)PCB 가 기여 할 수 있을 것이고, 이를 위하여 Set 업체, PCB 업체, 재료 업체간의 지속적인 협조가 필요할 것이다.

• Journal of the Microelectronics and Packaging Society
• /
• v.9 no.3
• /
• pp.7-12
• /
• 2002

In the measurement of the RF properties, the LTCC substrate must be considered as a system including various conductor patterning processes. In this paper, the LTCC substrate system is compared with a conventional PCB(Printed Circuit Board) substrate such as FR-4, Duroid and Teflon, etc. The microstrip resonator method is employed for the measurement of the RF properties in the range of DC to 20 GHz. Experimental results show that the ring resonator method is suitable for system loss measurement, and the series gap resonator method for dielectric constant measurement. The process of conductor patterning and its effect on the system loss were also studied.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.60 no.3
• /
• pp.594-599
• /
• 2011

A SAW strain sensor based on Shear Horizontal wave with an 92 MHz central frequency was developed. It consists of SAW sensor, PCB substrate and bonding material (Loctite 401). External force applied to PCB substrate bonded to a piezoelectric substrate induces strain at the substrate surface, which causes changes in the elastic constant and density of the substrate and hence the propagation velocity of the SAW. The change in the velocity of the SAW result in a frequency shift of the sensor and by measuring a frequency shift, we can extract the strain induced by the external force. The $41^{\circ}$ YX $LiNbO_3$ was used because it has a Leaky shear horizontal(SH) wave propagation mode and a high electromechanical coupling coefficient ($K^2$=17.2%). And to compare with Rayleigh wave mode, $128^{\circ}$ YX $LiNbO_3$ was used. And to make a stable and low insert loss, Split IDT structure was used. The obtained sensitivity and linearity of the SAW strain sensor in the case of Split IDT were measured to be 17.2 kHz / % and 0.99, respectively.