Warpage Characteristics Analysis for Top Packages of Thin Package-on-Packages with Progress of Their Process Steps (공정 단계에 따른 박형 Package-on-Package 상부 패키지의 Warpage 특성 분석)
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- Journal of the Microelectronics and Packaging Society
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- v.21 no.2
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- pp.65-70
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- 2014