• Journal of Multimedia Information System
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• 제8권4호
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• pp.211-220
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• 2021

The process of inspecting SMDs on the PCB boards improves the product quality, performance and reduces frequent issues in this field. However, undesirable scenarios such as assembly failure and device breakdown can occur sometime during the assembly process and result in costly losses and time-consuming. The detection of these components with a model based on deep learning may be effective to reduce some errors during the inspection in the manufacturing process. In this paper, YOLO models were used due to their high speed and good accuracy in classification and target detection. A SMD detection and classification method using YOLO networks based on robust data preprocessing and augmentation techniques to deal with various types of variation such as illumination and geometric changes is proposed. For 9 different components of data provided from a PCB manufacturer company, the experiment results show that YOLOv4 is better with fast detection and classification than YOLOv3.

• 제어로봇시스템학회논문지
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• 제5권3호
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• pp.353-362
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• 1999

This paper presents a shape reconstruction method for automatic inspection of the solder joints on PCBs using X-ray. Shape reconstruction from X-ray radiographic image has been very important since X-ray equipment was used for improving the reliability of inspection result. For this purpose there have been lots of previous works using tomography, which reconstructs the correct shape, laminography or tomosynthesis, which are very fast algorithm. Latter two methods show outstanding performance in cross-sectional image reconstruction of lead type component, but they are also known to show some fatal limitations to some kinds of components such as BGA, because of shadow effect. Although conventional tomography does not have any shadow effect, the shape of PCB prohibits it from being applied to shape reconstruction of solder joints on PCB. This paper shows that tomography using Iterative Reconstruction Technique(IRT) can be applied to this difficult problem without any limitations. This makes conventional radiographic instrument used for shape reconstruction without shadow effect. This means that the new method makes cost down and shadow-free shape reconstruction. To verify the effectiveness of IRT, we develop three dimensional model of BGA solder ball, make projection model to obtain X-ray projection data. and perform a simulation study of shape reconstruction. To compare the performance of IRT with that of conventional laminography or tomosynthesis, reconstruction data are reorganized and error analysis between the original model are also performed.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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• pp.302-302
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• 2000

This paper presents the measurement and correction of PCB alignment errors for PCB-manufacturing machines. The conventional PCB-manufacturing machine doesn't have enough accuracy to accommodate the demand for high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because of alignment errors of PCB loaded to the PCB-manufacturing machine. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors whit high-accuracy. An automatic optical inspection part measures the PCB alignment error using two cameras, and the high-accuracy 3-axis stage makes correct of these error. The operating system is run in the environment of Window 98 (or NT). Finally we implemented this system to PCB screen printer and PCB exposure system.

• 한국산학기술학회논문지
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• 제15권8호
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• pp.5269-5279
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• 2014

SMT에 의한 PCB 조립에서 발생하는 가장 큰 불량의 원인은 솔더의 도포이다. 기존의 솔더 도포의 검사 방법은 신뢰도가 낮고 검사 속도가 느리며 가격이 높다. 본 논문에서는 2차원 영상을 추가로 획득하지 않고, 3차원 형상정보에서 PCB 위의 솔더영역을 검출하고 높이를 계산하는 방법을 제안한다. 솔더영역은 3차원 형상정보에서 측정점과 PCB 전체의 위상평균의 상대적 위상에 의하여 추출한다. 또 솔더영역의 높이를 신뢰도 높게 측정하기 위하여, 솔더영역의 높이는 반복능과 신뢰도를 적용한 측정점들의 위상평균으로 계산된다. 제안한 방법에 대한 측정실험 결과 검사시간에서 17.5%, 높이계산에서 29%의 반복능 향상을 보였으며, SPI장비 가격 인하 및 검사시간 단축 효과가 있다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1996년도 한국자동제어학술회의논문집(국내학술편); 포항공과대학교, 포항; 24-26 Oct. 1996
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• pp.605-608
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• 1996

The aim of this thesis is to develop a SMT-components placement inspection system equipped with a visual sensor. The visual sensor, which consists of a camera and 2-layer LED illuminator, developed to inspect the component placement state such as missing, shift, flipping, polarity and tomb-stone. on PCB in the reflow-process. In practical applications, however, it is too hard to classify component from images mixed pad on PCB, cream solder paste and component. To overcome the problem, this thesis proposes the 2-layer illumination method and the heuristic image processing algorithms according to inspection type. To show the effectiveness of the proposed approach, a series of experiments on the inspection were conducted. The results show that the proposed method is robust to visual noise and variations in component conditions.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.691-692
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• 2008

• 반도체디스플레이기술학회지
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• 제12권1호
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• pp.1-7
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• 2013

Grey-level statistical models have been widely used in many applications for object location and identification. However, conventional models yield some problems in model refinement when training images are not properly aligned, and have difficulties for real-time recognition of arbitrarily rotated models. This paper presents improved grey-level statistical models that align training images using image or feature matching to overcome problems in model refinement of conventional models, and that enable real-time recognition of arbitrarily rotated objects using efficient hierarchical search methods. Edges or features extracted from a mean training image are used for accurate alignment of models in the search image. On the aligned position and orientation, fitness measure based on grey-level statistical models is computed for object recognition. It is demonstrated in various experiments in PCB inspection that proposed methods are superior to conventional methods in recognition accuracy and speed.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1996년도 한국자동제어학술회의논문집(국내학술편); 포항공과대학교, 포항; 24-26 Oct. 1996
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• pp.264-267
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• 1996

This paper is aimed to develop a very reliable method for automatic inspection of the solder joints on PCBS. There have been lots of previous works using vision technologies, but they can not be used for inspecting BGA, FCA or other newly used devices. Thus we adopt X-ray technologies for solder joint inspection. We put our attention on reconstructing the 3D shapes of solder joints since it gives us the most detailed information on quality of solder joints. Laminography principle is used to reject the interferences from neighboring parts or leads. To verify the effectiveness of laminography, a simulation study is performed in the case of a solder joints on double sided PCB using.

• 한국정밀공학회지
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• 제20권6호
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• pp.88-95
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• 2003

This paper presents the measurement and correction method of PCB alignment errors for PCB screen printer. Electronic equipment is getting smaller and yet must satisfy high performance standard. Therefore, there is a great demand for PCB with high density. However conventional PCB screen printer doesn't have enough accuracy to accommodate the demand fur high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because the alignment errors of PCB occur when it is loaded to the screen printer. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors with high-accuracy. An automatic optical inspection part measures the PCB alignment errors using machine vision, and the high-accuracy 3-axis stage makes correction for these errors. This system used two CCD cameras to get images of two fiducial marks of PCB. The geometrical relationship between PCB, cameras, and xy$\theta$ stage is derived, and analytical equations for alignment errors are also obtained. The unknown parameters including camera declining angles and etc. can be obtained by initialization process. Finally, the proposed algorithm is verified by experiments by using test bench.

• 한국정밀공학회지
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• 제20권6호
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• pp.96-104
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• 2003

This paper presents the measurement and correction method of PCB alignment errors for PCB screen printer. Electronic equipment is getting smaller and yet must satisfy high performance standard. Therefore, there is a great demand for PCB with high density. However conventional PCB screen printer doesn't have enough accuracy to accommodate the demand for high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because the alignment errors of PCB occur when it is loaded to the screen printer. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors with high-accuracy. An automatic optical inspection part measures the PCB alignment errors using machine vision, and the high-accuracy 3-axis stage makes correction for these errors. This system used two CCD cameras to get images of two fiducial marks of PCB. The centers of fiducial marks are obtained by using moment, gradient method. The first method is calculating the centroid by using first moment of blob, and the latter method is calculating the center of the circle whose equation is obtained by curve-fitting the boundaries of fiducial mark. The operating system used to implement the whole set-up is carried in Window 98 (or NT) environment. Finally we implemented this system to PCB screen printer.