• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.113-117
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• 2003

The digital systems include the noise in power supply, ground and packaging due to a simultaneous switching of signal, signal reflections and distortions on single and multiple transmission lines. The requirement for the controlled impedance on a PCB can be both a critical success factor and a design challenge. So, the invented tool simulates the tracks controlled impedance with the test coupon. It can saves the design time and supports the economical PCB design.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.296-296
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• 2000

This paper describes the features of a transmission line and a wiring, and a design rule based on a demanded condition for a wiring. Like as the simulation of a circuit, by tracking the wiring path among parts that are disposed on PCB, we analyze the feature of the corresponding wiring using the design formula and rule. We implement a signal integrity simulator, which is capable of electrical and electronic simulation for the feature of a wiring signal and the corresponding signal, and the results are demonstrated.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.3
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• pp.732-737
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• 2016

Using the pyrolyzed carbon black (PCB) from waste tires, the performance of 13 mm dense-graded hot mix asphalt was evaluated. The Marshall mix design was carried out and the measured optimal asphalt content was 5.8%. The impact resonant test was conducted to obtain the elastic modulus and damping ratio of the hot mix asphalt. The elastic modulus of HMA increased with increasing amount of PCB. On the other hand, there was no significant change in the damping ratio. The Marshall mix design, indirect tensile test, permanent deformation test, and program analysis were carried out. The strength ratio of the PCB modified asphalt mixtures was within 10%. More 10% of PCB was not good for the permanent deformation of hot mix asphalt. From the pavement design program, the use of 5% PCB in hot mix asphalt showed a decrease in the top-down crack, bottom-up crack, and permanent deformation. Judging from the limited test and analysis, the use of 5% PCB is good for enhancing the pavement performance.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.6
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• pp.39-44
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• 2011

This purpose of this study is to propose the characteristics analysis of the PCB pattern designed two modes for the output voltage value on the PMIC through converting the limited voltage value inputted from a battery. The PCB design technology has been undergoing difficulty in getting the related technology in a domestic market because of increasing EMI/EMC, Cross-talk, Impedance. And it requires to have the appropriate clearance between the patterns and the technology of PCB pattern width with a amperage according to various uses. The study carried out the characteristics analysis of the PCB pattern designed from a direct output method without a capacitor[mode1], to an output method through a capacitor[mode2] for PMIC output voltage value. Besides, we calculated the pattern width with a amperage using the equation suggested by IPC-2221, presenting the right way of the layout design to analyze the trouble with the test. Therefore, this study is expected to contribute not only to applying the PMIC design for the mobile panel power supply, but also helping the design and application technology in various areas such as car control, camera, note-book, computer, PDA, etc.

• Korean Journal of Computational Design and Engineering
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• v.9 no.4
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• pp.416-424
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• 2004

In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.7
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• pp.753-759
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• 2014

This paper introduces the reduction design technique of the resonance phenomenon of the inner PCB based on power integrity from the analysis about the inner power supply line generating RLC resonance. With the technique, the resonant frequency resulted from the structural characteristics of the PCB can be analyzed and allows to predict and the capacitor for resonance phenomenon reduction can be decided as a decoupling capacitor. From the simulation result, it was confirmed that the PCB's resonance phenomenon reduction design technique should have the reduction effect in the inner motherboard of the industrial controller. This research will be contributed to the improvement of the safety of a PDN (Power Delivery Network) structure in the layout design technique of the PCB.

• Proceedings of the KIEE Conference
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• 2004.11c
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• pp.577-579
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• 2004

Digital hearing aids enclose $6{\sim}8$ tiny components. Those electromechanical components are individually wired by soldering which is a manual labor and sometimes causes components' damage by heating. This paper suggests a PCB design for overcome these problems. Several PCBs are designed and manufactured and circuited to produce ITE(In The Ear) type hearing aids which are inserted in the ear canal. The most optimal size of the PCB design for the ITE hearing aid is presented in this paper.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1012-1015
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• 2004

Digital hearing aids enclose $6{\sim}8$ tiny components. Those electromechanical components are individually wired by soldering which is a manual labor and sometimes causes components' damage by heating. This paper suggests a PCB design for overcome these problems. Several PCBs are designed and manufactured and circuited to produce ITE(In-the-Ear) type hearing aids which are inserted in the ear canal. The most optimal size of the PCB design for the ITE hearing aid is presented in this paper.

• Journal of the Korea Computer Industry Society
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• v.2 no.12
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• pp.1533-1540
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• 2001

In this paper, we described extraction method of electrical parameters and modeling method of PCB nets on PCB design process. To analyze electrical characteristics of real PCB structure, we selected a cache memory system as an experimental board and designed 6 layer PCB substrate. For extraction of the electrical parameters, we divided circuit elements into the components of conductor types which are wires, via holes, BGA balls etc. and combined the calculated value by real net structure to modeling the PCB nets. We analyzed the electrical characteristics of the PCB nets with the simulation tools of SPICE and XNS. The simulation analysis has shown that the maximum signal delay was 2.6ns and the maximum crosstalk noise was 281 mV and we found that the designed substrate was adequate to system specification.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.209-213
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• 2008

In this work, we have proposed a method for calculating the residual stress developed during the PCB thermo-compression bonding precess. Residual stress is the most important factor that causes PCB warpage in accordance with the pattern design. In this work, a single-layed double-sided PCB, which is comprised of the dielectric (FR-4) substrate in the middle and copper cladding on the both top and bottom sides, is considered. A reference temperature, where all stress is free, is calculated by comparing the calculated and measured warapge of a PCB of which copper cladding of the top side is removed. Then, the reesidual stress values is calculated for the double-sided PCB.