• Title/Summary/Keyword: PCB Channel

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Numerical Study on the Three-Dimensional Natural Convection Cooling of Periodically Fully Developed PCB Channel (주기적으로 완전발달된 PCB 채널의 3차원 층류 자연대류 냉각에 관한 수치적 연구)

  • 이관수;백창인;김우승
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.18 no.10
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    • pp.2751-2761
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    • 1994
  • A numerical investigation on the three-dimensional laminar natural convection heat transfer in the periodically fully developed PCB channel has been performed. When heat generating blocks mounted on the adiabatic wall make a channel with their facing shrouding wall, the flow inside the channel becomes periodically fully developed. A single module in the periodically fully developed region is chosen for computational domain in order to save computer storage and computational time. The periodic boundary condition is applied in the anlaysis. The effects of the parameters such as the Rayleigh number, the number of the modules, and the height of channel are examined to obtain the optimum condition for the enhancement of the cooling effectiveness. The result shows that the cooling effect is improved with increasing Rayleigh number and channel height, and decreasing the number of the module. The result also indicates that increasing the height of the channel and number of the module is recommended for a limited space.

Thermal optimization of the chip arrangement in the PCB channel using genetic algorithm (제네틱 알고리듬을 이용한 PCB 채널 내 칩배열의 열적 최적화)

  • Baek, Chang-In;Lee, Gwan-Su;Kim, U-Seung
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.21 no.3
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    • pp.405-413
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    • 1997
  • A thermal optimization of the chip arrangement in the PCB channel oriented vertically and cooled by natural convection has been studied. The objective of this study is to find the chip arrangement that minimizes the maximum temperature of the entire PCB channel. SIMPLER algorithm is employed in the analysis, and the genetic algorithm is used for the optimization. The results show that the chip with a maximum volumetric heat generation rate has to be located at the bottom of the channel, and chips with relatively high heat generation rates should not be close to each other, and small chip should not be located between the large chips.

A Numerical Study on the Effect of PCB Structure Variation on the Electronic Equipment Cooling (PCB 구조변화가 전자장비 냉각에 미치는 영향에 관한 수치적 연구)

  • ;;Park, Kyoung-Woo
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.19 no.12
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    • pp.3329-3343
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    • 1995
  • The interaction of mixed convection and surface radiation in a printed circuit board(PCB) is investigated numerically. The electronic equipment is modeled by a two-dimensional channel with three hot blocks. In order to calculate the turbulent flow characteristics, the low Reynolds number k-.epsilon. model which is proposed by Launder and Sharma is applied. The S-4 approximation is used to solve the radiative transfer equation. The effects of the Reynolds number and geometric configuration variation of PCB on the flow and heat transfer characteristics are analyzed. As the results of this study, it is found that the thermal boundary layer occured at adiabatic wall in case with thermal radiation included, and the effect of radiation is also found to be insignificant for high Reynolds numbers. It is found, as well, that the heat transfer increases as the Reynolds number and block space increase and the channel height decreases and the heat transfer of vertical channel is greater than that of horizontal channel.

The stable design of radiant heat inside PCB circuit board device (PCB회로 보드장치내의 안정적 방열설계를 위한 연구)

  • Won, Jong-Wun;Lee, Jong-Hwi
    • Journal of the Korea Safety Management & Science
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    • v.15 no.2
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    • pp.129-134
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    • 2013
  • In this study, the heat flow analysis compatible commercial code CFX 11 was used to develop the structure inside PCB circuit board devices, which could stable radiant heat as well as the cooling device within it. In case of modifying the arrangement of electronic parts on the PCB inside the multi channel temperature measurement board devices, radiant heat effects did not show a rising tendency, whereas the overall temperature went down in case of installing the vents in the outer case of PCB circuit board devices. In terms of installation location, it was the most appropriate to install it on the electronic parts with no heat. Besides, in case of mounting the fan as a cooling device by considering various user environments for multi channel temperature measurement board devices, the radiant heat effects were shown higher than in case of installing the vents, and the middle sections were the most appropriate to its installation location. In case of changing the wind quantity of the fan from its selected installation location, the best radiant heat effects were shown at high speed as expected.

Glucuronidation of Hydroxylated Polychlorinated Biphenyl by Channel Catfish Liver (챠넬메기 간에서 Hydroxylated Polychlorinated Biphenyl의 Glucuronidation)

  • Shin, Hea-Soon
    • Environmental Analysis Health and Toxicology
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    • v.23 no.3
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    • pp.195-200
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    • 2008
  • Hydroxylated polychlorinated biphenyl (OH-PCBs)는 PCB의 CYP-dependent oxidation의 대사물로서 잠재적 독성이 강하고 지질친화성을 가지며 생물군에 지속적인 축적성을 나타낸다. OH-PCBs의 해독화 효능을 조사하기 위하여 channel catfish 간에서 glucuronidation을 통한 해독작용 가능성을 평가하고 biphenyl 구조에 다양한 염소치환의 구조적 차이점에 따른 영향을 비교 분석하여 보았다. Kinetic parameters에서 $K_m$$V_{max}$$192{\sim}871{\mu}M$, $869{\sim}1774$ pmo1/min/mg으로써 4'-OH-PCB35와 4'-OH-PCB69이 가장 높은 속도의 glucuronidation을 나타냈으며, 구조적 차이점에서 phenolic group에 한 개의 염소치환이 존재할 경우보다 두 개의 염소치환이 존재할 경우에 OH-PCBs(p<0.001)의 glucuronidation에 대한 $V_{max}$를 현저하게 낮추는 결과를 보였다.

Development of the Insufflator for Endoscopic Surgery using the Fluidic System in Printed Circuit Board (유공압 부품이 내장된 인쇄회로기판을 활용한 내시경 수술용 기복기의 개발)

  • Lee, Hee-Nam;Kim, In-Young;Chee, Young-Joon
    • Journal of Biomedical Engineering Research
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    • v.32 no.1
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    • pp.32-36
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    • 2011
  • The insufflators in endoscopic surgery supply carbon dioxide to make the air-filled cavity in the abdomen. It contains many kinds of pneumatic and electronic parts and they are connected with the air tubes and electrical wires. The printed circuit boards (PCB) perform wiring, holding and cooling tasks in electronic systems. In this study, the PCB is used as the air channel for insufflators to decrease the cost, volume, and the malfunction according to aging of the device. Three layers of PCB made of FR4 are combined with prepreg as adhesive which has the internal airway channel according to the design. By mounting the pressure sensors and valves, the PCB based fluidic system is implemented. After calibration of flow sensor, the flow rate of the gas also can be measured. The climate test, temperature test, and biocompatibility test showed this idea can be used in insufflators for laparoscopic surgery.

Forced Convective Cooling Characteristics with Stacked Modules of Multi-PCBs' in Telecommunication Cabinet (다중 PCB 적층 모듈구조의 정보통신용 캐비넷 강제대류 냉각특성 연구)

  • Kim, W.T.;Kim, K.S.
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.8 no.2
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    • pp.230-239
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    • 1996
  • A multi-faceted experimental investigation has been carried out to study the cooling performance for stacked modules in arrays of heat generating rectangular modules deployed along PCB's in the enclosed cabinet. The main parameters which have an important effect on cooling characteristics are flow velocity, channel spacing, installation of fan unit, attachment of heat sink, and acoustic noise. The results of individual effect are very helpful for the electronic packaging designer. In order to improve the cooling performance, it is certain that the enlargement of channel space is obviously effective, while this id disadvantageous in high density electronic packaging. Each of the paameters is quantitatively examined as cooling performance and the correlation of Reynolds number to Nusselt number is compared with previous study.

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Generation of Mini-compacted Thin Film Hybrid Package by Ceramic Ball Grid Array (CBGA를 통한 초소형/박형 박막하이브리드 패키지 구현)

  • 김상희
    • Journal of the Microelectronics and Packaging Society
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    • v.2 no.1
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    • pp.59-68
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    • 1995
  • 박막제조 기술 및 BGA패캐지를 이용하여 Wellcom 2000 system 소요 OCU Board 의 집적화를 구현하였다. 기존 PCB에 실장되는 소자 일부를 2 Channel BGA 패캐지로 모 듈화한 결과 약 1/6로 소형화시킬수 있었으며 8 Channel의 모율화는 현재 진행중인 다층 구조의 제조 기술 개발과 아울러 BGA 패캐지로 실현이 가능하며 1/10로집접화할수 있음을 알수 있었다. 또한 PCB위에 Bare Chip을 실장하여 Wire Bonding 한 COB를 구현하여 CBGGA의 PCB실장과 함께한 모듈을 형성해 보았다. CBGA패캐지에 Ball Shear Test, In Circuit Test 온도 환경주기시험(TCT) 진동시험을 통하여 신뢰성을 입증하였다. 이때 CBGA의 Coplanarity(3.2%) 증진을 위하여 Ceramic Pad에 선택적인 도금 방식을 개발적용 하였다.

A Gigabit Serial Transceiver Design Using FPGA for Satellite Communication Transponder (위성통신 중계기에서의 FPGA를 이용한 Gigabit 시리얼 송수신기 설계)

  • Hong, Keun-Pyo;Lee, Jung-Sub;Jin, Byoung-Il;Ko, Hyun-Suk;Seo, Hak-Geum
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.39A no.8
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    • pp.481-487
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    • 2014
  • In this paper, we have proposed gigabit serial transceiver based on backplane architecture at the satellite communication digital transponder. The transponder supports the full combinational switching function with broadband multi-channel using programmable device - Xilinx space-grade Virtex-5 FPGA. In order to implement the switching function, GTX transceiver solution inside Virtex-5 FPGA is used. Also hardware implementation is simple because of no additional component. In order to use a GTX transceiver, signal integrity(SI) simulation of PCB design is essential. We investigate the characteristics of the S-parameter, eye diagram, channel jitter of GTX transmission line and conform that GTX Transceiver operates without error. Finally the proposed PCB design will be utilized at satellite communication digital transponder EQM-2(Engineering Qualification Model-2).

Heat Transfer Characteristics of Radiation-Mixed Convection in a Three-Dimensional PCB Channel (3차원 PCB 채널내에서의 복사-혼합대류 열전달 특성)

  • Lee, J.H.;Park, K.W.;Pak, H.Y.
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.8 no.4
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    • pp.561-575
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    • 1996
  • The interaction of turbulent mixed convection and surface radiation in a three-dimensional channel with the heated blocks is analyzed numerically. Two blocks are maintained at high temperature and the other bottom and horizontal walls are insulated. S-4 method is employed to calculate the effect of the radiative heat transfer. The low Reynolds number k-$\varepsilon$ model proposed by Launder and Sharma is used to estimate the turbulent influence on the heat transfer enhancement. From above modeling, the effects of various channel specifications on the flow and heat transfer characteristics are investigated. The variables used for the present study are Reynolds number, block spacing, the channel height spacing for block and the emissivity. Average Nusselt numbers along the block surfaces are correlated and presented in terms of Reynolds number, emissivity and dimensionless geometric parameters. For the range of conditions in this study, average Nusselt numbers along the block surfaces are strongly influenced by the Reynolds numbers and channel height spacing for block but weakly influenced by the block spacing and the emissivity of the adiabatic walls.

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