• Title/Summary/Keyword: PCB 산업

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Characteristics of the High Speed Shear Test for Sn-3.0wt.%Ag-0.5wt.%Cu Solder Ball Joints (Sn-3.0wt.%Ag-0.5wt.%Cu 솔더 볼 접합부의 고속전단 특성)

  • Lee, Young-Gon;Lee, Hee-Yul;Moon, Jeong-Tak;Park, Jai-Hyun;Han, Shin-Sik;Jung, Jae-Pil
    • Korean Journal of Metals and Materials
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    • v.47 no.9
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    • pp.580-585
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    • 2009
  • The effects of shear speed and tip height on the high speed shear test of Sn-3.0wt.%Ag-0.5wt.%Cu ball joints were investigated. Solder balls of $450{\mu}m$ in diameter were reflowed at $245^{\circ}C$ on a FR4 PCB (Printed Circuit Board) in order to obtain a sample for the high-speed shear test. The UBM was comprised of Cu/Ni/Au, and the shear speed and tip height varied from 0.5 to 3.0 m/s, and from 10 to $135{\mu}m$, respectively. According to the experimental results, faster shear speed enhanced the shear strength of the solder joints, regardless of the tip height. The fraction of ductile (solder) fracture decreased when the shearing speed was raised from 0.5 to 3.0 m/s. With an increasing tip height from 10 to 50 and $135{\mu}m$, the fracture mode changed from pad lift to mixed (ductile and brittle) and ductile fracture, respectively, while the shearing energy also increased in the same order. The shear energy had a proportional relationship with the fraction of the solder fracture.

Theoretical Heat Flow Analysis and Vibration Characteristics During Transportation of PCS(Power Conversion System) for Reliability (전력변환장치 캐비넷에서의 내부발열 개선을 위한 열유동 분석 및 유통안전성 향상을 위한 진동특성 분석)

  • Joo, Minjung;Suh, Sang Uk;Oh, Jae Young;Jung, Hyun-Mo;Park, Jong-Min
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.28 no.2
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    • pp.143-149
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    • 2022
  • PCS needs to freely switch AC and DC to connect the battery, external AC loads and renewable energy in both directions for energy efficiency. Whenever converting happens, power loss inevitably occurs. Minimization of the power loss to save electricity and convert it for usage is a very critical function in PCS. PCS plays an important role in the ESS(Energy Storage System) but the importance of stabilizing semiconductors on PCB(Printed Circuit Board) should be empathized with a risk of failure such as a fire explosion. In this study, the temperature variation inside PCS was reviewed by cooling fan on top of PCS, and the vibration characteristics of PCS were analyzed during truck transportation for reliability of the product. In most cases, a cooling fan is mounted to control the inner temperature at the upper part of the PCS and components generating the heat placed on the internal aluminum cooling plate to apply the primary cooling and the secondary cooling system with inlet fans for the external air. Results of CFD showed slightly lack of circulating capacity but simulated temperatures were durable for components. The resonance points of PCS were various due to the complexity of components. Although they were less than 40 Hz which mostly occurs breakage, it was analyzed that the vibration displacement in the resonance frequency band was very insufficient. As a result of random-vibration simulation, the lower part was analyzed as the stress-concentrated point but no breakage was shown. The steel sheet could be stable for now, but for long-term domestic transportation, structural coupling may occur due to accumulation of fatigue strength. After the test completed, output voltage of the product had lost so that extra packaging such as bubble wrap should be considered.

Design of Optimal Thermal Structure for DUT Shell using Fluid Analysis (유동해석을 활용한 DUT Shell의 최적 방열구조 설계)

  • Jeong-Gu Lee;Byung-jin Jin;Yong-Hyeon Kim;Young-Chul Bae
    • The Journal of the Korea institute of electronic communication sciences
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    • v.18 no.4
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    • pp.641-648
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    • 2023
  • Recently, the rapid growth of artificial intelligence among the 4th industrial revolution has progressed based on the performance improvement of semiconductor, and circuit integration. According to transistors, which help operation of internal electronic devices and equipment that have been progressed to be more complicated and miniaturized, the control of heat generation and improvement of heat dissipation efficiency have emerged as new performance indicators. The DUT(Device Under Test) Shell is equipment which detects malfunction transistor by evaluating the durability of transistor through heat dissipation in a state where the power is cut off at an arbitrary heating point applying the rating current to inspect the transistor. Since the DUT shell can test more transistor at the same time according to the heat dissipation structure inside the equipment, the heat dissipation efficiency has a direct relationship with the malfunction transistor detection efficiency. Thus, in this paper, we propose various method for PCB configuration structure to optimize heat dissipation of DUT shell and we also propose various transformation and thermal analysis of optimal DUT shell using computational fluid dynamics.

Plasma Application Technology of FOWLP (Fan-out Wafer Level Packaging) Process (FOWLP(Fan-out Wafer Level Packaging) 공정의 플라즈마 응용 기술)

  • Se Yong Park;Seong Eui Lee;Hee Chul Lee;Sung Yong Kim;Nam Sun Park;Kyoung Min Kim
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.1
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    • pp.42-48
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    • 2023
  • Recently, there has been an increasing demand for performance improvement and miniaturization in response to the growing variety of signals and power demands in many industries such as mobile, IoT, and automotive. As a result, there is a high demand for high-performance chips and advanced packaging technologies that can package such chips. In this context, the FOWLP process technology is a suitable technology, and this paper discusses the plasma application technologies that are being used and studied to improve the shortcomings of this process. The paper is divided into four parts, with an introduction and case studies for each of the plasma application technologies used in each part.

Comparison of Cleaning Performance of CFC 113 and the Alternatives (CFC 113과 대체세정제의 세정성능 비교)

  • Row, Kyung Ho;Choi, Dai-Ki;Lee, Youn Yong
    • Analytical Science and Technology
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    • v.6 no.5
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    • pp.521-530
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    • 1993
  • According to the Montreal Protocol, CFC 113, one of the ozone-depleting substances, will be prohibited to use as a cleaning solvent essentially in the electronic industry. Therefore, the development of the alternative cleaning solvents to CFC 113 is being accelerated. A number of the alternative cleaning solvents are avialable on the market. The alternatives of Axarel 32(DuPont), Cleanthru 750H(KAO Chemical), and EC-Ultra(Petroferm) are chosen for the comparison of cleaning performance with CFC 113. The test methods for measuring the cleaning performance were composed of the measurement of the physical properties, the experiments on the material compatibility with cleaning solvents, the measurement of the evaporation rate, and finally the experiments of the removal efficiency. Normally the basic physical properties of the alternatives had higher boiling points, viscosity and surface tension, which were quite different to those of CFC 113. In terms of solubility of rosin-based flux, the solubilities of abietic acid (nonpolar organic) were similar, but those of the activator (polar organic) in the alternatives were better than CFC 113. The evaporation of the alternatives was very slow, compared to CFC 113, which had much lower boiling point. All the cleaning solvents showed the good material compatibility with FR4 and Cu-coated PCB. The better removal efficiencies of abietic acid were obtained when using the ultrasonic mechanical energy over the dipping method. The experiments also indicated the very slow-eavaporating solvent was not desirable with the dipping cleaning method, and the differences in the removal efficiency of the alternatives with the ultrasonic cleaning method were negligible. Among the alternatives, the overall cleaning performances were obsorved as almost similar. Before selecting the ultimate cleaning solvent, the application of cleaning machine, environmental issues, and economics are simultaneously considered with the cleaning performance.

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Soil Pollution and Contaminated Soil Management of the Public Housing Agency in Residential Land Development (전국 토양오염실태 및 공공택지개발지구의 오염토양 관리)

  • Oh, Jeongik;Jin, Kyunam;Lee, Hyunjeong
    • Journal of Korean Society of Environmental Engineers
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    • v.38 no.7
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    • pp.377-386
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    • 2016
  • The purposes of this research are to examine soil pollution in the nation and to explore the contaminated soil management of the public housing agency in public land for residential development. In so doing, the primary and secondary data were utilized, the former made use of the public data annually released by the Korea Ministry of Environment, and the latter relied on a self-administerd questionnaire survey conducted in the staff of the public housing agency, particularly those in charge of soil contamination in large-scale land, housing and urban development projects. The findings reveal that the national concentrations of 21 inorganic and organic soil contaminants (e.g., Cd, Cu, As, Hg, Pb, Cr, Zn, Ni, F, P, PCB, CN, Phenol, BTEX, TPH, TCE, PCE, Benzo(a)pyrene, and pH) in the land were extracted to be well below the risk level designated by the statutory guidance while industrial areas had them at a relatively modest level. In addition, the survey results indicate that the public housing agency didn't establish specific and clear guidelines for soil pollution and its remediation in the residential land development, so that contaminated sites have been primarily remediated by outsourcing companies. As the unexpected occurrence of contaminated sites causes the incurring expenses added to total project budget, the provision of both professional training and on-site manuals with the sufficient information on techniques and methods of soil contamination is critical to promptly and systematically deal with soil pollution.

Effect of RED and FAR-RED LEDs on the Fruit Quality of 'Hongro'/M.26 Apple (적색과 초적색 LEDs 보광이 '홍로'/M.26 사과의 과실품질에 미치는 영향)

  • Kang, Seok-Beom;Song, Yang-Yik;Park, Moo-Yong;Kweon, Hun-Joong
    • Korean Journal of Environmental Agriculture
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    • v.32 no.1
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    • pp.42-47
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    • 2013
  • BACKGROUND: As improved LEDs (Light Emitting Diode) industry and decreased the price of LEDs in Korea, some farmers try to using the RED LEDs in green house and open field to increase the production of crop under bad weather condition. The aim of this study is to find out the effect of RED and FAR-RED LEDs lighting on the fruit quality of twelve-year old 'Hongro'/M.26 apple during night after sunset. METHODS AND RESULTS: FAR-RED (730nm, 2 and 4 hour) and RED (620nm, 2 and 4 hour) with 20 LED/PCB were treated in orchard for 16 weeks from June 10 to October 10 in 2009 and 2010 with control as an comparison. In our experiments, leaf weight was significantly higher in RED LEDs than control, tended to be decreased as times of FAR-RED lighting increased. Fruit weight was increased more in RED LEDs than control in 2009 and 2010, but decreased in FAR-RED lighting compared to control in 2010. Firmness and Hunter's a value of fruit were increased in FAR-RED lighting with 2 and 4 h than control. Soluble solid contents were higher in 2 h RED and 2, 4 h FAR-RED LEDs compared to control in 2009, there was no significant difference in 2010. Acid contents were no difference among the treatments. CONCLUSION(S): In our results, we found that RED LEDs was more helpful to increase the fruit weight and FAR-RED LEDs promote to be higher hunter a value of fruit skin. So, we thought that it is necessary to more study if mixed of RED and FAR-RED lighting is more helpful to promote fruit quality of 'Hongro' apple than single lighting of RED or FAR-RED LEDs respectively.