• Title/Summary/Keyword: P-V Characteristics

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A Study on the Cultural Characteristics of Pholiota nameko Mycelium (맛버섯 균사체의 배양 특성에 관한 연구)

  • 차월석;이동병;강시형;오동규
    • Journal of Life Science
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    • v.13 no.4
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    • pp.498-504
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    • 2003
  • This Study was carried out to investigate the optimal mycelial growth of Pholiota nameko. The optimal medium for the mycelial growth was ME medium. The optimal temperature and pH were $25^{\circ}C$$\pm$1 and 5.5, respectively. The modified optimal medium compositions were glucose 3% (w/v), malt extract 0.25% (w/v), yeast extract 0.25% (w/v), $KH_2PO_4$ 0.046% (w/v), $K_2HPO_4$ 0.1% (w/v), $MgSO_4$$7H_2O$ 0.05% (w/v). From the result of experiments on the optimal temperature, pH and nutritional requirements, the mycelial growth of modified optimal medium was higher than that of ME medium.

Characteristics of Capacitive Coupler for Partial Discharge Measurement in 6.6kV Rotating Machines (6.6kV 회전기 부분방전 측정용 Capacitive Coupler 특성)

  • Kang, Dong-Sik;Yoon, Dae-Hee;Kim, Yong-Joo;Yun, Yung-Ho;Lee, Jung-Jun;Song, Sang-Ock
    • Proceedings of the KIEE Conference
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    • 2001.07c
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    • pp.1619-1622
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    • 2001
  • Recently many researches on the diagnosis of stator winding insulation for large rotating machines have been developed sine the 1970s. Capacitive coupler has been the most widely used sensor for on-line partial discharge(PD) in rotating machines. The 105 [pF] ceramic coupler(CC) has been developed to continuously measure the PD activity in operating motor stator windings. This paper presents frequency characteristics and laboratory test to compare traditional 80 [pF] epoxy-mica coupler(EMC) and 105 [pF] CC for PD measurement in 6.6 [kV] stator windings.

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Study on 3.3 kV Super Junction Field Stop IGBT According to Design and Process Parameters (설계 및 공정 파라미터에 따른 3.3 kV급 Super Junction FS-IGBT에 관한 연구)

  • Kang, Ey Goo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.4
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    • pp.210-213
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    • 2017
  • In this paper, we analyzed the structural design and electrical characteristics of a 3.3 kV super junction FS IGBT as a next generation power device. The device parameters were extracted by design and process simulation. To obtain optimal breakdown voltage, we researched the breakdown characteristics. Initially, we confirmed that the breakdown voltage decreased as trench depth increased. We analyzed the breakdown voltage according to p pillar dose. As a result of the experiment, we confirmed that the breakdown voltage increased as p pillar dose increased. To obtain more than 3.3 kV, the p pillar dose was $5{\times}10^{13}cm^{-2}$, and the epi layer resistance was $140{\Omega}$. We extracted design and process parameters considering the on state voltage drop.

Dielectric Characteristics of Gaseous $SF_6$ for Impulse Voltages in Presence of a Metallic Particle in GIS (가스절연개폐장치에 있어서 금속입자 존재시 임펄스전압에 대한 $SF_6$가스의 절연특성)

  • 이복희;이경옥;이창준
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.14 no.1
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    • pp.22-29
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    • 2000
  • This paper deals with the dielectric characteristics of $SF_6$ gas gap stressed by $\pm$1.2/44[$mutextrm{s}$] non-oscillating impulse and $\pm$0.4[$mutextrm{s}$]/1.14[MHz] oscillating impulse voltages in the presence of a needle-shape metallic particle in gas-insulated switchgear(GIS). Breakdown voltage-time (V-t) and breakdown voltage-gas pressure (V-p) characteristics were investigated and discussed. The experiments were carried out under highly inhomogeneous field geometry with a needle protrusion whose length and radius are 10[mm] and 0.5[mm], respectively. The gas pressure ranges from 0.1 to 0.5[㎫]. As a result, it was found that the electrical breakdown for both the positive and negative polarity develops with steplike pulses in leader mechanism, When subjected to the positive oscillating impulse voltage, the minimum breakdown voltages appeared in all the gas pressure ranges and the V-t curves have a pronounced upturning at short times to breakdown and give a little dependence of the gas pressure. On the other hand, in the case of the negative polarity the dependence of the V-t and V-p characteristics on the wave shape of the applied voltages is known to be appreciable.

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Effect of Mixture Ratio of Biochar and Peatmoss on the Growth of Aster spathulifolius (바이오차와 피트모스의 혼합비율이 해국 묘 생육에 미치는 영향)

  • Kim, S.J.;Kim, S.J.;Han, S.K.;Kwon, Y.K.;Kwon, Y.H.
    • Journal of Practical Agriculture & Fisheries Research
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    • v.20 no.2
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    • pp.31-38
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    • 2018
  • This study was conducted to investigate the possibility of biochar as an alternative medium to peatmoss using for Aster spathulifolius. We cultivated A. spathulifolius in four potting media with different mixing rates (v/v) of peatmoss (P) and biochar (B) as follows: B0+P3, B1+P2, B2+P1, and B3+P0 with vermiculite 3 + perlite 3. Also, we analyzed the chemical properties of media and the plant growth characteristics. The results were as follows: In case of media's chemical condition, B0+P3 and B1+P2 treatments showed higher tendency (p < 0.05). Plant height on B0+P3 and B1+P2 treatments was much higher than that on other treatments (p < 0.05). Root length on B1+P2 treatment was higher than on B0+P3 treatment (p < 0.05). B0+P3 and B1+P2 treatments showed higher number of leaves and dry biomass than other treatments. Therefore, our results support that Biochar : Peatmoss : Vermiculite : Perlite (1/3 : 2/3 : 1 : 1, v/v) could be a more economical potting medium for A. spathulifolius than peatmoss : vermiculite : perlite (1 : 1 : 1, v/v).

Electrical characteristics of polycrystalline 3C-SiC thin film diodes (다결정 3C-SiC 박막 다이오드의 전기적 특성)

  • Chung, Gwiy-Sang;Ahn, Jeong-Hak
    • Journal of Sensor Science and Technology
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    • v.16 no.4
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    • pp.259-262
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    • 2007
  • This paper describes the electrical characteristics of polycrystalline (poly) 3C-SiC thin film diodes, in which poly 3C-SiC thin films on n-type and p-type Si wafers, respectively, were deposited by APCVD using HMDS, $H_{2}$, and Ar gas at $1150^{\circ}C$ for 3 hr. The schottky diode with Au/poly 3C-SiC/Si (n-type) structure was fabricated. Its threshold voltage ($V_{bi}$), breakdown voltage, thickness of depletion layer, and doping concentration ($N_{D}$) value were measured as 0.84 V, over 140 V, 61 nm, and $2.7{\times}10^{19}cm^{-3}$, respectively. Moreover, for the good ohmic contact, Al/poly 3C-SiC/Si (n-type) structure was annealed at 300, 400, and $500^{\circ}C$, respectively for 30 min under the vacuum condition of $5.0{\times}10^{-6}$ Torr. Finally, the p-n junction diodes fabricated on the poly 3C-Si/Si (p-type) were obtained like characteristics of single 3CSiC p-n junction diode. Therefore, poly 3C-SiC thin film diodes will be suitable for microsensors in conjunction with Si fabrication technology.

Optical packaging technology and characterization of analog PIN-Photodiode (Analog용 PIN-Photodiode의 광 패키징 기술 및 특성 연구)

  • Lee Chang Min;Kwon Kee Young
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.42 no.3 s.333
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    • pp.17-24
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    • 2005
  • We fabricated PIN-Photodiodes with a single mode fiber for analog communications and analyzed characteristics of the devices. The fabricated PIN-Photodiode shows a bandwidth of 1.5 GHz, a dark current of 20 p4 a capacitance of 0.48 pF, and the responsivity of 0.9 V/W, a second order distortion of -72 dBc. In this paper, we developed a new optical Packaging technology that is aligning in real-time monitoring of both responsivity and IM2 characteristics. As a result responsivity has been improved by 0.03 V/W, and also U has been improved by $3\~5\;dBc$. On the other hand, failure ratio has been reduced by $3.5\%$.

A Study on the Development and Characteristics Evaluation of Non-Contact HFCT Sensor for Partial Discharge Measurement (부분방전 측정용 비접촉식 HFCT 센서개발 및 특성평가에 관한 연구)

  • Sang-Bo Han
    • Journal of IKEEE
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    • v.28 no.2
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    • pp.131-135
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    • 2024
  • In this study, the sensor such as current transformer type was developed for measuring non-contact partial discharge in power electrical facilities, and the results of the characteristic evaluation were discussed. The frequency response characteristics of the HFCT sensor were shown to be measurable from 20 [kHz] to 20 [MHz]. The average sensitivity for the positive direction was 0.308 [mV/pC], and the negative direction was 0.459 [mV/pC]. Which showed that the sensitivity for the negative direction was better than that for the positive direction. The developed HFCT sensor is possible to measure very small partial discharge pulse signals and can be measured various types of partial discharge that may occur at power electrical facilities.

A Study for Electrical Characteristics of MAS (Metal-$Al_2O_3$-Si) Structure (MAS (Metal-$Al_2O_3$-Si) 구조에 있어서 전기적 특성에 관한 연구)

  • Park, Sung-Hee;Lee, Dong-Yeob;Chang, Ji-Keun;Lee, Young-Hee
    • Proceedings of the KIEE Conference
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    • 1987.07a
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    • pp.461-464
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    • 1987
  • With the fabrication of Al-$Al_2O_3$-n(p) type Si devices, the analysis and measurement of various characteristics, this study presented the electric physical property theory for the charge distribution of MAS device $Al_2O_3$ films, and inquired out the devices available. In order to study them, Al-(450A)$Al_2O_3$-n(p) type Si was the main objects in the study. They were examined through carrier injection, C-V curves of devices on time, ${\Delta}V_{FB}$-t curves, I-V curves and $Al_2O_3$ film's breakdown characteristics.

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A Study on the Design and Electrical Characteristics of High Performance Smart Power Device (고성능 Smart Power 소자 설계 및 전기적 특성에 관한 연구)

  • Ku, Yong-Seo
    • Journal of IKEEE
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    • v.7 no.1 s.12
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    • pp.1-8
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    • 2003
  • In this study, the high performance BCD device structure which satisfies the high voltage and fast switching speed characteristics is devised. Through the process and device simulation, optimal process spec. & device spec. are designed. We adapt double buried layer structure, trench isolation process, n-/p-drift region formation and shallow junction technology to optimize an electrical property as mentioned above. This I.C consists of 20V level high voltage bipolar npn/pnp device, 60V level LDMOS device, a few Ampere level VDMOS, 20V level CMOS device and 5V level logic CMOS.

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