• The Journal of Advanced Prosthodontics
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• v.6 no.5
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• pp.333-345
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• 2014

PURPOSE. Bonding agents (BA) are the crucial weak link of composite restorations. Since the commercial materials' compositions are not disclosed, studies to formulize the optimum ratios of different components are of value. The aim of this study was to find a proper formula of BAs. MATERIALS AND METHODS. This explorative experimental in vitro study was composed of 4 different sets of extensive experiments. A commercial BA and 7 experimental formulas were compared in terms of degree of conversion (5 experimental formulas), shear bond strength, mode of failure, and microleakage (3 experimental formulas). Statistical analyses were performed (${\alpha}$=.05). The DC of selected formula was tested one year later. RESULTS. The two-way ANOVA indicated a significant difference between the shear bond strength (SBS) of two tissues (dentin vs. enamel, P=.0001) in a way that dentinal bonds were weaker. However, there was no difference between the four materials (P=.283). The adhesive mode of failure was predominant in all groups. No differences between the microleakage of the four materials at occlusal (P=.788) or gingival (P=.508) sites were detected (Kruskal-Wallis). The Mann-Whitney U test showed a significant difference between the microleakage of all materials (3 experimental formulas and a commercial material) together at the occlusal site versus the gingival site (P=.041). CONCLUSION. A formula with 62% bisphenol A-glycidyl methacrylate (Bis-GMA), 37% hydroxy ethyl methacrylate (HEMA), 0.3% camphorquinone (CQ), and 0.7% dimethyl-para-toluidine (DMPT) seems a proper formula for mass production. The microleakage and SBS might be respectively higher and lower on dentin compared to enamel.

• The korean journal of orthodontics
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• v.44 no.3
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• pp.128-135
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• 2014

Objective: This study evaluated the cytotoxicity and genotoxicity of fixed orthodontic treatment with three different light-cured orthodontic bonding composites by analyzing micronucleus (MN) formation in the buccal mucosa during a 6-month period. Methods: Thirty healthy volunteers were selected from consecutive patients referred for orthodontic treatment. Equilibrium 2 brackets and molar tubes (Dentaurum) were bonded with three different lightcured orthodontic bonding composites-Transbond XT (3M Unitek), Kurasper F (Kuraray Europe), or GrenGloo (Ormco Corporation)- to all teeth in both arches. Exfoliated buccal epithelial cells were scraped from the middle part of the inner cheeks with sterile cement spatulas before treatment and at 1, 3, and 6 months after treatment. MNs and nuclear alterations, such as karyorrhexis (KR), karyolysis (KL), and binucleated cells (BNs), were scored under a light microscope. Repeated measure ANOVA was used to calculate statistical differences in degenerative nuclear abnormalities. Results: MN rates did not significantly differ among different time points within the same cell type (p > 0.05). In contrast, the number of BNs in buccal epithelial cells significantly increased in all composite groups (p < 0.01, Transbond XT; p < 0.001, Kurasper F and GrenGloo). KL frequency significantly increased between the beginning and end of the study in the Kurasfer F ($0.80{\pm}0.79$ to $1.90{\pm}1.10$; p < 0.05) and GrenGloo ($1.30{\pm}1.06$ to $2.40{\pm}1.08$; p < 0.05) groups. Conclusions: After 6 months of fixed orthodontic treatment with different light-cured composites, morphological signs of cytotoxicity were observed but genotoxic effects were absent.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.11 s.114
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• pp.1105-1111
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• 2006

In this paper, using low-temperature co-fired ceramic(LTCC) based system-in-package(SiP) technology, a very compact power amplifier LTCC module was designed, fabricated, and then characterized for 60 GHz wireless transmitter applications. In order to reduce the interconnection loss between a LTCC board and power amplifier monolithic microwave integrated circuits(MMIC), bond-wire transitions were optimized and high-isolated module structure was proposed to integrate the power amplifier MMIC into LTCC board. In the case of wire-bonding transition, a matching circuit was designed on the LTCC substrate and interconnection space between wires was optimized in terms of their angle. In addition, the wire-bonding structure of coplanar waveguide type was used to reduce radiation of EM-fields due to interconnection discontinuity. For high-isolated module structure, DC bias lines were fully embedded into the LTCC substrate and shielded with vias. Using 5-layer LTCC dielectrics, the power amplifier LTCC module was fabricated and its size is $4.6{\times}4.9{\times}0.5mm^3$. The fabricated module shows the gain of 10 dB and the output power of 11 dBm at P1dB compression point from 60 to 65 GHz.

• 한국생물공학회:학술대회논문집
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• 2000.11a
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• pp.644-647
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• 2000

The properties of hydrogen bonding between poly(2-ethyl-2-oxazoline)[PEOx] and poly(acrylic acid)[PAA] were investigated. PEOx and PAA formed stable complex and precipitated due to hydrogen bonding between hydrogen of PAA and oxygen of PEOx in acidic condition(below pH 4.3). Optimum reaction ratio of PEOx and PAA was determined as mass ratio of 1:1.5 for applications in aqueous two phase system. The mixtures of the polymers formed aqueous two phase system with dextran solution after the breakage of hydrogen bondings. This properties can be used for the recovery of valuable products.

• Journal of Powder Materials
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• v.13 no.1 s.54
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• pp.39-45
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• 2006

The $Al/SiC_p$ particle reinforced composite fabricated by a powder-in sheath rolling (PSR) method was severely. deformed by the accumulative roll-bonding (ARB) process. The ARB process was performed up to 8 cycles at ambient temperature without lubricant. The ARBed composite exhibited an ulbricant. grained structure similar to the other ARBed bulky materials. Tensile strength of the composite increased gradually with the number of ARB cycles, but from the 6th cycle it rather decreased slightly. These characteristics of the composite were somewhat different from those of Al powder compact fabricated by the same procedures. The difference in microstructure and mechanical properties between Al powder compact and the composite was discussed.

• Restorative Dentistry and Endodontics
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• v.27 no.1
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• pp.44-53
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• 2002

목적 : 최근 개발된 bonding agent 중 일부는 다양한 함량의 filler를 포함하고 있으며 filler의 첨가는 bonding agent의 기계적인 물성을 향상시킴으로써 접착력의 향상에 기여한다는 주장이 있다. 본 연구에서는 다양한 함량의 filler를 포함한 adhesive를 실험적으로 만들어, filler의 함량이 전단접착강도에 미치는 영향을 살펴보고 임상적으로 가장 적절한 filler의 함량을 알아보고자 하였다. 또 adhesive의 간접인장강도를 측정하여 adhesive의 기계적인 물성과 접착력과의 상관관계를 알아보았다. 방법 : 발거된 건전한 70개의 대구치를 투명 레진에 매몰하고 상아질면을 노출시켰다. 3M사의 Scotchbond Multipurpose의 etchant와 primer를 제조사의 지시대로 적용하고 1$\mu\textrm{m}$크기의 barium glass filler를 0, 5, 10, 15, 20, 30, 45wt% 포함하도록 실험적으로 제작한 adhesive를 도포한 후 레진을 충전하여 시편을 완성하였다. Instron으로 0.5mm/min의 속도에서 전단접착강도를 측정하고 그 단면을 입체현미경으로 관찰하여 파절의 양상을 확인하였다. Filler함량에 따른 adhesive의 후경을 측정하기 위해 상기한 방법으로 시편을 제작하여 주사 전자현미경으로 관찰한 후 Sigmascan을 이용하여 그 후경을 측정하였다. 또, 지름 4mm 높이 6mm의 원통형 시편을 제작하여 Instron로 간접인장강도의 측정을 시행하였다. 얻어진 결과는 Kruskal-Wallis test와 Mann-Whitney test를 시행하여 분석하였으며, 상관관계를 분석을 위해 Pearson Product Moment Correlation Coefficient를 구하였다. 결과 : 1) Filler함유량에 따라 전단접착강도는 유의할 만한 차이를 보였다(p<0.05). 2) Filler함량의 증가에 따라 전단접착강도는 유의하게 증가하여 15% 수준에서 가장 높은 갈(19.9$\pm$1.38Mpa)을 보였으며 20% 이상의 수준에서는 유의하게 감소하였다(p<0.05). 3) Adhesive의 간접인장강도는 20% 수준까지는 증가하는 양상을 보였으나 통계적 유의성은 없었으며(p>0.05), 30% 이상에서는 유의할 만한 감소를 보였다(p<0.05). 4) Adhesive의 후경은 0% 수준에서 5.97$\pm$1.23$\mu\textrm{m}$부터 45%수준에서 73.37$\pm$11.7$\mu\textrm{m}$까지 유의하게 증가하였다(p<0.05). 5) Filler함량에 따른 Adhesive의 간접인장강도와 전단접착강도는 상관관계가 없었다.

• YAKHAK HOEJI
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• v.42 no.3
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• pp.290-295
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• 1998

To optimize the formulation of acetaminophen liquid suppository, the effect of additives on the physicochemical properties of liquid suppository base was investigated. The physi cochemical properties of P 407/P 188 (15/15%) (abbreviated in 15/15) and P 407/P l88 (15/20%) (abbreviated in 15/20) were measured after the addition of following additives; 2.5% acetaminophen as an active ingredient, vehicle components (5% ethanol, 5% propylene glycol, 5% glycerin), preservatives (0.1% sodium benzoate, 0,1% methylparahydroxybenzoate, 0.1% propylparahydroxybenzoate) and 1% of sodium chloride as an ionic strength controlling agent. Poloxamer gel was prepared with three different buffer solutions (pH 1.2, 4.0 and 6.8) and the physicochemical properties, gelation temperature, gel strength and bioadhesive force, were determined. In the results, the effect of additives on the physicochemical properties was dependent on their bonding capacities including hydrogen bonding and cross-linking bonding. Because the hydrogen-bonding capacities of acetaminophen, ethanol and propylene glycol were smaller than that of poloxamer, the binding force of poloxamer gel became weak by their putting in between poloxamer gel. Therefore, the gelation temperature (15/15, $35.7^{\circ}C$ vs 37.0, 39.4 $38.2^{\circ}C$; 15/20, $29.2^{\circ}C$ vs 31.2, 32.0, $30.3^{\circ}C$) increased, and gel strength (15/15, 4.03 see vs 2.72, 2.08, 3.12sec; 15/20, 300g vs 50, 50, 200g) and bioadhesive force (15/15, $6.8{\times}10^2\;dyne/cm^2$ vs 3.2, 6.0, $6.0{\times}10^2\;dyne/cm^2$; 15/20, $97.3{\times}10^2\;dyne/cm^2$ vs 11.1, 89.5, $92.0{\times}10^2\;dyne/cm^2$) decreased. Furthermore, the binding force of poloxamer gel became strong due to the hydrogen-bonding capacities of glycerin and the cross-liking bonding of sodium salt. Then, the gelation temperature (15/15, 35.0, $32.1^{\circ}C$; 15/20, 26.0, $21.0^{\circ}C$) decreased, and gel strength (15/15, 6.51 see, 300g; 15/20, 500, 650g) and bioadhesive force (15/15, 7.2, $81.6{\times}10^2\;dyne/cm^2$; 15/20, 112.3, $309.2{\times}10^2\;dyne/cm^2$) increased. The effect of pH on the physicochemical properties of poloxamer gel was dependent on the ingredients with which the buffer solutions were prepared. Poloxamer gels prepared with pH 1.2 and 4.0 buffer solutions had the increasing gelation temperature (15/15, 37.5, $38.1^{\circ}C$; 15/20, 33.1, $34.0^{\circ}C$) and the decreasing gel strength (15/15, 2.98, 3.81sec; 15/20, 200, 200g) and bioadhesive force (15/15, $7.0{\times}10^2dyne/cm^2$; 15/20, $74.0{\sim}88.1{\times}10^2dyne/cm^2$) owing to HCl. Poloxamer gel prepared with pH 6.8 buffer solutions had the decreasing gelation temperature (15/15, $27.2^{\circ}C$; 15/20, $22.3^{\circ}C$) and the increasing gel strength (15/15, 400g; 15/20, 550g) and bioadhesive force (15/15, $207.0{\times}10^2dyne/cm^2$; 15/20, $215.0{\times}10^2dyne/cm^2$) due to the cross-linking bonding of $NaH_2PO_4\;and\;K_2HPO_4$.

• Restorative Dentistry and Endodontics
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• v.20 no.2
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• pp.685-698
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• 1995

This study was conducted to the effect of temporary cement on the adhesiveness of dentin bonding agent to dentin surface. One hundred freshly extracted bovine mandibular incisors were grinded to expose flat labial dentin surface. The dentin surfaces were temporarized with either eugenol-containing temporary cement(TemBond and Zinc Oxide Eugenol cement) or non-eugenol temporary cement(Nogenol and TempBond NE) for 7days, and then the temporarization was removed with surgical currette and the exposed dentin surfaces were water-rinsed. Bonding specimens were made by use of All-Bond 2 and Super-Bond C&B dentin bonding agent, and stored in $37^{\circ}C$ distilled water for 24hours. The tensile bond strenth and the cohesive failure rate were measured, and then the pretreated dentin surfaces which the temporary cement had been applied to and removed from and the fractured dentin surfaces after bonding test were examined under scanning electron microscope. The results were as follows : In case of bonding with All-Bond 2, tensile bond strength of each experimental group was lower than that of the control group(p<0.05), but there was no significant difference between the bond strengths of the control group and each experimental group in case of bonding with Super-Bond C&B(p>0.05). No significant difference between tensile bond strength of experimental group, whether temporary cement contains eugenol or not, was seen(p>0.05). In case of bonding with All-Bond 2, the control group showed cohesive-adhesive mixed failure mode and the experimental groups mainly showed adhesive failure mode, but in case of bonding with Super-Bond C&B, almost of the control and the experimental groups mainly showed cohesive failure mode. On SEM examination, all of the dentin specimens pretreated with either 10 % phosphoric acid or 10% citric acid after application of the temporary cements demonstrated remnants of temporary cement attached to dentin surface.

• Bulletin of the Korean Chemical Society
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• v.28 no.12
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• pp.2454-2458
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• 2007

Exploring the basic concepts for the design of CO2-philic molecules is important due to the possibility for “green” chemistry in supercritical CO2 as substitute solvent systems. The Lewis acid-base interactions and C?H…O weak hydrogen bonding were suggested as two key factors for the solubility of CO2-philic molecules. We have performed high level quantum mechanical calculations for the van der Waals complexes of CO2 with trimethylphosphate and trimethylphosphine oxide, which have long been used for metal extractants in supercritical CO2 fluid. Structures and energies were calculated using the MP2/6-31+G(d) and recently developed multilevel methods. These studies indicate that the Lewis acid-base interactions have larger impact on the stability of structure than the C?H…O weak hydrogen bonding. The weak hydrogen bonds in trimethylphosphine oxide have an important role to the large supercritical CO2 solubility when a metal is bound to the oxygen atom of the P=O group. Trimethylphosphate has many Lewis acid-base interaction sites so that it can be dissolved into supercritical CO2 easily even when it has metal ion on the oxygen atom of the P=O group, which is indispensable for a good extractant.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.25 no.9B
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• pp.1635-1640
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• 2000

In this paper, a 18 GHz oscillator is designed with the push-push method an fabricated by semi-MMIC process, in which the second harmonic is the main output signal with the suppressed fundamental mode. In semi-MMIC process, passive components with microstrip transmission line are implemented using MMIC process on semi-insulating GaAs substrate. Then, chip types of P-HEMT, resistors, and capacitors are connected through Au wire-bonding. Also, the ground plane is inserted around the circuit and connected each other with the back-side of substrate through Au wire-bonding instead of via-hole. The semi-MMIC push-push oscillator shows the output powder of -10.5 dBm, the fundamental frequency suppression of -17.3 dBc/Hz, and the phase noise of -97.9 dBc/Hz at the offset frequency of 100 kHz.