• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.65-70
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• 2014

Warpage of top packages to form thin package-on-packages was measured with progress of their process steps such as PCB substrate itself, chip bonding, and epoxy molding. The $100{\mu}m$-thick PCB substrate exhibited a warpage of $136{\sim}214{\mu}m$. The specimen formed by mounting a $40{\mu}m$-thick Si chip to such a PCB using a die attach film exhibited the warpage of $89{\sim}194{\mu}m$, which was similar to that of the PCB itself. On the other hand, the specimen fabricated by flip chip bonding of a $40{\mu}m$-thick chip to such a PCB possessed the warpage of $-199{\sim}691{\mu}m$, which was significantly different from the warpage of the PCB. After epoxy molding, the specimens processed by die attach bonding and flip chip bonding exhibited warpages of $-79{\sim}202{\mu}m$ and $-117{\sim}159{\mu}m$, respectively.

• The Journal of Korean Academy of Prosthodontics
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• v.43 no.4
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• pp.415-425
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• 2005

Statement of problem : Fracture of composite resin core will be occulted by progress of crack. Bonding interface of different materials has large possibility of starting point of crack line. Therefore, the bond strength of glass fiber post to composite resin core is important for prevention of fracture. Purpose: This in vitro study tried to find out how to get the higher strength of glass fiber post to composite resin core through surveying the maximum load that fractures the post and cote complex. Materials and methods: 40 specimens made with glass fiber Posts(Style $post^{(R)}$, Metalor, Swiss) and composite resin core ($Z-100^{(R)}$, 3M, USA) were prepared and loaded to failure with push-out type shear-bond strength test in a universal test machine. The maximum fracture load and fracture mode were investigated in the specimens that were restored with four different surface treatments. With the data. ANOVA test was used to validate the significance between the test groups, and Bonferroni method was used to check if there is any significant statistical difference between each test group. Evely analysis was approved with 95% reliance. Results: On measuring the maximum fracture load of specimens, both the treatments of sandblasted and acid-etched one statistically showed the strength increase rather than the control group (p<0.005). The scanning electric microscope revealed that sand blasting made more micro-retention form not only on the resin matrix but on the glass fiber, and acid-etching contributed to increase in surface retention form, eliminated the inorganic particles in resin matrix. Specimen fracture modes investigation represented that sand blasted groups showed lower bonding failure than no-sand blasted groups. Conclusion: Referring to the values of maximum fracture load of specimens, the bonding strength was increased by sand blasting and acid-etching.

• International Journal of Highway Engineering
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• v.15 no.2
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• pp.65-71
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• 2013

PURPOSES : The objective of this study is to evaluate the effect of physical characteristics of emulsion asphalt and aggregate on performance of chip seal pavements. METHODS : In order to evaluate the performance of chip seal materials, the sweep tests and Vialit Plate Shock tests were conducted on the mixtures with five emulsion asphalt binders and three aggregate types. The sweep tests was intended to investigate the change of bonding properties between emulsion asphalt and aggregate with curing time. The Vialit Plate Shock test was used to evaluate the bonding properties of chip seal materials at low temperatures. RESULTS : Results from sweep tests showed that polymer modified emulsion asphalt can reduce the curing time by 1.5 hour comparing with typical emulsion asphalt. It is also found that the Flakiness Index of aggregates and absorption rate of binder are the major factors affecting the bonding properties of chip seal materials. The Vialit Plate Shock test results showed that the average aggregate loss of CRS-2 is ten times higher than CRS-2P No.2 indicating that the use of polymer additives in emulsion asphalt can improve the performance of chip seal materials in low temperature region. CONCLUSIONS : The use of polymer in emulsion asphalt can decrease the curing time of chip seal materials and increase the bonding properties between aggregates and asphalt binder. It is also concluded that the lower Flakiness Index and absorption rate of aggregates can improve the performance of chip seal pavement.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.7
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• pp.691-696
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• 2004

The electronic state and chemical bonding of $\beta$-MnO$_2$ with transition metal dopants were theoretically investigated by DV-X$_{\alpha}$ (the discrete variational X$_{\alpha}$) method, which is a sort of the first principles molecular orbital method using the Hartree-Fock-Slater approximation. The calculations were performed with a $_Mn_{14}$ MO$_{56}$ )$^{-52}$ (M = transition metals) cluster model. The electron energy level, the density of states (DOS), the overlap population, the charge density distribution, and the net charges, were calculated. The energy level diagram of MnO$_2$ shows the different band structure and electron occupancy between the up spin states and down spin states. The dopant levels decrease between the conduction band and the valence band with the increase of the atomic number of dopants. The covalency of chemical bonding was shown to increase and ionicity decreased in increasing the atomic number of dopants. Calculated results were discussed on the basis of the interaction between transition metal 3d and oxygen 2p orbital. In conclusion it is expected that when the transition metals are added to MnO$_2$ the band gap decreases and the electronic conductivity increases with the increase of the atomic number of dopants. the atomic number of dopants.

• Journal of the korean academy of Pediatric Dentistry
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• v.39 no.2
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• pp.153-159
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• 2012

The objective of this study was to assess the effect of salivary contamination on shear bond strength of pit and fissure sealant using several bonding agents by means of applying saliva at different stages of treatment. 56 teeth were randomly divided into one of seven groups (8 per group): (Group A, B) acid etching; (Group C, D, E) Adper$^{TM}$ Single Bond after acid-etching; (Group F, G) Adper$^{TM}$ Prompt L-pop. Saliva was applied to teeth surface of B, D, E, and G groups for 10 seconds. Especially, group D was contaminated after acid-etching and group E was contaminated with saliva after adhesive application. After light curing, all of the specimens were thermocycled and the shear bond strength tests were performed. The results were as follows. 1. In generally performed pit and fissure sealant group, shear bonding strength significantly differently reduced when was contaminated by saliva (p<0.05). However the group that was applied with bonding agent during pit and fissure sealant procedure, there were no significant differences in the kind of bonding agents nor the stage of contamination. 2. In group that was not contaminated by saliva during pit and fissure sealant treatment, Adper$^{TM}$ Single Bond yielded the highest bonding strength but there were no significant differences. 3. The failure pattern on the debonded surfaces shows that most specimens from groups using bonding agents showed cohesive failures while most specimens from groups that didn't use bonding agents showed adhesive failures.

• Korean Journal of Soil Science and Fertilizer
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• v.16 no.4
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• pp.318-324
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• 1983

Electrochemical properties of Georgia kaolinite in aqueous suspension were studied by ion adsorption, potentiometric titration, and electrophoretic mobility measurements. Kaolinite in 0.001 M and 0.1 M NaCl solution showed qualitatively both pH independent and pH depender negative and positive charges through pH range 2.5-11.0 when dissolved aluminum ions from kaolinite were considered as well as $Na^+$ and $Cl^-$ as index ions. Electrophoretic mobilities (EM) of 0.02 wt. % kaolinite suspension in distilled water and 0.001 M NaCl solution were approximately constant against mobility measuring time consumed in the electrophoresis cell at different pH values, and isoelectric points(IEP) were around pH 4.7. EM values in 0.1 M NaCl solution were positive and constant against mobility measuring time below pH 4; but above pH 4, EM values were negative for the first 10 seconds followed by positive values which became approximately constant through stepped changes after 10 minutes. Hydrated cations may bind to the six- member oxygen ring sites having multiple partial negative charges on the exterior tetrahedral layer surface by both electrostatic and hydrogen bonding force while hydrated anions bind to the partially positively charged hydrogen atoms on the exterior octahedral layer surface. Parts of the aluminol groups on the exterior octahedral layer surface as well as edge faces may be involved in complex reactions and have both anion and cation exchange capacities in the electrolyte solution above pH 4.

• Restorative Dentistry and Endodontics
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• v.33 no.2
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• pp.125-132
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• 2008

The purpose of this study is to compare the shear bond strength of repaired composite resin with different bonding agents and evaluate the effect of bonding agents on composite repair strength. Forty composite specimens (Z-250) were prepared and aged for 1 week by thermo cycling between 5 and $55^{\circ}C$ with a dwell time of 30s. After air abrasion with $50\;{\mu}m$ aluminum oxide, following different bonding agents were applied (n = 10); SB group: Scotchbond multipurpose adhesive (3 step Total-Etch system); XE group: Clearfil SE bond (2 step Self-Etch system); XP group: XP bond (2 step Total-Etch system); XE group: Xeno III (1 step Self-Etch system). After bonding procedure was completed, new composite resin (Z-250) was applied to the mold and cured. For control group. 10 specimens were prepared. Seven days after repair, shear bond strength was measured. Data was statistically analyzed using one-way ANOVA and Tukey's test (p<0.05). The means and standard deviations of shear bond strength (MPa ${\pm}$ S.D.) per group were as follows: SB group: 17.06; SE group: 19.10; XP group: 14.44; XE group: 13.57; Control Group: 19.40. No significant difference found in each group. Within the limit of this study, it was concluded that the different type of bonding system was not affect on the shear bond strength of repaired composite resin.

• Restorative Dentistry and Endodontics
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• v.38 no.1
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• pp.43-47
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• 2013

Objectives: The aim of this study was to determine an appropriate application duration of sodium ascorbate (SA) antioxidant gel in reducing microleakage of bonded composite restoration in intracoronally-bleached teeth. Materials and Methods: Eighty endodontically-treated human incisors were randomly divided into eight groups: control, no bleaching; IB and DB, immediate and delayed bonding after bleaching, respectively; S10m, S60m, S24h, S3d and S7d, bleaching + SA gel for 10 min, 60 min, 24 hr, 3 day and 7 day, respectively. For bleaching, a mixture of 30% hydrogen peroxide and sodium perborate was applied for 7 day. All access cavities were restored using One-Step adhesive (Bisco Inc.) and then Aelite LS Packable composite (Bisco Inc.). The bonded specimens were subjected to 500 thermal cycles, immersed in 1% methylene blue for 8 hr, and longitudinally sectioned. Microleakage was assessed with a 0 - 4 scoring system and analyzed using nonparametric statistical methods (${\alpha}$ = 0.05). Results: Group IB showed a significantly higher microleakage than the control group (p = 0.006) and group DB a statistically similar score to the control group (p > 0.999). Although groups S10m, S60m, and S24h exhibited significantly higher scores than group DB (p < 0.05), the microleakage in groups S3d and S7d was statistically similar to that in group DB (p = 0.771, p > 0.999). Conclusions: Application of SA gel for 3 day after nonvital bleaching was effective in reducing microleakage of composite restoration in intracoronally-bleached teeth.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.11
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• pp.1081-1090
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• 2013

In this paper, a C-band 10 W power amplifier with internally matched input and output matching circuit is designed and fabricated. The used power transistor for the power amplifier is GaAs pHEMT bare-chip. The wire bonding analysis considering the size of the capacitor and the position of transistor pad improves the accurate design. The matching circuit design with the package effect using EM simulation is performed. To reduce the unsymmetry of IMD3 in 2-tone measurement due to the memory effect, the bias circuit minimizing the memory effect is proposed and employed. The measured $P_{1dB}$, power gain, and power added efficiency are 39.8~40.4 dBm, 9.7~10.4 dB, and 33.4~38.0 %, respectively. Adopting the proposed bias circuit, the difference between the upper and lower IMD3 is less than 0.76 dB.

• Macromolecular Research
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• v.14 no.2
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• pp.173-178
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• 2006

Poly(3-(2-hydroxyethyl)thiophene) (P3HET) was synthesized using oxidative coupling polymerization that involved the protecting and deprotecting of hydroxyl groups but not the chlorine substitution or oxidative decomposition of the hydroxyl groups. The resulting P3HET exhibited good solubility in aprotic solvents, in contrast to the insoluble polymer product synthesized directly from the monomer, 3-(2-hydroxyethyl)thiophene (3HET). P3HET had low conductivity due to the strong hydrogen bonding of its hydroxyl groups. The ester-functionalized poly(3-(2-acetoxyethyl)thiophene) and poly(3-(4-pentylbenzoateethyl)thiophene) were also prepared with reasonably high molecular weights in order to examine how this functionalization modified the physical and chemical properties of P3HET. These polymers exhibited better solubility in common solvents and higher conductivity than P3HET. All these polymers exhibited bathochromic shifts of their film state absorption maxima with respect to those found in the UV-visible spectra of their solution phases. The extent of the bathochromic shift was found to vary with the lengths of the side chains of the ester-functionalized polymers.