• Journal of Welding and Joining
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• 제9권4호
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• pp.28-39
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• 1991

The change of microstructure in the bonded interlayer and mechanical properties of the joints were investigated during Transient Liquid Phase Diffusion Bonding(TLP bonding) of STS304/SM17C and STS304/SM45C couples using Ni base amorphous alloys added boron and prepared alloy as insert metal. Main experimental results obtained in this study are as follows: 1) Isothermal solidification process was completed much faster than theoretically expected time, 14ks at 1473K temperature. Its completion times were 3.6ks at 1423K, 2.5ks at 1473K and 1.6ks at 1523K respectively. 2) As the concentration of boron in the insert metal increased, the more borides were precipitated near bonded interlayer and grain boundary of STS304 side during isothermal solidification process, its products were $M_{23}P(C,B)_6}_3)$ The formation of grain boundary during isothermal solidification process was completed at structural carbon steel after starting the solidfication at STS304 stainless steel. 4) The highest value of hardness was obtained at bonded interface of STS304 side. The desirable tensile properties were obtained from STS304/SM17C, STS304/SM45C using MBF50 and experimentally prepared insert metal with low boron concentration.

• 대한소아치과학회지
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• 제45권3호
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• pp.299-306
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• 2018

본 연구의 목적은 산부식 시간과 접착제 적용에 따른 유구치 치면열구전색제의 미세인장 결합강도를 평가하여 비교하는 것이다. 40개의 발거된 건전한 하악 유구치를 선정하여 산부식을 시행하지 않은 군과 산부식을 각각 15, 30, 60초 시행한 군으로 분류하였다. 이를 다시 접착제를 적용하지 않은 군과 적용한 군으로 나누었다. 각 군의 치아에 치면열구 전색제를 도포하여 시편을 제작한 후 미세인장 결합강도를 측정하였다. 산부식을 시행한 15, 30, 60초에 따라 미세인장 결합강도는 유의한 차이가 없었다. 전색제를 적용하기 전에 접착제를 적용한 경우가 산부식만 시행한 경우보다 더 높은 결합강도를 보였으며(p < 0.05), 산부식 시간에 따른 유의한 차이는 없었다. 결론적으로, 유구치의 교합면 법랑질에서 산부식 시간이 15초 이상이면 전색제의 미세인장 결합강도는 유의하게 증가하지 않았으며, 치면열구전색제 도포 전에 접착제를 적용하는 것은 결합강도를 증가시켰다.

• Design & Manufacturing
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• 제13권4호
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• pp.10-16
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• 2019

Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip bonding is applied by a Reflow process or a Thermo-Compression(TC) bonding process. In this paper, we introduce a Laser Assisted Thermo-Compression bonding (LATCB) process to improve the anxiety of the existing process(Reflow, TC bonding). In the LATCB process, the chip is bonded to the substrate by irradiating a laser with a uniform energy density in the same area as the chip to melt only the solder bumps and press the chip with a Transparent Compression Module (TCM). The TCM consists of a fused silica header for penetrating the laser and pressurizing the chip, and a piezoelectric actuator (P.A.) coupled to both ends of the header for micro displacement control of the header. In addition, TCM is a structure that can pressurize the chip and deliver it to the chip and solder bumps without losing the energy of the laser. Fused silica, which is brittle, is vulnerable to deformation, so the header may be damaged when an external force is applied for pressurization or a displacement differenced is caused by piezoelectric actuators at both ends. On the other hand, in order to avoid interference between the header and the adjacent chip when pressing the chip using the TCM, the header has a notch at the bottom, and breakage due to stress concentration of the notch is expected. In this study, the thickness and notch length that the header does not break when the external force (500 N) is applied to both ends of the header are optimized using structural analysis and Coulomb-Mohr failure theory. In addition, the maximum displacement difference of the P.A.s at both ends where no break occurred in the header was derived. As a result, the thickness of the header is 11 mm, and the maximum displacement difference between both ends is 8 um.

• Restorative Dentistry and Endodontics
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• 제23권2호
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• pp.701-709
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• 1998

Many dental composites are Bis-GMA based resin which diluted with the more fluid monomer triethylenglycol dimethacrylate(TEGDMA). TEGDMA is often present in exess so that some quantity remains unreacted following photo-initiated polymerization. TEGDMA is a component of some resin composites which contributes to their cytotoxicity. The presence of dentin between resin composite and pulp space reduce the cytotoxicity in vitro. The root system from extrcted human third molar was removed and then a circular occlusal cavity 4mm in diameter was prepared, leaving a remaining dentinal thickness to the roof of the pulpal chamber within the range 1.0-1.5mm. Dentine was treated with 37% phosphoric acid prior to Z 100 placement without using bonding resin(group 1). In group 2, SMP(Scotchbond Multi Purpose) primer, bonding resin prior to Z 100 placement were applied sequently. In group 3, moulds with internal dimensions 4mm diameter by 2mm depth were used to contain the composite alone with an equvalent mass on tooth model, and then they were immersed directly into water. The purpose of this study is to evaluate the release rate and quantity of TEGDMA with or without the application of bonding resin. Both release rate and total cumulative amount of TEGDMA for the three groups were determined using reversed-phase HPLC at times up to 10 days. The results were as follows: 1. All experimental groups showed the highest rate of release was in the first sample period(0-4.32 min) and the rate of release declined exponentially thereafter. 2. The maximum release rate and total cumulative account of TEGDMA in the tooth model of group 1 and group 2 with the use of SMP bonding resin were reduced however ther were no significant differences between these groups(P>0.05). 3. In the first sample period(0-4.32 min), the rate of release of TEGDMA from composite resin in group 3 immersed directly into water was significantly higher than that in group 1 and group 2 of tooth model(P<0.05). Conclusively, TEGDMA diffusion from Z 100 resin was not effectively prevented by the presence of dentin in spite of using the SMP bonding resin.

• 대한소아치과학회지
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• 제28권2호
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• pp.228-237
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• 2001

본 연구의 목적은 와동 충전시 충전재와 치질 사이에 개재되는 상아질 결합제가, 수복물에서 유리되는 불소가 와동 벽으로 침투하는 과정에 어떠한 영향을 주는지를 조사함이었고, 부가적으로 레진 강화형-글라스 아이오노머 시멘트의 접착에도 상아질 결합제를 도포 하는것이 치질과의 결합력을 강화시킬 수 있는지에 대해 평가하고자 하였다. Fuji II $LC^{(R)}$와 Dyract $AP^{(R)}$를 선정하여 상아질 결합제의 도포 여부에 따른 불소 유리량 측정과 전단 결합 강도를 비교분석하였으며, 치질 내로의 불소 침투 양상은 교환 시기에 있는 제2유구치에 Fuji II $LC^{(R)}$와 Dyract $AP^{(R)}$를 충전하고 3주내에 발거하여 EPMA로 분석하였다. 상아질 결합제는 불소 유리량을 현저하게 감소시키는 것으로 나타났으며(p<0.05) Fuji II $LC^{(R)}$의 경우 상아질 결합제의 도포가 결합강도를 증가시키지 못하였다. EPMA 분석결과 상아질 결합제는 충전재로부터 유리되어 나오는 불소가 치질 내로 확산되는 것을 방해하는 것으로 확인되었다.

• 대한소아치과학회지
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• 제33권3호
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• pp.422-428
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• 2006

상아질 접착제는 많은 발전을 거듭하여 적용 단계가 단순화되고 짧아져서 어린이에게 사용하기에 더욱 편리해졌다. 본 연구에서는 최근 개발된 7세대 결합제인 $i-bond^{TM}$(Kulzer, Germany)의 미세누출을 기존에 사용되는 다른 결합제와 비교하여 그 효용성을 평가하기 위함이다. 40개의 교정적 목적으로 발거된 건전한 소구치의 협면과 설면에 5급 와동을 형성하고 무작위로 4개의 군으로 나누었다. 1군은 4세대인 Scotchbond $Multi-Purpose^{(R)}$(3M, USA), 2군은 5세대 Clearfil SE Bond(Kuraray, Japan), 3군은 6세대 AQ Bond(Sun medical, Japan), 4군은 7세대 $i-bond^{TM}$(Kulzer, Germany)를 적용하고 복합레진 Z100(3M, USA)으로 충전하였다. 시편을 $5^{\circ}C$와 $55^{\circ}C$에 각 30초간 계류시켜 1,000회 열순환하고 2% methylene blue 용액에 24시간 넣어 염료를 침투시킨 뒤, 저속 diamond cutter($Isomet^{TM}$, Buehler, USA)를 이용하여 주수하에 치아를 협설로 절단하였다. 색소의 침투 정도를 입체현미경을 이용하여 침투깊이를 0에서 3점으로 채점하여 측정한 뒤 미세누출 정도를 비교하였다. 결과적으로 7세대 결합제의 미세누출 평균값이 다른 결합제보다 높게 나왔으며, 특히 4세대 결합제와는 통계적으로 유의한 차이가 있었다.

• 한국염색가공학회지
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• 제1권1호
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• pp.19-25
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• 1989

In past, dye diffusion and dyeing rate in fibers have been emphasized in dyeing phenomena. However, in the light of the properties of colloids in the surface of disperse phase and dispersion, there exist specific characters such as adsorption or electric double layer, which seems to play important roles in determining the physiochemical properties in the dyeing system. Electrostatic bonding, hydrogen bonding and Van der Waals adsorption are common in dyeing as well as covalent bonding. Particularly, electrostatic bonding is premised on the existance of ionic radicals in fibers. The present study was aimed to clarify the electrokinetic phenomena of dyeing through the role of electric double layer by ion in amphoteric fibers with different ionic effects under different pH. Spectrophotometric analysis method was used to compare dyeing condition of surface, which can be detected by electrokinetic phenomena and the inner of fibers after deceleration of dyed fibers. Nylon and wool, the typical amphoteric fibers were dyed with monoazo acid dyes such as C.I. Acid Orange 20, and C.I. Acid Orange 10. Various combinations were prepared by combining pH, temperature and dye concentration, in order to generate streaming electric potential which were measured by microvolt meter and specific conductivity meter. The results were transformed to zeta potential by Helmholtz-Smoluchowski formular and to surface electric charge density by Suzawa formular, surface dye amount, and effective surface area of fibers. The amount of dyes of inner fibers were also measured by the Lambert-Beer’s law. The main results obtained are as follows. 1. By measuring zeta pontential, it was possible to detect the dyeing mechanism, surface charge density, surface dye amount and effective surface area concerning dye adsorption of the amphoteric fibers. 2. Zeta pontential increases in negative at low pH and high dye concentration in the process of dyeing. This implied that there existed ionic bond formation in the dyeing mechanism between acid dyes and amphoteric fibers. 3. Dibasic acid dye had little changing rate in zeta potential due to the difference in solubility of dye and in number of dissociated ions per dye molecule to bond with amino radicals of amphoteric fibers. The dye adsorption of mono basic acid dye was higher than that of dibasic acid dye. 4. The effective surface areas concerning dyeing were $6.3E+05\;cm^2/g$ in nylon, $1.6E+07\;cm^2/g$ in wool fiber being higher order of wool then nylon.

• 대한소아치과학회지
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• 제26권4호
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• pp.595-607
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• 1999

본 연구의 목적은 최근 술식을 간소화 시켜 개발된 여러 가지 자가 부식 프라이머를 이용하여 유치에서의 상아질과 레진 간의 결합력을 측정하고, 그 결합의 양상을 주사 전자 현미경을 이용해 분석하기 위함이었다. 실험 재료로는 자가-부식 프라이머를 이용한 새로운 결합제인 Mac-bond $II^{(R)}$(Tokuso Co. Japan.)와 Clearfil Liner-bond $II^{(R)}$(Curaray Co. Japan.)가 각각 I군과 II군으로 사용되었고, 대조군으로 사용된 III군에 Scotchbond Multipurpose System(3M Co. U.S.A)이 사용되었다. 치관이 건전한 유구치 45개를 근원심으로 절단하여 레진에 매몰하고 상아질을 노출시켰다. 90개의 시편을 30개씩 3개의 군으로 나누고, 상아질 표면을 3가지 상아질 결합제를 이용하여 각 제조자의 지침에 따라 처리하여 실험 시편을 제작하였다. 각 군당 20개의 시편은 전단 강도를 측정한 후 그 파절면을 실체 현미경 하에서 관찰하였고, 각 군당 10개의 시편은 주사전자 현미경관찰을 위해 사용하였다. 전단강도 측정결과 III군, I군, II군의 순서로 높은 강도를 보였으며, III군과 II군, I군과 II군 사이에서 유의차를 보였으나(p<0.05), I군과 III군과의 사이에서는 유의차를 보이지 않았다(p>0.05). 실체 현미경 관찰 결과에서는 I군에서는 60%의 상아질내 파절과 40%의 계면 파절 양상을 보였고, II군에서는 20%의 상아질내 파절과 80%의 계면 파절 양상을 나타냈으며, III군의 경우 75%의 상아질내 파절과 25%의 계면 파절 양상을 나타내었다. 주사전자현미경 관찰 결과, 모든 군에서 $100-200{\mu}m$정도의 긴 resin tag양상을 보였으며, I군에서는 거의 균일한 긴 resin tag의 양상을 보인것에 반해 II군에서는 부분적으로 짧은 resin tag의 양상을 나타냈으며, III군의 경우 긴 resin tag뿐만 아니라 특징적인 측방 분지의 양상을 나타냈다.

• Restorative Dentistry and Endodontics
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• 제16권1호
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• pp.60-73
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• 1991

The purpose of this study is to evaluate the effects of etching time, environmental temperature and humidity on the adhesion of composite resin to glass-ionomer cement. Two chemical cure composite resins (Clearfil F II and Microrest AP) and two glass-ionomer cements (Fuji ionomer Type I and KET AC-CEM) were used as the experimental materials. The experiment is performed in 3 stages: The first stage is to bond composite resins to glass-ionomer cements, and the surface was not etched, and etched for 20 seconds, 40 seconds, and 60 seconds. Then specimens are stored in distilled water at $37^{\circ}C$ for 24 hours to measure tensile strength. The second stage is to choose the one group that had the highest tensile strength from the first stage and prepare two experimental groups: One group with composite resin bonded to glass-ionomer cement without etching and bonding agent application and the other with composite resin bonded to glass-ionomer cement with etching but without any bonding agent application. The specimens are stored in distilled water at $37^{\circ}C$ for 24 hours and tensile strength is measured. The third stage is to choose group that had the highest tensile strength from the first stage experiment, and bond composite resin to glass-ionomer cement at $24^{\circ}C$ 44%, $30^{\circ}C$ 44%, $30^{\circ}C$ 80%, and $32^{\circ}C$ 92%. The storage time of specimens is to bond immediately after storage, then changed to 30 sec., 60 sec., and 120 sec.. Specimens are stored in distilled water at $37^{\circ}C$ for 24 hours and their tensile strength are measured again. The following results were obtained: 1. As the etching time increases, the tensile bond strength between glass-ionomer cement and composite resin increase, and the tensile bond strength is the highest when acid etched for 60 minutes (P < 0.05). 2. After acid etching for 60 minutes, the tensile strength of the group with bonding agent was stronger than that without bonding agent application (P < 0.05). 3. The tensile strength of Clearfil F II was stronger than that of Microrest AP. 4. It was observed that the tensile bond strength is not affected by different storage time with different temperature and humidity. 5. As the humidity was increased, the tensile bond strength between glass-ionomer cement and composite resin decreased (P < 0.05).

• 한국자기학회지
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• 제1권1호
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• pp.6-11
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• 1991

희토류금속과 천이금속의 화합물인 희토류 영구자석의 전기적, 자기적 성질등을 이해하고 자우리는 $SmCo_{5},\;NdB_{6},\;NdFe_{5},\;NdFe_{4}B$등의 비교적 간단한 희토류 화합물에 대한 자체충족적 전자구조 이론연구를 시도하였다. 국재 밀도함수 근사 LMTO(Linearized Muffin Tin Orbital)밴드 방법을 이용하여 $SmCo_{5}$ 영구자석을 포함한 희토류 금속 화학물의 기저상태의 물리적 파라미터들, 즉 에너지 밴드, 상태밀도, Stoner상수, 자기 모멘트 등을 구하여 이들의 전자기적 물성을 고찰하였다. Nd, Sm등의 희토류원소와 Fe, Co등의 천이원소, 또한 boron등의 원소들이 서로 금속 화합물을 형성할 때 일어나는 bonding효과, 즉 희토류금속의 f-전자와 d-전자, 천이금속의 d-전자, 또한 boron 금속의 s,p-전자와의 상호 작용, 그에 따른 전자구조, 자성의 변화에 대한 연구를 수행하였다.