• Title/Summary/Keyword: Oxynitride glass

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Effect of Additive Composition on Fracture Toughness of In Situ-Toughened SiC−Si3N4 Composites

  • Lee, Young-Il;Kim, Young-Wook
    • Journal of the Korean Ceramic Society
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    • v.44 no.4 s.299
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    • pp.189-193
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    • 2007
  • Effect of additive composition on fracture toughness of in situ-toughened $SiC-Si_3N_4$ composites was investigated for five different additive compositions. The highest toughness $(6.4MPa{\cdot}m^{1/2})\;in\;SiC-Si_3N_4$ composites investigated herein was obtained when an Y-Mg-Si-Al-O-N oxynitride glass was used as a sintering additive. The improvement in fracture toughness was produced by enhanced bridging and deflection by $Si_3N_4$ grains.

Nanostructured Bulk Ceramics (Part I)

  • Han, Young-Hwan;Mukherjee, Amiya K.
    • Journal of the Korean Ceramic Society
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    • v.46 no.3
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    • pp.225-228
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    • 2009
  • The processing and characterization of ceramic nanocomposites, which produce bulk nanostructures with attractive mechanical properties, have been emphasized and introduced at Prof. Mukherjee's Lab at UC Davis. The following subjects will be introduced in detail in Part II, III, and IV. In Part II, the paper will describe a three-phase alumina-based nanoceramic composite demonstrating superplasticity at a surprisingly lower temperature and higher strain rate. The next part will show that an alumina-carbon nanotube-niobium nanocomposite produced fracture toughness values that are three times higher than that of pure nanocrystalline alumina. It was possible to take advantage of both fiber-toughening and ductile-metal toughening in this investigation. In the fourth section, discussed will be a silicon-nitride/silicon-carbide nanocomposite, produced by pyrolysis of liquid polymer precursors, demonstrating one of the lowest creep rates reported so far in ceramics at the comparable temperature of $1400^{\circ}C$. This was first achieved by avoiding the oxynitride glass phase at the intergrain boundaries. One important factor in the processing of these nanocomposites was the use of the electrical field assisted sintering method. This allowed the sintering to be completed at significantly lower temperatures and during much shorter times. These improvements in mechanical properties will be discussed in the context of the results from the microstructural investigations.

Cutting Performance of Si$_3$N$_4$ Based SiC Ceramic Cutting Tools

  • Kwon, Won-Tae;Kim, Young-Wook
    • Journal of Mechanical Science and Technology
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    • v.18 no.3
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    • pp.388-394
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    • 2004
  • Composites of Si$_3$N$_4$-SiC containing up to 30 wt% of dispersed SiC particles were fabricated via hot-pressing with an oxynitride glass. To determine the effect of sintering time and SiC content on the mechanical properties and the cutting performance, the composites with fixed 8hr-sintering time and 20 wt% SiC content were fabricated and tested. Fracture toughness of the composites increased with increasing sintering time, while the hardness increased as the SiC content increased up to 20 wt%. The hardness of the composites was relatively independent of the grain size and the sintered density. For machining heat-treated AISI4140, the insert with 20 wt% SiC sintered for 8hr showed the longest tool life while the insert with 20 wt% SiC sintered for 12hr showed the longest tool life for machining gray cast iron. An effort was made to relate the mechanical properties, such as hardness, fracture toughness and wear resistance coefficient with the tool life. However, no apparent relationship was found between them. It may be stated that tool life is affected by not only the mechanical properties but also other properties such as surface roughness, density, grian size and the number of the inherent defects in the inserts.

Optimization of the Sintering Time and Composition for SiC-$Si_3 N_4$ Ceramic Tool (SiC-$Si_3 N_4$ 세라믹공구를 위한 소결시간과 조성변화의 최적화)

  • 김경재;박준석;이성구;권원태;김영욱
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.10 no.6
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    • pp.78-84
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    • 2001
  • In the present study, SiCSi-$Si_3 N_4$-SiC ceramic composites that contained up to 30 wt% of dispersed SiC particles were fabricat-ed cia hot-pressing with an oxynitride glass. The microstructure, the mechanical properties and the cutting performance of resulting ceramic composites were investigated. By fixing the composition as $Si_3 N_4$-20wf%SiC, the effect of sintering time on the microstructure, the mechanical properties and the cutting performance were also investigated. The longer sir-tering time is, the bigger the grain size of SiC is. The fracture toughness(-$K_k$) of the $Si_3 N_4$-SiC ceramic composites increased with the increase of gain size, while the flexural strengthh($\sigma$) decreased. For machining SCM440, the insert with 20wt%r SiC sintered for 8 hours showed the longest tool life while the insert with 20wt% SiC sintered for 12 hours showed the longest tool life for machining gray cast iron.

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Electrical characteristics of poly-Si NVM by using the MIC as the active layer

  • Cho, Jae-Hyun;Nguyen, Thanh Nga;Jung, Sung-Wook;Yi, Jun-Sin
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.151-151
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    • 2010
  • In this paper, the electrically properties of nonvolatile memory (NVM) using multi-stacks gate insulators of oxide-nitride-oxynitride (ONOn) and active layer of the low temperature polycrystalline silicon (LTPS) were investigated. From hydrogenated amorphous silicon (a-Si:H), the LTPS thin films with high crystalline fraction of 96% and low surface's roughness of 1.28 nm were fabricated by the metal induced crystallization (MIC) with annealing conditions of $650^{\circ}C$ for 5 hours on glass substrates. The LTPS thin film transistor (TFT) or the NVM obtains a field effect mobility of ($\mu_{FE}$) $10\;cm^2/V{\cdot}s$, threshold voltage ($V_{TH}$) of -3.5V. The results demonstrated that the NVM has a memory window of 1.6 V with a programming and erasing (P/E) voltage of -14 V and 14 V in 1 ms. Moreover, retention properties of the memory was determined exceed 80% after 10 years. Therefore, the LTPS fabricated by the MIC became a potential material for NVM application which employed for the system integration of the panel display.

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