• Proceedings of the KIEE Conference
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• 2005.11a
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• pp.191-193
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• 2005

This study has investigated the effects of the etching method of a Ti substrate for a metal oxide electrode on the electrochemical characteristics of the electrode. The HCl etching develops a fine and homogeneous roughness on the Ti substrate. Fabrication and material properties of the catalytic oxide electrode, which is known to be so effective to destruct refractory organics in aqueous waste, were studied. A method to enhance the fabrication reproducibility of the oxide electrode was tested for Ru, Zr, Sn oxide on the Ti substrate using SEM, XRD, Cyclic voltammetry.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.79-79
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• 1999

The varous techniques for fabrication of si or metal tip as a field emission electron source have been reported due to great potential capabilities of flat panel display application. In this report, 240nm thermal oxide was initially grown at the p-type (100) (5-25 ohm-cm) 4 inch Si wafer and 310nm Si3N4 thin layer was deposited using low pressure chemical vapor deposition technique(LPCVD). The 2 micron size dot array was photolithographically patterned. The KOH anisotropic etching of the silicon substrate was utilized to provide V-groove formation. After formation of the V-groove shape, dry oxidation at 100$0^{\circ}C$ for 600 minutes was followed. In this procedure, the orientation dependent oxide growth was performed to have a etch-mask for dry etching. The thicknesses of the grown oxides on the (111) surface and on the (100) etch stop surface were found to be ~330nm and ~90nm, respectively. The reactive ion etching by 100 watt, 9 mtorr, 40 sccm Cl2 feed gas using inductively coupled plasma (ICP) system was performed in order to etch ~90nm SiO layer on the bottom of the etch stop and to etch the Si layer on the bottom. The 300 watt RF power was connected to the substrate in order to supply ~(-500)eV. The negative ion energy would enhance the directional anisotropic etching of the Cl2 RIE. After etching, remaining thickness of the oxide on the (111) was measured to be ~130nm by scanning electron microscopy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.340-343
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• 2000

ITO(Indium Tin Oxide) films for transparent electrodes of FPD(Flat Panel Display) were patterned in atmosphere using laser. A pulse type(repetition rate of 10 Hz) Q-switched Nd:YAG laser which can generate the fundamental wavelength at 1064 nm or its harmonics(532, 266 nm) was used for Patterning of the ITO film. In case of using the second harmonic(532 nm) of Nd:YAG laser, the ITO film(thickness of 20 nm) was removed clearly with a laser fluence of 5.2 J/$\textrm{cm}^2$ and a beam scan speed of 200${\mu}{\textrm}{m}$/s. But the glass substrate was damaged when the laser fluence was over 5.2 J/$\textrm{cm}^2$. We discussed the etching mechanism of the ITO film using Nd:YAG laser with observation of the etching characteristics including a depths and widths of ITO films as a function of laser fluence using SEM(Scanning Electron Microscopy) and surface profiler($\alpha$-step 500).

• Journal of the Korean Electrochemical Society
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• v.11 no.2
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• pp.95-99
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• 2008

This study has made the electrode that is coated zirconium oxide on the titanium by ESD(Electrostatic spray deposition) coating methode. It has investigated the effects of the etching method of a Ti substrate as the preparation, making of zirconium oxide film and electrochemical characteristics of the electrode that is etched on the titanium. The HCl etching develops a fine and homogeneous roughness on the Ti substrate. Fabrication and material properties of the metal oxide electrode, which is known to be so effective to generate ozone and hypochlorous acid (HOCl) as power oxidant, were studied. A proper metal oxide material is focus zirconium oxide through reference. A coating method to enhance the fabrication reproducibility of the zirconium oxide electrode was used ESD coating method by zirconium oxychloride. Zirconium oxide films on the Ti substrate were tested using SEM, XRD, Cyclic voltammetry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.338-339
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• 2005

The wider surface of the aluminum foil, electrochemically very important and it is necessary to increase the surface area. A study has been made of the fabrication condition for etching cube texture of high purity aluminium foil and of electrochemical etching of the aluminium foil. In the present work, it is shown there exists a relation between the influence of the pre-treatment time in the NaOH & HCI solution and $H_2SO_4$ concentration in the conversion solution. Also effect of temperature during AC etching was also studied. Result of the etched aluminum film is shown in the typical SEM images. Its electrochemical characteristics were investigated by cyclic voltammetry. And effects of current density and frequency is also reported. Cyclic voltammogram showed that the protective oxide film was formedon the inner surfaces of etch pit. the frequency influence resistance of oxide film in AC etching.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.65-66
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• 2005

Etching characteristics of $Ge_2Sb_2Te_5$ (GST) films were investigated using $Cl_2$/Ar inductively coupled plasma.We examined the etching characteristics such as etching rate and selectivity over oxide films of GST films using inductively coupled plasma (ICP) with various etching parameters such as $Cl_2$/Ar gas mixing ratios, ICP source power, pressure, and bias power. The maximum etch rate of GST film was $2,815{\AA}$/min and the selectivity higher than 12:1 over the oxide films was also obtained at the $Cl_2$ flow rates of 40 sccm.

• Journal of the Korean Vacuum Society
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• v.1 no.1
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• pp.37-42
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• 1992

Abstract-The ECR(E1ectron Cyclotron Resonance) plasma etcher was developed for process of manufacturing 16M164' DRAM and applied to poly-Si etching process. The etching rate and selectivity of poly-Si were investigated by changing the process factor of pressure gas and microwave power. The increasing power of microwave will have the trend of increasing the etching rate and selectivity of Oxide, and have suitable value process pressure at 6 mTorr. The increasing value of process gas SFdSF6+ Clz will cause the decrease of etching rate and selectivity, this is because the best process factor is not found.

• Journal of Electrochemical Science and Technology
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• v.11 no.1
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• pp.60-67
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• 2020

In this study, copper (II) oxide powder for electroplating was prepared by recovering CuCl₂ from NaClO₃ type etching wastes via recovered non-sintering two step chemical reaction. In case of alkali copper carbonate [mCuCo₃·nCu(OH)₂], first reaction product, CuCo₃ is produced more than Cu(OH)₂ when the reaction molar ratio of sodium carbonate is low, since m is larger than n. As the reaction molar ratio of sodium carbonate increased, m is larger than n and Cu(OH)₂ was produced more than CuCO₃. In the case of m has same values as n, the optimum reaction mole ratio was 1.44 at the reaction temperature of 80℃ based on the theoretical copper content of 57.5 wt. %. The optimum amount of sodium hydroxide was 120 g at 80℃ for production of copper (II) oxide prepared by using basic copper carbonate product of first reaction. At this time, the yield of copper (II) oxide was 96.6 wt.%. Also, the chloride ion concentration was 9.7 mg/L. The properties of produced copper (II) oxide such as mean particle size, dissolution time for sulfuric acid, and repose angle were 19.5 mm, 64 second, and 34.8°, respectively. As a result of the hole filling test, it was found that the copper oxide (II) prepared with 120 g of sodium hydroxide, the optimum amount of basic hydroxide for copper carbonate, has a hole filling of 11.0 mm, which satisfies the general hole filling management range of 15 mm or less.

• Journal of Welding and Joining
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• v.20 no.4
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• pp.498-504
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• 2002

Fluxless flip chip bonding process using plasma treatment instead of flux was investigated. The effect of plasma process parameters on tin-oxide etching characteristics were estimated with Auger depth profile analysis. The die shear test was performed to evaluate the adhesion strength of the flip chip bonded after plasma treatment. The thickness of oxide layer on tin surface was reduced after Ar+H2 plasma treatment. The addition of H2 improved the oxide etching characteristics by plasma. The die shear strength of the plasma-treated Sn-Pb solder flip chip was higher than that of non-treated one but lower than that of fluxed one. The difference of the strength between plasma-treated specimen and non-treated one increased with increase in bonding temperature. The plasma-treated flip chip fractured at solder/TSM interface at low bonding temperature while the fracture occurred at solder/UBM interface at higher bonding temperature.

• Applied Chemistry for Engineering
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• v.22 no.5
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• pp.514-517
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• 2011

Herein, we fabricated magnesium oxalate nanostructures by chemical etching of a magnesium foil in alcoholic solvents containing acidic media. Interestingly, we could obtain magnesium oxalate nanowires in ethanolic oxalic acid. Growth mechanism for magnesium oxalate nanowires was investigated in terms of etching time. Annealing conditions were determined from TGA results. Magnesium oxalate nanowires were converted to magnesium oxide nanowires by thermal treatment and the magnesium oxide nanowires were examined by FE-SEM and FT-IR measurement.