• Korean Journal of Veterinary Research
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• v.49 no.4
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• pp.345-349
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• 2009

Polychlorinated biphenyls (PCBs) are synthetic organic compounds with two benzene rings and well known environmental pollutants. This study examined the effect of persistent exposure to 2,$3^{\prime}$,4,$4^{\prime}$,5-pentachlorobiphenyl (PCB118) on the proinflammatory and proapoptotic factors in male rats. Male Sprague Dawley rats were administered weekly intraperitoneal injections of either PCB118 (20 mg/kg) dissolved in corn oil or corn oil alone. One week after 2 and 5 administrations, the rats were sacrificed by a pentobarbital injection. The effect of PCB118 on the expression of cyclooxygenase 2 (COX-2), cytosolic phospholipase A2 (cPLA2), peroxisome proliferator-activated receptor gamma, Bcl and Bcl-2-associated X protein (BAX) was investigated. The level of COX-2 and cPLA2 expression was higher in the PCB118-treated rats than the control. These results suggest that PCB118 has a proinflammatory effect in rats.

• Journal of Environmental Science International
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• v.13 no.8
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• pp.739-746
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• 2004

Concentrations of PCBs in the sediment of the Kumho River was determined. Samples were collected at 23 locations along the river. Total PCB levels ranged from 2.7 to 87.6 ng/g dry weight. The site near the Keomdan factory district had the highest concentrations. The levels of PCB congeners significantly correlated with the total organic carbons in the sediment. The major fractions of PCBs were congeners containing 4, 5, or 6 chlorine atoms per biphenyl molecule.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.25-29
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• 2014

Plasma organic thin film for PCB surface finish is a potential replacement of the conventional PCB finishes because of environment-friendly process, high corrosion-resistance and long shelf life over 1 year. In this study, solder joint properties of the plasma organic surface finish were estimated and compared with OSP surface finish. The plasma surface finish was deposited by chemical vapor deposition from fluorine-based precursors. The thickness of the plasma organic coating was 20 nm. Sn-3.0Ag-0.5Cu (SAC305) solder was used as solder joint materials. From a salt spray test, the plasma organic coating had higher corrosion resistance than the OSP surface finish. The spreadability of SAC305 on plasma organic coating was higher than that on OSP surface finish. SEM and TEM micrographs showed that the interfacial microstructure of the plasma surface finish sample were similar to that of the OSP sample. Solder joint strength of the plasma finish sample was also similar to that of the OSP finished sample.

• Analytical Science and Technology
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• v.25 no.6
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• pp.421-428
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• 2012

In this study, PCDD/PCDFs, PAHs and PCBs in wastes from metal, plastic and wastewater treatment facilities were analyzed. The concentrations of PCDD/PCDFs ranged from 7.37~432.20 ng-TEQ/kg in fly ash, 0.51~855.01 ng-TEQ/kg in incinerated ash and 0.37~385.81 ng-TEQ/kg in dust. Dioxin content was lower, compared to data in foreign countries. PAHs concentration was in the range of 0.0075~2.9225 mg/kg for process sludge and 0.0035~1.6716 mg/kg for wastewater sludge, which satisfied all of the two standards (Nap, Ant, B(a)F:4/0.8, Phen, B(a)A:5/1, Flt:10/2.5, B(a)P:4.5/0.9) of the Marine Environment Management Act. PAHs concentration in process sludge and wastewater sludge were slightly lower than those abroad. According to the analysis of seven types of PCBs (in comparison with the first standard, 0.15 mg/kg), concentration was found in the range of 0.0~0.65 mg/kg, while PCB-52, PCB-101, PCB-138, PCB-153 and PCB-180 isomers were detected in excessive value in some machine oil and hydraulic fluid.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.81-88
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• 2010

Thermal annealing and electromigration test were performed at $150^{\circ}C$ and $4{\times}10^3\;A/cm^2$ conditions in order to investigate the effect of PCB surface finishs on the growth kinetics of intermetallic compound (IMC) in Sn-3.0Ag-0.5Cu solder bump. The surface finishes of the electrodes of printed circuit board (PCB) were organic solderability preservation (OSP), immersion Sn, and electroless Ni/immersion gold (ENIG). During thermal annealing, the OSP and immersion Sn show similar IMC growth velocity, while ENIG surface finish had much slower IMC growth velocity. Applying electric current accelerated IMC growth velocity and showed polarity effect due to directional electron flow.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.47-54
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• 2021

For the bonding of smaller PCB solder bumps of less than 100 microns, an experiment was performed to make up a tin plating solution and find plating conditions in order to produce a bump pattern through tin electroplating, replacing the previous PCB solder bumps process by microballs. After SR patterning, a Cu seed layer was formed, and then, through DFR patterning, a pattern in which Sn can be selectively plated only within the SR pattern was formed on the PCB substrate. The tin plating solution was made based on methanesulfonic acid, and hydroquinone was used as an antioxidant to prevent oxidation of divalent tin ions. Triton X-100 was used as a surfactant, and gelatin was used as a grain refiner. By measuring the electrochemical polarization curve, the characteristics of organic additives in Triton X-100 and gelatin were compared. It was confirmed that the addition of Triton X-100 suppressed hydrogen generation up to -1 V vs. NHE, whereas gelatin inhibited hydrogen generation up to -0.7 V vs. NHE. As the current density increased, there was a general tendency that the grain size became finer, and it was observed that it became finer when gelatin was added.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.49-54
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• 2022

The copper plating process used to fabricate the submicron damascene pattern of Cu wiring for Si wafer was applied to the plating of a PCB pattern of several tens of microns in size using the same organic additives and current density conditions. In this case, the non-uniformity of the plating thickness inside the pattern was observed. In order to quantitatively analyze the cause, a numerical calculation considering the solution flow and electric field was carried out. The calculation confirmed that the depletion of Cu²⁺ ions in the solution occurred relatively earlier at the bottom corner than the upper part of the pattern due to the plating of the sidewall and the bottom at the corner of the pattern bottom. The diffusion coefficient of Cu²⁺ ions is 2.65 10^-10 m²/s, which means that Cu²⁺ ions move at 16.3 ㎛ per second on average. In the cases of small damascene patterns, the velocity of Cu²⁺ ions is high enough to supply sufficient ions to the inside of the patterns, while sufficient time is required to replenish the exhausted copper ions in the case of a PCB pattern having a size of several tens of microns. Therefore, it is found that the thickness uniformity can be improved by reducing the current density to supply sufficient copper ions to the target area.

• Resources Recycling
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• v.22 no.2
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• pp.71-77
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• 2013

Electronic products such as appliances, computers, and cellular phones have printed circuit boards (PCBs) in common and the PCBs in the waste electronic products contain valuable metals and organic resins. In Korea, recovery and recycling of the organic resins as well as the valuable metallics from the wastes are required indeed as the most of resources are being imported from abroad. In this article, the patents and papers for the recycling of organic residues from the waste PCBs were collected and analyzed. The open patents of USA (US), European Union (EP), Japan (JP), and Korea (KR) and SCI journals from 1979 to 2012 were investigated. The patents and journals were collected using key-words and filtered by the definition of the technology. The patents and journals were analyzed by the years, countries, companies, and technologies and the technical trends were discussed in this paper. It is showed sluggish relatively activity of published papers and patent applications for polymer manufacturing technology in local and abroad.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.15-19
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• 2015

We demonstrated an inspection system for detecting discoloration of PCB Cu ball pad with an OSP surface finish. Though the OSP surface finish has many advantages such as eco-friendly and low cost, however, it often shows a discoloration phenomenon due to a heating process. In this study, the discoloration was analyzed with device-independent CIELAB color space. First of all, the PCB samples were inspected with standard lamps and CCD camera. The measured data was processed with Labview program for detecting discoloration of Cu ball pad. From the original PCB sample image, the localized Cu ball pad image was selected to reduce the image size by the binarization and edge detection processes and it was also converted to device-independent CIELAB color space using $3{\times}3$ conversion matrix. Both acquisition time and false acceptance rate were significantly reduced with this proposed inspection system. In addition, $L^*$ and $b^*$ values of CIELAB color space were suitable for inspection of discoloration of Cu ball pad.

• Clean Technology
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• v.11 no.1
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• pp.29-39
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• 2005

Polychlorinated biphenyls, (PCBs) are a group of highly toxic chlorinated industrial chemicals used as dielectrics, coolants and lubricants in electrical transformers. This article reviewed the state-of-the-art on technologies for decomposition of Polychlorinated biphenyls (PCBs), one of the persistent organic materials (POPs). The purpose of this study was to evaluate the feasibility of decontaminating PCBs contaminated pollutants using treatment technologies such as chemical dechlorination, photodegradation and biological transformation.