• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.5
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• pp.40-46
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• 2017

A plasma gas control apparatus for semiconductor plasma etching processes securely holds a cathode for forming a plasma, confines the plasma during the plasma etching process, and discharges gas after etching. It is a key part of the etching process. With the advancement of semiconductor technology, there is increasing interest in parts for semiconductor manufacturing that directly affect wafers. Accordingly, in order to replace the plasma gas control device with a CVD-SiC material superior in mechanical properties to existing SiCs (Sintered-SiC, RB-SiC), a study on the grinding characteristics of CVD-SiC was carried out. It is confirmed that the optimal grinding condition was obtained when the result table feed rate was 2 m/min and the infeed depth was $5{\mu}m$.

• 대한공업교육학회지
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• v.31 no.2
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• pp.350-363
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• 2006

Recently, the micro end-milling processing is demanded the high-precise technique with good surface roughness and rapid time in milli-structure parts, micro machine parts and molding industry. The cutting conditions of micro end-milling has an effect on surface roughness of cutting surface. Therefore this study was carried out to cut stainless steel using high revolution air bearing spindle and micro end-mill and analyze the cutting condition to get the optimum surface roughness by design of experiment. From this study, surface roughness have an much effect according to priority on depth of cut, revolution of spindle and feed.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.21 no.1
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• pp.35-42
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• 2008

In the nuclear power plant, early detection of fatigue crack by non-destructive test (NDT) equipment due to the thermal cyclic load is very important in terms of strict safety regulation. To this end, many efforts are exerted to the fabrication of artificial cracked specimen for practicing engineers in the NDT company. The crack of this kind, however, cannot be made by conventional machining, but should be made under thermal cyclic load that is close to the in-situ condition, which takes tremendous time due to the repetition. In this study, thermal loading condition is investigated to minimize the time for fabricating the cracked specimen using simulation technique which predicts the crack initiation and propagation behavior. Simulation and experiment are conducted under an initial assumed condition for validation purpose. A number of simulations are conducted next under a variety of heating and cooling conditions, from which the best solution to achieve minimum time for crack with wanted size is found. In the simulation, general purpose software ANSYS is used for the stress analysis, MATLAB is used to compute crack initiation life, and ZENCRACK, which is special purpose software for crack growth prediction, is used to compute crack propagation life. As a result of the study, the time for the crack to reach the size of 1mm is predicted from the 418 hours at the initial condition to the 319 hours at the optimum condition, which is about 24% reduction.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.1
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• pp.18-26
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• 2001

In this paper, the resonant characteristics and modes of the film bulk acoustic wave resonator (FBAR) used in 1~2 GHz frequency region are analyzed by it's input impedance which was calculated by three dimensional finite element method formulated as eigenvalue problem using electro-mechanical wave equation and boundary condition. It was extracted that the resonant and the spurious characteristics considering the effects of electrode area and shape variation and unsymmetry of upper and lower electrode. Those effects couldn't be analyzed by on dimensional analysis, e.g. Mason equivalent model. The simulation result was confirmed by comparing with the simulation data from Mason model analysis and the measured data of the ZnO FBAR fabricated using micro-machining technique. Also, through the simulation of the area variations of FBAR, it was obtained that the optimum ratio of length and thickness is 20:1 and the minimum ratio is 5:1 to operate thickness vibration mode.