• Polymer(Korea)
• /
• v.39 no.2
• /
• pp.225-234
• /
• 2015

In this study, we proposed to synthesize thermally stable, soluble and conjugated Schiff base polymer (SbP). For this reason, a specific molecule namely 4,4'-thiodiphenol which has sulfur and oxygen bridge in its structure was used to synthesize bi-functional monomers. Bi-functional amino and carbonyl monomers namely 4,4'-[thio-bis(4,1-phenyleneoxy)] dianiline (DIA) and 4,4'-[thiobis(4,1-phenyleneoxy)]dibenzaldehyde (DIB) were prepared from the elimination reaction of 4,4'-thiodiphenol with 4-iodonitrobenzene and 4-iodobenzaldehyde, respectively. The structures of products were confirmed by elemental analysis, FTIR, $^1H$ NMR and $^{13}C$ NMR techniques. The molecular weight distribution parameters of SbP were determined by size exclusion chromatography (SEC). The synthesized SbP was characterized by solubility tests, TG-DTA and DSC. Also, conductivity values of SbP and SbP-iodine complex were determined from their solid conductivity measurements. The conductivity measurements of doped and undoped SbP were carried out by Keithley 2400 electrometer at room temperature and atmospheric pressure, which were calculated via four-point probe technique. When iodine was used as a doping agent, the conductivity of SbP was observed to be increased. Optical band gap ($E_g$) of SbP was also calculated by using UV-Vis spectroscopy. It should be stressed that SbP was a semiconductor which had a potential in electronic and optoelectronic applications, with fairly low band gap. SbP was found to be thermally stable up to $300^{\circ}C$. The char of SbP was observed 29.86% at $1000^{\circ}C$.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.323-323
• /
• 2013

High power light-emitting diodes (LEDs) are widely used in many device applications due to its ability to operate at high power and produce high luminance. However, releasing the heat accumulated in the device during operating time is a serious problem that needs to be resolved to ensure high optical efficiency. Ceramic or Aluminium base metal printed circuit boards are generally used as integral parts of communication and power devices due to its outstanding thermal dissipation capabilities as heat sink or heat spreader. We investigated the characterisation of electroless plating of Ni-B film according to plating bath temperature, ranging from $50^{\circ}C$ to $75^{\circ}C$ on Ag paste/anodised Al ($Al_2O_3$)/Al substrate to be used in metal PCB for high power LED packing systems. X-ray diffraction (XRD), Field-Emission Scanning Electron Microscopy (FE-SEM) and X-ray Photoelectron Spectroscopy (XPS) were used in the film analysis. By XRD result, the structure of the as deposited Ni-B film was amorphous irrespective of bath temperature. The activation energy of electroless Ni-B plating was 59.78 kJ/mol at the temperature region of $50{\sim}75^{\circ}C$. In addition, the Ni-B film grew selectively on the patterned Ag paste surface.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.630-630
• /
• 2013

Recently, atomically smooth hexagonal boron nitride(h-BN) known as a white graphene has drawn great attention since the discovery of graphene. h-BN is a III-V compound and has a honeycomb structure very similar to graphene with smaller lattice mismatch. Because of strong covalent sp2bonds like graphene, h-BN provides a high thermal conductivity and mechanical strength as well as chemical stability of h-BN superior to graphene. While graphene has a high electrical conductivity, h-BN has a highly dielectric property as an insulator with optical band gap up to 6eV. Similar to the graphene, h-BN can be applied to a variety of field, such as gate dielectric layers/substrate, ultraviolet emitter, transparent membrane, and protective coatings. However, up until recently, obtaining and controlling good quality monolayer h-BN layers have been too difficult and challenging. In this work, we investigate the controlled synthesis of h-BN layers according to the growth condition, time, temperature, and gas partial pressure. h-BN is obtained by using chemical vapor deposition on Cu foil with ammonia borane (BH3NH3) as a source for h-BN. Scanning Transmission Electron Microscopy (STEM, JEOL-JEM-ARM200F) is used for imaging and structural analysis of h-BN layer. Sample's surface morphology is characterized by Field emission scanning electron microscopy (SEM, JEOL JSM-7100F). h-BN is analyzed by Raman spectroscopy (HORIBA, ARAMIS) and its topographic variations by Atomic force microscopy (AFM, Park Systems XE-100).

• Journal of the Korean institute of surface engineering
• /
• v.39 no.5
• /
• pp.206-209
• /
• 2006

Indium tin oxide (ITO) films were synthesized on polymer (PES, polyethersulfone) at room temperature by pulsed DC magnetron sputtering. By the control of introducing hydrogen to argon atmosphere, the resistivity of ITO films was obtained at $5.27\;{\times}\;10^{-4}\;{\Omega}{\cdot}cm$ without substrate heating in comparison with $2.65\;{\times}\;10{-3}\;{\Omega}{\cdot}cm$ under hydrogen free condition. ITO film synthesized at Ar condition was changed from amorphous to crystalline. These result from the enhancement of electron temperature in $Ar\;+\;H_2$ plasma, which induces the increase of ionization of target materials and argon. The dominant increase of ions such as In II and O II and neutral Sn I was monitored by optical emission spectroscopy (OES). Thermal energy required for the crystalline film formation is compensated by kinetic energy transfer through ion bombardments to substrate.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.10 no.1
• /
• pp.5-12
• /
• 2000

As a semiconductor material for electronic devices operated under extreme environmental conditions, silicon carbides (SiCs) have been intensively studied because of their excellent electrical, thermal and other physical properties. The growth characteristics of single- crystalline 6H-SiC homoepitaxial layers grown by a thermal chemical vapor deposition (CVD) were investigated. Especially, the successful growth condition of 6H-SiC homoepitaxial layers using a SiC-uncoated graphite susceptor that utilized Mo-plates was obtained. The CVD growth was performed in an RF-induction heated atmospheric pressure chamber and carried out using off-oriented ($3.5^{\circ}$tilt) substrates from the (0001) basal plane in the <110> direction with the Si-face side of the wafer. In order to investigate the crystallinity of grown epilayers, Nomarski optical microscopy, transmittance spectra, Raman spectroscopy, XRD, Photoluninescence (PL) and transmission electron microscopy (TEM) were utilized. The best quality of 6H-SiC homoepitaxial layers was observed in conditions of growth temperature $1500^{\circ}C$ and C/Si flow ratio 2.0 of $C_3H_8$ 0.2 sccm & $SiH_4$ 0.3 sccm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.06a
• /
• pp.168-168
• /
• 2008

Dimension of a transistor has rapidly shrunk to increase the speed of device and to reduce the power consumption. However, it is accompanied with several problems like direct tunneling through the gate dioxide layer and low conductivity characteristic of poly-Si gate in nano-region. To cover these faults, study of new materials is urgently needed. Recently, high dielectric materials like $Al_2O_3$, $ZrO_2$, and $HfO_2$ are being studied for equivalent oxide thickness (EOT). However, poly-Si gate is not compatible with high-k materials for gate-insulator. Poly Si gate with high-k material has some problems such as gate depletion and dopant penetration problems. Therefore, new gate structure or materials that are compatible with high-k materials are also needed. TiN for metal/high-k gate stack is conductive enough to allow a good electrical connection and compatible with high-k materials. According to this trend, the study on dry etching of TiN for metal/high-k gate stack is needed. In this study, the investigations of the TiN etching characteristics were carried out using the inductively coupled $BCl_3$-based plasma system and adding $Cl_2$ gas. Dry etching of the TiN was studied by varying the etching parameters including $BCl_3$/Ar gas mixing ratio, RF power, DC-bias voltage to substrate, and $Cl_2$ gas addition. The plasmas were characterized by optical emission spectroscopy analysis. Scanning electron microscopy was used to investigate the etching profile.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.06a
• /
• pp.335-335
• /
• 2008

Phosphate glass samples with various $Cr_2O_3$ and $Er_2O_3$ contents based upon $55P_2O_5\cdot24BaO\cdot10K_2O\cdot4Al_2O_3\cdot6Yb_2O_3$ were prepared. The prepared glass compositions are dehydrated using gas bubble flow method in open system and investigated the effects of the eliminating of OH groups from the glass melts with bubbling time. It was found that the probability of $Er^{+3}$ fluorescence quenching by OH groups oscillations linear depends upon the OH groups absorption coefficients in the maximum of the stretch vibrations band at $3500cm^{-1}$ while $Er^{+3}$ concentration range is between $1.6\times10^{19}$ and $21.2\times10^{19}$ ion/$cm^3$.

• Proceedings of the KIEE Conference
• /
• 2000.07c
• /
• pp.1736-1738
• /
• 2000

ITO/TPD($450{\AA}$)/$Alq_{3}(500{\AA})$/Al:Li($1200{\AA}$) 구조의 유기 LED를 제작하였다. Al과 Al:Li(0.lwt%), Al:Li(1wt%), Al:Li(5wt %) 합금을 음전극으로 증착시켜 소자의 전기적 광학적 특성을 분석하였다. 음전극 내의 Li의 분포를 알아보기 위하여 SIMS(Secondary ion Mass Spectroscopy) depth profiling을 하였다. Al:Li합금에서 Li의 함량이 0.1 wt %에서 5 wt %로 증가함에 따라 소자의 turn-on voltage는 약 3.5 V에서 3 V로 감소하였고, 구동전압도 감소하였다. 200$cd/m^2$의 휘도를 기준으로 Al:Li(0.1wt %) 합금을 사용한 소자의 경우 3.5 lm/W로 발광효율이 최대였다. 증착된 Al:Li(0.1wt%) 합금의 SIMS depth profiling 결과 초기에만 Al:Li이 증착되어 Al:Li/Al의 두 층이 형성되었고, Al:Li 합금층의 두께는 약 120${\AA}$ 이었다.

• Corrosion Science and Technology
• /
• v.19 no.1
• /
• pp.43-50
• /
• 2020

In this study, the effects of KCl(s) and K₂SO₄(s) on the oxidation characteristics of 2.25Cr-1Mo steel were investigated for 500 h in 10O₂ + 10CO₂ (vol%) gas environmen at 650 ℃. Oxidation kinetics were characterized by weight gain, oxide layer thickness, and fitted models for the experiment data were proposed. The fitted models presented considerable agreement with the experimental data. The oxide layer was analyzed using the scanning electron microscope, optical microscope, and energy dispersive X-ray spectroscopy. The oxidation kinetics of 2.25Cr-1Mo steel with KCl and K₂SO₄ coatings showed significantly different oxidation kinetics. KCl accelerated the oxidation rate very much and had linear oxidation behavior. In contrast, K₂SO₄ had no significant effect, which had parabolic kinetics. The oxide layer was commonly composed of Fe₂O₃, Fe₃O₄, and FeCr₂O₄ spinel. KCl strongly accelerated the oxidation rates of 2.25Cr-1Mo steel in the high-temperature oxidation environment. Conversely, K₂SO₄ had little effect on the oxidation rates.

• Journal of IKEEE
• /
• v.19 no.4
• /
• pp.541-547
• /
• 2015

In current semiconductor manufacturing, as the feature size of integrated circuit (IC) devices continuously shrinks, detecting endpoint in plasma etching process is more difficult than before. For endpoint detection, various kinds of sensors are installed in semiconductor manufacturing equipments, and sensor data are gathered with predefined sampling rate. Generally, detecting endpoint is performed using OES data of by-product. In this study, OES data of both by-product and etchant gas are used to improve reliability of endpoint detection. For the OES data pre-processing, a combination of Signal to Noise Ratio (SNR) and Principal Component Analysis (PCA),are used. Polynomial Regression and Expanded Hidden Markov model (eHMM) technique are applied to pre-processed OES data to detect endpoint.