• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.191-194
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• 2002

In optical pick-up, optical components such as objective lens, collimator, mirror, laser diode and photo diode are mounted on the pick-up base. These components must keep their original position during operation for proper transmittance of information from laser diode to optical disk and back to photo diode. However, micro thermal deformation of pick-up base which is induced by thermal environment during operation can deteriorate the performance of optical pick-up. Therefore, it is important to measure and analyze the thermal deformation behavior of pick-up base under thermal environment. In the present study, a measurement system using holographic interferometry was designed to measure micro thermal deformation of pick up base. The measurement system was verified by using the deformation of cantilever with prescribed motion actuated by PZT with 1 nm resolution. Interferometric measurement was compared quantitatively with that induced by PZT actuator. Finally, micro thermal deformation of pick-up base under actual thermal environment was measured using the present holographic interferometry and the results were analysed.

• 한국정밀공학회지
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• 제15권3호
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• pp.38-49
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• 1998

The 3rd generation optical pick-up used popularly in resent years is composed of many optical and electronic components such as laser diode, photo diode, beam splitter, objective lens, grating lens, concave lens, collimator lens etc. Therefore, the design of its optical system and its main base which the said optical and electronic components are set on, is complicated and needs high precision. Its assembly and adjustment in the production line is also difficult. This complication and the demand of high precision get its production cost to be high and its reliability to be low. In this paper, the 4th generation optical pick-up is designed and developed, with the hologram device which laser diode. photo diode, beam splitter. and grating lens are integrated in. This optical pick-up reduces the number of points of adjustment by 3, compared with the 3rd generation optical pick-up of which the number of points of adjustment is 6. This optical pickup also decreases by 4 the number of points of W bonding to have bad influence on environmental reliability, decreases by about 10 the number of parts, and establishes about 20% cost-down of material cost, compared with the 3rd generation optical pick-up.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 춘계학술대회 논문집
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• pp.105-108
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• 2004

The effect of thermal deformation of optical pick-up due to laser diode(LD) and LD driving integrated circuit on the optical performance of digital versatile disk(DVD) optical system was analyzed using the finite element analysis with initial surface residual stress conditions, and results were compared with the measured results with holographic interferometry. Ray tracing was performed using the deformed configuration of optical system.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2000년도 춘계학술대회논문집 - 한국공작기계학회
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• pp.435-440
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• 2000

In this study, we aims to develop the machining technology for the ultra precision surface and profile accuracy. For this purpose, we construct the electrolytic in process grinding system (ELID grinding) and apply to the cylindrical and internal grinding. Through the various machining experiments such as SCM steel., ceramics, tungsten carbide etc., we have obtained nanometer surface roughness. And we have applied this mirror grinding technique to hydraulic manual valve and mold core of mini disk optical pick-up base. For the development of fine mechanical part machining technology, e have made multi fiber optical connector using fine grinding technology. And constructed micro drilling system with process monitoring system which is possible to drill 50${\mu}{\textrm}{m}$ diameter hole.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1987년도 전기.전자공학 학술대회 논문집(I)
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• pp.501-504
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• 1987

The photoconductor is made of evaporated amorphous selenium as the base material, doped with arsenic and tellurium to prevent crystallization and to increase the red sensitivity of the amorphous selenium. The four-layered photoconductor of Se-As-Te has good photosensitivity(r=0.9) and high dark resistivity($P_d=10^{12}{\Omega}{\cdot}cm$). therefore, this four-layered photoconductor can be used for the target of color image pick-up tube.

• 대한전자공학회논문지
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• 제25권4호
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• pp.422-429
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• 1988

The photoconductive multilayer of Se-As(hole blocking layer)/Se-As-Te (photoconductive layer) /Se-As (layer for supporiting hole transport)/Se-As(layer or controlling total capacitance)/Sb2S3(electron blocking layer) was fabricated and its electrical and optical properties were investigated. The photoconductive multilayer is made of evaporated a-Se as the base material, doped with As and Te to prevent the crystallization of a-Se and to enhance red sensitivity, respectively. The multilayer with good image reproducibility has the following deposition condition. The first layer has the thickness of 250\ulcornerat the deposition rate of 250\ulcornersec. The second layer has the thickness of 800\ulcornerat the deposition rate of 250\ulcornersec. The third layer has the thickness of 125\ulcornerat the deposition rate of 250\ulcornersec. The fourth layer has the thickness of 1700\ulcornerunder the Ar gas ambient of 50x10**-3torr. The image pick-up tube, employing this multilayer demonstrates the following characteristics. The photosensitivity is 0.8, the resolution limit is above 300TV line, and the decay lag is about 7%. And spectral response convers the whole visible range. Therfore the application to color TV camera is expected.