• Journal of the Optical Society of Korea
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• v.10 no.3
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• pp.105-111
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• 2006

A novel image quality evaluation method, which is based on combination of the rigorous grating diffraction theory and the ray-optic method, is proposed. It is applied for design optimization and, tolerance analysis of optical imaging systems implementing diffractive optical elements (DOE). The evaluation method can predict the quality and resolution of the image on the image sensor plane through the optical imaging system. Especially, we can simulate the effect of diffraction efficiencies of DOE in the camera lenses module, which is very effective for predicting different color sense and MTF performance. Using this method, we can effectively determine the fabrication tolerances of diffractive and refractive optical elements such as the variations' in profile thickness, and the shoulder of the DOE, as well as conventional parameters such as decenter and tilt in optical-surface alignments. A DOE-based 2M-resolution camera lens module designed by the optimization process based on the proposed image quality evaluation method shows ${\sim}15%$ MTF improvement compared with a design without such an optimization.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.319-320
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• 2012

Large aperture optical modulator called optical shutter is a key component to realize time-of-flight (TOF) based three dimensional (3D) imaging systems [1-2]. The transmission type electro-absorption modulator (EAM) is a prime candidate for 3D imaging systems due to its advantages such as small size, high modulation performance [3], and ease of forming two dimensional (2D) array over large area [4]. In order to use the EAM for 3D imaging systems, it is crucial to remove GaAs substrate over large area so as to obtain high uniformity modulation performance at 850 nm. In this study, we propose and experimentally demonstrate techniques for backside etching of GaAs substrate over a large area having high uniformity. Various methods such as lapping and polishing, dry etching for anisotropic etching, and wet etching ([20%] C6H8O7 : H2O2 = 5:1) for high selectivity backside etching [5] are employed. A high transmittance of 80% over the large aperture area ($5{\times}5mm^2$) can be obtained with good uniformity through optimized backside etching method. These results reveal that the proposed methods for backside etching can etch the substrate over a large area with high uniformity, and the EAM fabricated by using backside etching method is an excellent candidate as optical shutter for 3D imaging systems.

• Journal of the Optical Society of Korea
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• v.18 no.6
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• pp.672-678
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• 2014

We propose a method to estimate the 3-D shape of surfaces with specular reflection, using a model of the difference in appearance between images reflected from a flat surface and a curved surface. First, we analyze the geometry of spatial reflection from a specular surface and how reflected light varies due to a curved surface. This is used to estimate 3-D shape. The proposed method is shown to be effective in experiments using illumination from spatially distributed light sources and a camera capturing the reflected light from curved, specular surfaces.

• Proceedings of the Optical Society of Korea Conference
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• 2007.07a
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• pp.259-260
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• 2007

In this paper, we propose a novel computational integral imaging reconstruction (CIIR) method using round-type mapping model. Proposed CIIP method can overcome problems of non-uniformly reconstructed images caused from the conventional method and improve the resoulution of 3-D images. To show the usefulness of the proposed method, both computational experiment and optical experiment are carried out and their results are presented.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2012.05a
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• pp.155-157
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• 2012

In this paper, we propose a nonlinear 3D image correlator using computational reconstruction of 3D images based on integral imaging. In the proposed method, the elemental images for reference 3D object and target 3D object are recorded through the lens array. The recorded elemental images are reconstructed as reference plane image and target plane images using the computational integral imaging reconstruction algorithm and the nonolinear correlation between them is performed for object recognition. To show the usefulness of the proposed method, the preliminary experiments are carried out and the experimental results are presented compared with the conventional results.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.20 no.12
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• pp.2363-2369
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• 2016

In this paper, we propose three-dimensional (3D) quick-response (QR) code generation technique using passive 3D integral imaging and computational integral imaging reconstruction technique. In our proposed method, we divide 2D QR code into 4 planes with different reconstruction depths and then we generate 3D QR code using synthetic aperture integral imaging and computational reconstruction. In this 3D QR code generation process, we use integral imaging which is one of 3D imaging technologies. Finally, 3D QR code can be scanned by reconstructing and merging 3D QR codes at 4 different planes with computational reconstruction. Therefore, the security level for QR code scanning may be enhanced when QR code is scanned. To show that our proposed method can improve the security level for QR code scanning, in this paper, we carry out the optical experiments and computational reconstruction. In addition, we show that 3D QR code can be scanned when reconstruction depths are known.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2013.10a
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• pp.763-764
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• 2013

A three-dimensional image capturing device and its signal processing algorithm and apparatus are presented. Three dimensional information is one of emerging differentiators that provides consumers with more realistic and immersive experiences in user interface, game, 3D-virtual reality, and 3D display. It has the depth information of a scene together with conventional color image so that full-information of real life that human eyes experience can be captured, recorded and reproduced. 20 Mega-Hertz-switching high speed image shutter device for 3D image capturing and its application to system prototype are presented[1,2]. For 3D image capturing, the system utilizes Time-of-Flight (TOF) principle by means of 20MHz high-speed micro-optical image modulator, so called 'optical resonator'. The high speed image modulation is obtained using the electro-optic operation of the multi-layer stacked structure having diffractive mirrors and optical resonance cavity which maximizes the magnitude of optical modulation[3,4]. The optical resonator is specially designed and fabricated realizing low resistance-capacitance cell structures having small RC-time constant. The optical shutter is positioned in front of a standard high resolution CMOS image sensor and modulates the IR image reflected from the object to capture a depth image (Figure 1). Suggested novel optical resonator enables capturing of a full HD depth image with depth accuracy of mm-scale, which is the largest depth image resolution among the-state-of-the-arts, which have been limited up to VGA. The 3D camera prototype realizes color/depth concurrent sensing optical architecture to capture 14Mp color and full HD depth images, simultaneously (Figure 2,3). The resulting high definition color/depth image and its capturing device have crucial impact on 3D business eco-system in IT industry especially as 3D image sensing means in the fields of 3D camera, gesture recognition, user interface, and 3D display. This paper presents MEMS-based optical resonator design, fabrication, 3D camera system prototype and signal processing algorithms.

• Journal of the Semiconductor & Display Technology
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• v.7 no.1
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• pp.11-16
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• 2008

Confocal scanning microscopy is a widely used technique for three dimensional measurements because it is characterized by high resolution, high SNR and depth discrimination. Generally an image is generated by moving one optical probe that satisfies the confocal condition on the specimen. Measurement speed is limited by movement speed of the optical probe; scanning speed. To improve measurement speed we increase the number of optical probes. Specimen region to scan is divided by optical probes. Multi-point information each optical probe points to can be obtained simultaneously. Therefore image acquisition speed is increased in proportion to the number of optical probes. And multiple optical probes from red, green and blue laser sources can be used for color imaging and image quality, i.e., contrast, is improved by adding color information by this way. To conclude, this technique contributes to the improvement of measurement speed and image quality.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.12
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• pp.15-21
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• 2010

Recently, there is a demand for a thermal imaging microscope in the medical field as well as the semi-conductor industry Although the demand of the advanced thermal imaging microscope has been increased, it is very difficult to obtain the technology of developing a thermal camera, because it is used for defense industry. We developed the ${\times}5$ zoom microscope which has $3\;{\mu}m$ spatial resolution to research the design and fabrication of the IR (Infrared) optical system. The optical system of the IR microscope consists of four spherical lenses and four aspheric lenses. We verified individual sensitivity of each optical parameter as the first order approach to the analysis. And we also performed structure and vibration analysis. The optical elements are fabricated using Freeform 700A. The measurement results of surface roughness and form accuracy using NT 2000 and UA3P are Ra 2.36 nm and P-V $0.13\;{\mu}m$. Finally we ascertained resolution power of $3\;{\mu}m$ using USAF (United State Air Force) 1951 IR resolution test chart.

• Current Optics and Photonics
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• v.2 no.5
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• pp.460-467
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• 2018

Three-dimensional (3D) refractive-index (RI) imaging and quantitative analyses of angiosperm pollen grains are presented. Using optical diffraction tomography, the 3D RI structures of individual angiosperm pollen grains were measured without using labeling or other preparation techniques. Various physical quantities including volume, surface area, exine volume, and sphericity were determined from the measured RI tomograms of pollen grains. Exine skeletons, the distinct internal structures of angiosperm pollen grains, were identified and systematically analyzed.