• Journal of Power Electronics
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• v.16 no.3
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• pp.1097-1109
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• 2016

Fault detection and isolation are related to system monitoring, identifying when a fault has occurred, and determining the type of fault and its location. Fault detection is utilized to determine whether a problem has occurred within a certain channel or area of operation. Fault detection and diagnosis have become increasingly important for many technical processes in the development of safe and efficient advanced systems for supervision. This paper presents an integrated technique for fault diagnosis and classification for open- and short-circuit faults in three-phase inverter circuits. Discrete wavelet transform and principal component analysis are utilized to detect the discontinuity in currents caused by a fault. The features of fault diagnosis are then extracted. A fault dictionary is used to acquire details about transistor faults and the corresponding fault identification. Fault classification is performed with a fuzzy logic system and relevance vector machine (RVM). The proposed model is incorporated with a set of optimization techniques, namely, evolutionary particle swarm optimization (EPSO) and cuckoo search optimization (CSO), to improve fault detection. The combination of optimization techniques with classification techniques is analyzed. Experimental results confirm that the combination of CSO with RVM yields better results than the combinations of CSO with fuzzy logic system, EPSO with RVM, and EPSO with fuzzy logic system.

• Journal of Power Electronics
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• v.13 no.6
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• pp.985-990
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• 2013

This paper proposes a novel fault diagnosis scheme using parameter estimation of the stator resistance, especially in the case of the open-phase faults of PMSM drives. The stator resistance of PMSMs can be estimated by the recursive least square (RLS) algorithm in real time. Fault diagnosis is achieved by analyzing the estimated stator resistance of each phase according to the fault condition. The proposed fault diagnosis scheme is implemented without any extra devices. Moreover, the estimated parameter information can be used to improve the control performance. The feasibility of the proposed fault diagnosis scheme is verified by simulation and experimental results.

• Journal of Power Electronics
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• v.18 no.2
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• pp.627-639
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• 2018

The fact that the reliability of IGBTs has become a more and more significant aspect of power converters has resulted in an increase in the research on the open circuit (OC) fault location of IGBTs. When an OC fault occurs, a zero-current phenomena exists and frequently appears, which can be found in a lot of the existing literature. In fact, fault variables have a very high correlation with the zero-current interval. In some cases, zero-current interval actually decides the most significant fault feature. However, very few of the previous studies really explain or prove the zero-current phenomena of the fault current. In this paper, the zero-current phenomena is explained and verified through mathematical derivation, based on two-level and three-level NPC static var generators (SVGs). Mathematical models of single OC fault are deduced and it is concluded that a zero-current interval with a certain length follows the OC faults for both two-level and NPC three-level SVGs. Both inductive and capacitive reactive power situations are considered. The unbalanced load situation is discussed. In addition, simulation and experimental results are presented to verify the correctness of the theoretical analysis.

• Korean Journal of Materials Research
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• v.24 no.4
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• pp.186-193
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• 2014

A thin Cu seed layer for electroplating has been employed for decades in the miniaturization and integration of printed circuit board (PCB), however many problems are still caused by the thin Cu seed layer, e.g., open circuit faults in PCB, dimple defects, low conductivity, and etc. Here, we studied the effect of heat treatment of the thin Cu seed layer on the deposition rate of electroplated Cu. We investigated the heat-treatment effect on the crystallite size, morphology, electrical properties, and electrodeposition thickness by X-ray diffraction (XRD), atomic force microscope (AFM), four point probe (FPP), and scanning electron microscope (SEM) measurements, respectively. The results showed that post heat treatment of the thin Cu seed layer could improve surface roughness as well as electrical conductivity. Moreover, the deposition rate of electroplated Cu was improved about 148% by heat treatment of the Cu seed layer, indicating that the enhanced electrical conductivity and surface roughness accelerated the formation of Cu nuclei during electroplating. We also confirmed that the electrodeposition rate in the via filling process was also accelerated by heat-treating the Cu seed layer.

• Proceedings of the KIPE Conference
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• 2002.07a
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• pp.723-726
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• 2002

In this paper, a high efficiency leakage transformer for neon tube is developed to improve its power factor, to reduce its core loss and weight by using a technique of shape optimization and direction of grain-oriented silicon steel sheet. A protection circuit is designed for all types of neon transformer loaded with one or more neon lamps. Whenever the neon tube fails to be started up or comes to the life end, or encounters faults with open-circuits at the output terminals of the neon transformer, the protection circuit will be initiated to avoid more critical hazards. These neon transformers need a protection circuit to prevent from current stresses on circuit components by neon tube fail. The input of the transformer is automatically cut off when the abnormal condition occurs, preventing waste of no-load power. As the results of the study, the core weight is reduced by $11\%$, the power factor improved by $5\%$ and the efficiency increased by $6\%$ compared with the conventional type due to the employment of the grain-oriented steel sl)eel and the optimized core shape.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.181_182
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• 2009

Some phenomena occurred when one phase of the line circuit breaker was opened while a generator was operating to connect with the power grid were simulated by PSCAD/EMTDC and the analysis for the reason of operation and non-operation of protective relay will contribute to prevent spreading damage when same prospective faults occur.

• Journal of Power Electronics
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• v.16 no.5
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• pp.1950-1963
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• 2016

A novel open-circuit fault diagnosis method for 3-phase 4-wire 3-level active power filters based on voltage error correlation is proposed in this paper. This method is based on observing the output pole voltage error of the active power filter through two kinds of algorithms. One algorithm is a voltage error analytical algorithm, which derives four output voltage error analytic expressions through the pulse state, current value and dc bus voltage, respectively, assuming that all of the IGBTs of a certain phase come to an OC fault. The other algorithm is a current circuit equation algorithm, which calculates the real-time output voltage error through basic circuit theory. A correlation is introduced to measure the similarity of the output voltage errors between the two algorithms, and OC faults are located by the maximum of the correlations. A FPGA has been chosen to implement the proposed method due to its fast prototyping. Simulation and experimental results are presented to show the performance of the proposed OC fault diagnosis method.

• Transactions on Electrical and Electronic Materials
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• v.10 no.2
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• pp.53-57
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• 2009

In this paper we develop a method to observe faults in semiconductor devices and transmission lines by calculating the variation of the reflection function in a dielectric microstrip line that has an open-ended termination containing an optically induced plasma region. It is analyzed with the assumption that the plasma is distributed homogeneously in laser illumination. With the non linear material of degradation, the concentration of the carrier in the part of the material has changed. Since the input wave has produced the phenomenon of reflection, the input signal to the open-ended microstrip lines can be observed on reflection to identify the location of the fault. The characteristic impedances resulting from the presence of plasma are evaluated by the transmission line model. The variation of the reflection wave in the microwave system has been calculated by using an equivalent circuit model. The transient response has been also evaluated theoretically for changing the phase of the variation in the reflection. The variation of characteristic response in differentially localized has been also evaluated analytically.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.9
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• pp.26-34
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• 1998

This paper presents a characterization method for faults of circuit patterns on MCM(Multichip Module) or PCB(Printed Circuit Board) substrates with electron beams of a SEM(Scanning Electron Microscope) by inducing voltage contrast on the signal line. The experimentation employes dual potential electron beams for the fault characterization of circuit patterns with a commercial SEM without modifying its structure. The testing procedure utilizes only one electron gun for the generation of dual potential electron beams by two different accelerating voltages, one for charging electron beam which introduces the yield of secondary electron $\delta$ < 1 and the other for reading beam which introduces $\delta$ > 1. Reading beam can read open's/short's of a specific net among many test nets, simultaneously discharging during the reading process for the next step, by removing its voltage contrast. The experimental results of testing the copper signal lines on glass-epoxy substrates showed that the state of open's/short's had generated the brightness contrast due to the voltage contrast on the surface of copper conductor line, when the net had charged with charging electron beams of 7KV accelerating voltages and then read with scanning reading electron beams of 2KV accelerating voltages in 10 seconds. The experimental results with Au pads of a IC die and Au plated Cu pads of BGA substrates provided the simple test method of circuit lines with 7KV charging electron beam and 2KV reading beam. Thus the characterization method showed that we can test open and short circuits of the net nondestructively by using dual potential electron beams with one SEM gun.

• Journal of Power Electronics
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• v.9 no.3
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• pp.377-385
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• 2009

In this paper, a diagnosis method for switch open-circuit faults in three-phase PWM inverters is proposed, which employs support vector machine (SVM) as classifying method. At first, a discrete wavelet transform (DWT) is used to detect a discontinuity of currents due to the fault, and then the features for fault diagnosis are extracted. Next, these features are employed as inputs for the SVM training. After training, the SVM produces an optimized boundary which is used identifying the fault. Finally, the fault classification is performed online with instantaneous features. The experimental results have verified the validity of the proposed estimation algorithm.