• 전기전자학회논문지
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• 제23권4호
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• pp.1203-1207
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• 2019

As the number of IP cores has been increasing in a System-on-Chip (SoC), multiple routers are included in on-chip-networks. Each router has its own arbitration policy and it is difficult to obtain a desired arbitration result by combining multiple routers. Allocating desired bandwidths to the ports across the routers is more difficult. In this paper, a guaranteed bandwidth allocation scheme using an IP-level QoS control is proposed to overcome the limitations of existing local arbitration policies. Each IP can control the priority of a packet depending on the data communication requirement within the allocated bandwidth. The experimental results show that the proposed mechanism guarantees for IPs to utilize the allocated bandwidth in multiple router on-chip-networks. The maximum error rate of bandwidth allocation of the proposed scheme is only 1.9%.

• 반도체디스플레이기술학회지
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• 제19권2호
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• pp.82-87
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• 2020

In this paper, we introduce the novel idea to improve the B/W usage efficiency of on-chip networks used for TAM to test multiple DRAMs. In order to avoid the local bottleneck of test packets caused by an ATE, we make test patterns using microcode-based instructions within ATE and adopt a test bus to transmit test responses from DRAM DFT (Design for Testability) called Test Generator (TG) to ATE. The proposed test platform will contribute to increasing the test economics of memory IC industry.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 하계종합학술대회 논문집(4)
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• pp.242-245
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• 2000

In this paper, we present a color interpolation technique based on artificial neural networks for a single-chip CCD (charge-coupled device) camera with a Bayer color filter array (CFA). Single-chip digital cameras use a color filter array and an interpolation method in order to regenerate high quality color images from sparsely sampled images. We applied 3-layer feedforward neural networks in order to interpolate missing pixel from surrounding pixels. And we compared the proposed method with conventional interpolation methods such as the proposed interpolation algorithm based on neural networks provides a better performance than the conventional interpolation algorithms.

• ETRI Journal
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• 제38권6호
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• pp.1240-1249
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• 2016

With the number of IP cores in a multicore system-on-chip increasing to up to tens or hundreds, the role of on-chip interconnection networks is vital. We propose a networks-on-chip-style bus network as a compromise and redefine the exploration problem to find the best IP tiling patterns and communication path combinations. Before solving the problem, we estimate the time complexity and validate the infeasibility of the solution. To reduce the time complexity, we propose two fast exploration algorithms and develop a program to implement these algorithms. The program is executed for several experiments, and the exploration time is reduced to approximately 1/22 and 7/1,200 at the first and second steps of the exploration process, respectively. However, as a trade-off for the time saving, the time cost (TC) of the searched architecture is increased to up to 4.7% and 11.2%, respectively, at each step compared with that of the architecture obtained through full-case exploration. The reduction ratio can be decreased to 1/4,000 by simultaneously applying both the algorithms even though the resulting TC is increased to up to 13.1% when compared with that obtained through full-case exploration.

• ETRI Journal
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• 제31권2호
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• pp.111-120
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• 2009

Network-on-chip (NoC) architecture provides a highper-formance communication infrastructure for system-on-chip designs. Circuit-switched networks guarantee transmission latency and throughput; hence, they are suitable for NoC architecture with real-time traffic. In this paper, we propose an efficient integrated scheme which automatically maps application tasks onto NoC tiles, establishes communication circuits, and allocates a proper bandwidth for each circuit. Simulation results show that the average waiting times of packets in a switch in $6{\times}6$6, $8{\times}8$, and $10{\times}10$ mesh NoC networks are 0.59, 0.62, and 0.61, respectively. The latency of circuits is significantly decreased. Furthermore, the buffer of a switch in NoC only needs to accommodate the data of one time slot. The cost of the switch in the circuit-switched network can be reduced using our scheme. Our design provides an effective solution for a critical step in NoC design.

• 대한전자공학회논문지SD
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• 제47권1호
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• pp.86-93
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• 2010

반도체 공정 및 설계 기술의 발전에 따라 SoC에 보다 많은 기능이 포함되고 데이터 전송량 또한 급격히 증가하고 있다. 이에 따라 SoC 내부의 온 칩 네트워크에서 데이터 전송 속도가 전체 시스템의 성능에 큰 영향을 미치게 되어 이와 관련된 연구가 활발하게 진행되고 있다. 기존의 AHB를 대체하기 위한 온 칩 네트워크 프로토콜로 AXI와 OCP가 대표적으로 거론되고 있으나 전송 성능을 증가시키기 위해 신호선의 수가 크게 증가하여 인터페이스와 네트워크 하드웨어 설계가 매우 어렵고 기존에 널리 사용되던 AHB와 다른 프로토콜과의 호환성도 좋지 않다. 본 논문에서는 이를 개선하기 위한 새로운 온 칩 네트워크 프로토콜을 제안한다. 제안된 프로토콜은 신호선의 수를 기존의 AHB보다 줄이고 AXI 등 다른 프로토콜과의 호환성도 고려하였다. 성능 분석결과 AXI보다는 조금 떨어지는 성능을 보여주고 있으나 8-버스트 이상의 전송에서는 큰 차이가 없고 신호선 수대비 성능에서는 월등히 우수함을 확인하였다.

• 전자공학회논문지A
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• 제31A권10호
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• pp.161-172
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• 1994

This paper describes the design of a neurochip with on-chip learning capability in hardware with multiple processing elements. A digital architecture is adopted because its flexiblity and accuracy is advantageous for simulating the various application systems. The proposed chip consists of several processing elements to fit the large computation of neural networks, and has on-chip learning capability based on error back-propagation algorithm. It also minimizes the number of blobal control signals for processing elements. The modularity of the system makes it possible to buil various kinds of boards to match the expected range of applications.

• ETRI Journal
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• 제36권4호
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• pp.643-653
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• 2014

To reduce interconnect delay and power consumption while improving chip performance, a three-dimensional integrated circuit (3D IC) has been developed with die-stacking and through-silicon via (TSV) techniques. The power supply problem is one of the essential challenges in 3D IC design because IR-drop caused by insufficient supply voltage in a 3D chip reduces the chip performance. In particular, power bumps and TSVs are placed to minimize IR-drop in a 3D power delivery network. In this paper, we propose a design methodology for 3D power delivery networks to minimize the number of power bumps and TSVs with optimum mesh structure and distribute voltage variation more uniformly by shifting the locations of power bumps and TSVs while satisfying IR-drop constraint. Simulation results show that our method can reduce the voltage variation by 29.7% on average while reducing the number of power bumps and TSVs by 76.2% and 15.4%, respectively.

• 전자공학회논문지B
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• 제31B권1호
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• pp.107-114
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• 1994

Hardware implementation of the on-chip learning artificial neural networks is important for real-time processing. A pRAM model is based on probabilistic firing of a biological neuron and can be implemented in the VLSI circuit with learning capability. We derive a backpropagation learning algorithm for the pRAM networks and present its circuit implementation with stochastic computation. The simulation results confirm the good convergence of the learning algorithm for the pRAM networks.

• 전자공학회논문지C
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• 제36C권11호
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• pp.46-54
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• 1999

셀룰러 신경망 셀의 출력값은 각 셀의 초기 상태값에 따라서 국부적 최소점으로 안정화될 수 있으므로 출력값에 오류를 가져을 수 있다. 이에 본 논문에서는 각 셀의 초기 상태값에 관계없이 출력값이 전역적 최소점 도달하여 정확한 출력이 보장되도록 하는 어닐링 기능을 갖는 6×6 셀룰러 신경망을 설계하였다. 이 칩은 0.8㎛ CMOS 공정으로 설계하였다. 설계된 칩은 약 15,000여개의 트랜지스터로 구성되며 칩 면적은 약 2.89×2.89㎟이다. 설계된 회로를 이용한 윤곽선 추출 및 hole filling에 대한 시뮬레이션 결과에서 어닐링이 되지 않은 경우에서 출력값에 오류를 일으킬 수 있지만 어닐링 기능을 갖는 경우에는 오류가 발생하지 않는 것을 확인하였다. 시뮬레이션에서 어닐링 시간은 3μsec로 하였다.