• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.730-732
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• 2007

We fabricated a coplanar type organic thin-film transistors using ink-jet printed silver source/drain electrodes and ${\alpha},{\omega}-dihexylquaterthiophene$ (DH4T) which is an active layer. Use of ink-jet printed silver nanoparticle-based metal electrode assists the energetic mismatch with p-type organic semiconductor via modification of their interfacial properties to enable ohmic contact formation.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1988년도 추계학술대회 논문집
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• pp.33-35
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• 1988

From the study of mechanism of electrical conduction of film which is made from Polyethylene Terephthalate at very high temperature which is larger than low electric field and glass transition point, we find that there is a extraordinary non ohmic region (I∝V$^n$, 0

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1988년도 추계학술대회 논문집
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• pp.108-111
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• 1988

In this study, the electrical conduction properties of plasma-polymerized (MMA+Styrene) thin film have been investigated. The measurements of transient conduction currents were carried out in the temperature of 50 to 150$^{\circ}C$ at electric field of 10$^4$to 10$\^$6/V/cm. The electric field-current density characteristic curves were divided into three regions-ohmic region, child region, sudden-increasing region. It is shown that the conduction mechanism of this thin film is in good agreement with SCLC(space charge limited current) model by applying the high field conduction theories.

• Transactions on Electrical and Electronic Materials
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• 제7권6호
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• pp.319-323
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• 2006

The problem of the partial discharge (PD) extinction is investigated. The transient process takes place in a small spherical inclusion which is located in the dielectric. Both the losses caused by polarization and ohmic losses as the dielectric parameters are taken into account. From the inclusion standpoint the dielectric is considered as an active two-pole element (equivalent generator) and inclusion represents by own current-voltage curve. PD extinction voltage was shown to depend on the polarization loss tangent.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 A
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• pp.366-368
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• 1999

In this paper, the analysis of the gas flow in the GCB is presented by using the modified FLIC method and the arc model. The modified FLIC method has two step calculation procedure. And it adopts the upwind scheme, which results in the stability.[1] The arc model used in this paper makes arc a heating source in the energy equation. The heating source is composed of ohmic heating and radiation energy transfer. And the type of the GCB in this paper is a auto-expansion type.[2]

• 한국전기전자재료학회논문지
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• 제24권4호
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• pp.261-265
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• 2011

This paper describes the fabrication and characteristics of a Au/Ni/Ti/3C-SiC Schottky diode with field plate (FP) edge termination. The Schottky contacts were annealed for 30 min at temperatures ranging from 0 to $800^{\circ}C$. At annealing temperature of $600^{\circ}C$, it showed an inhomogeneous Schottky barrier and had the best electrical characteristics. However, the annealing of $800^{\circ}C$ replaced it with ohmic behaviors because of the formation of many different types of nickel silicides. The fabricated Schottky diode had a breakdown voltage of 200 V, Schottky barrier height of 1.19 eV and worked normally even at $200^{\circ}C$.

• 반도체디스플레이기술학회지
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• 제3권3호
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• pp.31-35
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• 2004

A blue light emitting diode with 8 periods InGaN/GaN multi-quantum well structure grown by metal-organic chemical vapor deposition was fabricated with the inclusion of the metal-interconnection process in order to integrate the chips for light lamp. The quantum well structure provides the blue light photoluminescence peaked at 479.2 nm at room temperature. As decreasing the temperature to 20 K, the main peak was shifted to 469.7 nm and a minor peak at 441.9 nm appeared indicating the quantum dot formation in quantum wells. The current-voltage measurement for the fabricated LED chips shows that the metal-interconnection provides good current path with ohmic resistance of 41 $\Omega$.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.92-97
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• 2002

We establish a visible light emission from porous polycrystalline silicon nano structure(PPNS). The PPNS layer are formed on heavily doped n-type Si substrate. 2um thickness of undoped polycrystalline silicon deposited using LPCVD (Low Pressure Chemical Vapor Deposition) anodized in a HF: ethanol(=1:1) as functions of anodizing conditions. And then a PPNS layer thermally oxidized for 1 hr at $900 ^{\circ}C$. Subsequently, thin metal Au as a top electrode deposited onto the PPNS surface by E-beam evaporator and, in order to establish ohmic contact, an thermally evaporated Al was deposited on the back side of a Si-substrate. When the top electrode biased at +6V, the electron emission observed in a PPNS which caused by field-induces electron emission through the top metal. Among the PPNSs as functions of anodization conditions, the PPNS anodized at a current density of $10mA/cm^2$ for 20 sec has a lower turn-on voltage and a higher emission current. Furthermore, the behavior of electron emission is uniformly maintained.

• 태양에너지
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• 제19권1호
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• pp.29-36
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• 1999

ZnO/n-Si junctions were fabricated by spin coating with ZnO precursor produced by the sol-gel process. In order to increase the electrical conductivity of ZnO films, the films were n-doped with Al impurity and subsequently annealed at about $450^{\circ}C$ under reducing environments. The ohmic contacts between n-Si and AI for a bottom electrode were successfully fabricated by doping the rear surface of Si substrate with phosphorous atoms. The front surface of the substrate was also doped with phosphorous atoms for improving the efficiency of the solar cells. Consequently, conversion efficiencies ranging up to about 5.3% were obtained. These efficiencies were found to decrease slowly with time because of the oxide films formed at the ZnO/Si interface upon oxygen penetration through the porous ZnO. Oxygen barrier layers could be necessary in order to prevent the reduction of conversion efficiencies.

• 한국재료학회지
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• 제7권5호
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• pp.390-396
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• 1997

AIGaAs/InGaAs/GaAs high electron mobility transisters(HEMT)소자의 오믹 접합재료로 일반적으로 사용되고 있는 AuGeNi의 접합저항과 열적 안정성을 향상시키기 위한 새로운 접합재료에 대해 연구하였다. 이를 위해 sub/M$_{1}$Au-Ge/M$_{2}$Au의 구조에서 M$_{1}$을 Ni과 Pd, M$_{2}$를 Ni, Ti, Mo로 하였을 경우의 접합 재료에 대한 오믹 접합 특성의 변화를 조사하였다. 또한 일반 열처리로와 램프 히터를 이용한 고속 열처리에 따른 오믹 특성을 조사하였다. M$_{1}$을 Ni에서 Pd으로 대체하였을 경우 접합 저항은 약간 증가하였으며 접합 특성의 개선을 관찰되지 않았다. M$_{2}$를 Ni에서 Ti이나 Mo로 대치하였을 경우, 접합 저항은 감소하였고 열적 안정성과 접합 형상은 현저히 개선되었다. 특히 Ni/Au-Ge/Mo/Au의 접합재료는 급속 열처리에 의해 -0.1Ωmm의 극히 낮은 잡합 저항과 우수한 접합 형상을 갖는 것으로 조사되었다.