• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.275-276
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• 2005

Organic Light Emitting Diodes(OLEDs) are attractive as alternative display components because of their relative merits of being self-emitting, having large intrinsic viewing angle and fast switching speed. But because of their relatively short history of development, much remains to be studied in terms of their basic device physics and design, manufacturing techniques, stability and so on. We invested electrical properties of N,N-diphenyl-N,N bis (3-methyphenyl)-1,1'-biphenyl-4,4'-diamine(TPD) and tris-8-hydroxyquinoline aluminum($Alq_3$) when their thicknesses were changed variedly from 3:7 to 7:3 of their thickness ratios. And we also studied properties of OLEDs depend on their deposition rate between 0.05$\sim$0.2 [nm/s].

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.74-75
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• 2005

Organic Light Emitting Diodes are attractive as alternative display components because of their relative merits of being self-emitting, having large intrinsic viewing angle and fast switching speed. But because of their relatively short history of development, much remains to be studied in terms of their basic device physics and design, manufacturing techniques, stability and so on. We invested electrical properties of N, N-diphenyl-N, N bis (3-methyphenyl)-1, 1'-biphenyl-4, 4'-diamine and tris-8-hydroxyquinoline aluminum when their thickness were changed variedly from 3:7 to 7:3 of their thickness ratios. And we also studied their optimal thickness respectively.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.4-4
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• 2008

The progress in flat panel displays over the last two decades has been astonishing. In just 20 years, the LCD-TV grew up from a 2-inch curiosity, to an industry that will sell about 120 million flat panel TV's this year, with viewing area up to 4000 times larger. That success is based on continuous innovation, especially in manufacturing processes. For the next decade to bring another doubling of the business, progress will need to continue in four major areas: Human factors, ecological impact, visual quality, and of course continued drive towards affordability. This talk will detail the technology advances that can allow this industry to meet those challenges. Human factors. Today, we adapt our lifestyle to our technology. People organize their offices, and their homes, around displays. We pass around mobile phones to share images, rather than experiencing them as a group. Billions of newspapers continue to be sold daily. Advances in flexible displays can lead to large portable displays. "New era projection" includes the handheld Pico Projectors that are already on the market, and will ultimately appear integrated in mobile phones the same way cameras do today. "Eco" impact. Today TV's are one of the top energy consumers in a U.S. home, and the fastest growing. Watching a large flat panel TV can cost twice as much as running a large refrigerator. With today's concern about energy consumption, regulations are starting to emerge worldwide to limit TV electrical use. Fortunately, good solutions exist in using light management films to eliminate bulbs, saving power without increasing cost. Going forward, LED backlights will drive another step downward. OLED displays might be the ultimate solution. Visual quality. The color of an LCD-TV is still often considered inferior to a far less expensive CRT. And almost all displays suffer from representing a three-dimensional world on a two dimensional surface. The technology to improve color is available today, and will likely move from premium sets into the mainstream as costs come down. 3D is now arriving in movie theaters worldwide, and that will drive up the demand for similar realistic images in home theaters. And the technology is emerging today for 3D representation to move beyond specialized applications into everyday use, on screens large and small. Affordability. The world takes cost-down miracles for granted in consumer electronics. Each of these other advances will be balanced with a drive for affordability, especially as the market grows in emerging countries. The other three challenges must be met without increasing cost. Putting this all together, the next few years will emphasize "eco friendly" designs, and enhanced images such as 3D. By 2013 we will start to see serious penetration by emissive technologies (OLED, high efficiency plasma, or other), with the "ultimate display" likely not in the market for a decade. Lots of opportunities for innovation remain ahead of us.

• Clean Technology
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• v.21 no.4
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• pp.209-216
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• 2015

Indium-Tin-Oxide (ITO) is a material that is widely used for transparent conductive electrodes (TCEs). Indium (In), chief element of the ITO, is expected to be depleted in the near future owing to its high cost and limited reserves. To overcome the issue, ITO has to be retained by recycling redundant ITO targets after manufacturing processes. In this article, we proposed an efficient recycling way of the redundant ITO targets with investigation of the current recycling tendencies in domestic and foreign countries. As a result, it was revealed that only In is recycled from the redundant targets in domestic and Japan. As well, fabrication of TCEs is being researched with ITO nanoparticles solutions. However, since the TCEs fabricated with ITO target is superior to those with other materials, it is thought that establishment of regeneration technology of ITO itself is demanded for an efficient recycling and fabrication of ITO target.

• Transactions on Electrical and Electronic Materials
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• v.16 no.3
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• pp.124-129
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• 2015

Organic electronics are the domain in which the components and circuits are made of organic materials. This new electronics help to realize electronic and optoelectronic devices on flexible substrates. In recent years, organic materials have replaced conventional semiconductors in many electronic components such as, organic light-emitting diodes (OLEDs), organic field-effect transistors (OFETs) and organic photovoltaic (OPVs). It is well known that organic light emitting diodes (OLEDs) have many advantages in comparison with inorganic light-emitting diodes LEDs. These advantages include the low price of manufacturing, large area of electroluminescent display, uniform emission and lower the requirement for power. The aim of this paper is to model polymer LEDs and OLEDs made with small molecules for studying the electrical and optical characteristics. The purpose of this modeling process is, to obtain information about the running of OLEDs, as well as, the injection and charge transport mechanisms. The first simulation structure used in this paper is a mono layer device; typically consisting of the poly (2-methoxy-5(2'-ethyl) hexoxy-phenylenevinylene) (MEH-PPV) polymer sandwiched between an anode with a high work function, usually an indium tin oxide (ITO) substrate, and a cathode with a relatively low work function, such as Al. Electrons will then be injected from the cathode and recombine with electron holes injected from the anode, emitting light. In the second structure, we replaced MEH-PPV by tris (8-hydroxyquinolinato) aluminum (Alq₃). This simulation uses, the Poole-Frenkel -like mobility model and the Langevin bimolecular recombination model as the transport and recombination mechanism. These models are enabled in ATLAS- SILVACO. To optimize OLED performance, we propose to change some parameters in this device, such as doping concentration, thickness and electrode materials.

• Journal of Korean Ophthalmic Optics Society
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• v.13 no.4
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• pp.83-88
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• 2008

Purpose: To design an anamorphic aspherical prism lens for the HMD optical system. Methods: First, we get the initial data, needed in design, which are distances between each surface etc., by analyzing user's demended specifications and by drawing geometrically the shape of prism lens by using CAD. Based on these data and using 'ode V' which is an optical design software, we could progress the optimization in which we treat the coefficients of the anamorphic aspherical surface as the principal variables. To reduce the cost in DTM manufacturing, we would optimize the optical system with the transmitting surface, existed in the direction of video device among 3 surfaces of the prism lens, remaining as a plane. Results: we could design one anamorphic aspherical prism lens which has the finite ray aberration of 15 ${\mu}m$, the distortion of 0.5%, and the MTF value of 0.3 over at 36 lp/mm for the video device of 12 mm ${\times}$ 9 mm size. Conclusions: We designed a prism lens used for HMD. This prism lens has the optical capacities of 15 ${\mu}m$ finite ray aberration and 0.5% distortion for the video device of 12 mm ${\times}$ 9 mm size, and become the optical system having the MTF value of 0.3 over at 36 lp/mm.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.1-10
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• 2018

Recently, there has been rapid development in the field of flexible electronic devices, such as organic light emitting diodes (OLEDs), organic solar cells and flexible sensors. Encapsulation process is added to protect the flexible electronic devices from exposure to oxygen and moisture in the air. Using numerical simulation, we investigated the effects of the encapsulation layer on mechanical stability of the silicon chip, especially the fracture performance of center crack in multi-layer package for various loading condition. The multi-layer package is categorized in two type - a wide chip model in which the chip has a large width and encapsulation layer covers only the chip, and a narrow chip model in which the chip covers both the substrate and the chip with smaller width than the substrate. In the wide chip model where the external load acts directly on the chip, the encapsulation layer with high stiffness enhanced the crack resistance of the film chip as the thickness of the encapsulation layer increased regardless of loading conditions. In contrast, the encapsulation layer with high stiffness reduced the crack resistance of the film chip in the narrow chip model for the case of external tensile strain loading. This is because the external load is transferred to the chip through the encapsulation layer and the small load acts on the chip for the weak encapsulation layer in the narrow chip model. When the bending moment acts on the narrow model, thin encapsulation layer and thick encapsulation layer show the opposite results since the neutral axis is moving toward the chip with a crack and load acting on chip decreases consequently as the thickness of encapsulation layer increases. The present study is expected to provide practical design guidance to enhance the durability and fracture performance of the silicon chip in the multilayer package with encapsulation layer.