• Title/Summary/Keyword: OLED Degradation

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Effect of the Plasma-assisted Patterning of the Organic Layers on the Performance of Organic Light-emitting Diodes

  • Hong, Yong-Taek;Yang, Ji-Hoon;Kwak, Jeong-Hun;Lee, Chang-Hee
    • Journal of Information Display
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    • v.10 no.3
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    • pp.111-116
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    • 2009
  • In this paper, a plasma-assisted patterning method for the organic layers of organic light-emitting diodes (OLEDs) and its effect on the OLED performances are reported. Oxygen plasma was used to etch the organic layers, using the top electrode consisting of lithium fluoride and aluminum as an etching mask. Although the current flow at low voltages increased for the etched OLEDs, there was no significant degradation of the OLED efficiency and lifetime in comparison with the conventional OLEDs. Therefore, this method can be used to reduce the ohmic voltage drop along the common top electrodes by connecting the top electrode with highly conductive bus lines after the common organic layers on the bus lines are etched by plasma. To further analyze the current increase at low voltages, the plasma patterning effect on the OLED performance was investigated by changing the device sizes, especially in one direction, and by changing the etching depth in the vertical direction of the device. It was found that the current flow increase at low voltages was not proportional to the device sizes, indicating that the current flow increase does not come from the leakage current along the etched sides. In the etching depth experiment, the current flow at low voltages did not increase when the etching process was stopped in the middle of the hole transport layer. This means that the current flow increase at low voltages is closely related to the modification of the hole injection layer, and thus, to the modification of the interface between the hole injection layer and the bottom electrode.

Performance Analysis of Layered and Blended Organic Light-Emitting Diodes

  • Park, Jong-Woon;Yim, Yeon-Chan;Heo, Gi-Seok;Kim, Tae-Won;Lee, Jong-Ho;Park, Seung-Hwan
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.424-427
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    • 2008
  • We make performance simulations of three different organic light-emitting diodes (OLEDs), one of which is based on a conventional layered structure and the others on a blended structure where an emitting layer (EML) is either uniformly or stepwise mixed with an electron transport layer (ETL), Tris-(8-hydroxyquinoline) aluminum ($Alq_3$).

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A Video Data Correction Method for the Non-Uniform Electro-Optical Characteristics of the Pixels in AMOLED Displays

  • Min, Ung-Gyu;Kwon, Oh-Kyong
    • Journal of Information Display
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    • v.10 no.2
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    • pp.80-86
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    • 2009
  • The variation of the electrical characteristics of thin-film transistors (TFTs) causes a non-uniform image quality problem, and the differential aging of organic light-emitting diode (OLED) devices causes an image-sticking problem. A video data correction method is proposed herein as an effective solution to the non-uniform electro-optical characteristics of the pixels in activematrix organic light-emitting diode (AMOLED) displays. The results of the simulation that was conducted show that the proposed method successfully senses the electrical characteristics of TFTs and the degradation of OLEDs and effectively compensates for them.

Plasma Treatment Effects on Tungsten Oxide Hole Injection Layer for Application to Inverted Top-Emitting Organic Light-Emitting Diodes

  • Kim, Joo-Hyung;Lee, You-Jong;Jang, Yun-Sung;Kim, Doo-Hyun;Hong, Mun-Pyo
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.354-355
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    • 2009
  • In the fabrication of inverted top-emitting organic light emitting diodes (ITOLEDs), the sputtering process is needed for deposition of transparent conducting oxide (TCO) as top anode. Energetic particle bombardment, however, changes the physical properties of underlying layers. In this study, we examined plasma process effects on tungsten oxide ($WO_3$) hole injection layer (HIL). From our results, we suggest the theoretical mechanism to explain the correlation between the physical property changes caused by plasma process on $WO_3$ HIL and degradation of device performances.

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A Study on Dispersion Behaviors of Fume Particles in Laser Cutting Process of Optical Plastic Thin Films

  • Kim, Kyoungjin
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.4
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    • pp.62-68
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    • 2019
  • The optoelectronic display units such as TFT-LCD or OLED require many thin optical plastic films and their mass manufacturing processes employ CO2 laser cutting of those thin films in a large quantity. However, laser film cutting could generate fume particles through melt shearing, vaporization, and chemical degradation and those particles could be of great concern for film surface contamination. In order to appreciate the fume particle dispersion behaviors in laser film cutting, this study relies on random particle simulations by probabilistic distributions of particle size, ejection velocity and angles coupled with Basset-Boussinesq-Oseen model of particle trajectory in low Reynolds number flows. Here, up to one million particles of random sampling have been tested to effectively show fume particles dispersed on the film surface. The computational results could show that particular range of fume particle size could easily disperse into the pixel region of processed optical films.

Flexible Thin Film Encapsulation and Planarization Effectby Low Temperature Flowable Oxide Process

  • Yong, Sang Heon;Kim, Hoonbea;Chung, Ho Kyoon;Chae, Heeyeop
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.431-431
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    • 2013
  • Flexible Organic Light Emitting Diode (OLED) displays are required for future devices. It is possible that plastic substrates are instead of glass substrates. But the plastic substrates are permeable to moisture and oxygen. This weak point can cause the degradation of fabricated flexible devices; therefore, encapsulation process for flexible substrate is needed to protect organic devices from moisture and oxygen. Y.G. Lee et al.(2009) [1] reported organic and inorganic multilayer structure as an encapsulation barrier for enhanced reliability and life-time.Flowable Oxide process is a low-temperature process which shows the excellent gap-fill characteristics and high deposition rate. Besides, planarization is expected by covering dust smoothly on the substrate surface. So, in this research, Bi-layer structured is used for encapsulation: Flowable Oxide Thin film by PECVD process and Al2O3 thin film by ALD process. The samples were analyzed by water vapor transmission rate (WVTR) using the Calcium test and film cross section images were obtained by FE-SEM.

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