• 제목/요약/키워드: OIP5

검색결과 22건 처리시간 0.014초

DSRC 송신기를 위한 능동발룬 내장형 5.8 GHz SiGe 상향믹서 설계 및 제작 (A 5.8 GHz SiGe Up-Conversion Mixer with On-Chip Active Baluns for DSRC Transmitter)

  • 이상흥;이자열;김상훈;배현철;강진영;김보우
    • 한국통신학회논문지
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    • 제30권4A호
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    • pp.350-357
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    • 2005
  • 근거리무선통신 (Dedicated Short Range Communication, DSRC)은 지능형교통시스템 서비스 제공을 위한 통신 수단으로, 수 미터에서 수백 미터인 근거리 영역의 노변장치(Road Side Equipment, RSE)와 차량탑재장치(On-Board Equipment, OBE)와의 양방향 고속통신을 수행하는 통신시스템이다. 본 논문에서는 SiGe HBT 공정을 이용하여 근거리무선통신 송신기용 5.8 GHz 상향믹서를 설계 및 제작하였다. 설계된 상향믹서는 믹서코어 회로와 더불어 IF/LO/RF 입출력 정합 회로, IF/LO 입력 발룬 회로와 RF 출력 발룬 회로가 단일칩으로 구현되었다. 제작된 상향믹서는 $2.7 mm\times1.6mm$의 크기를 가지며, 3.5 dB의 전력변환이득과 -12.5 dBm의 OIP3, 42 dB의 LO to E isolation, 38 dB의 LO to RF isolation, 3.0 V의 공급전압 하에서 29 mA의 전류소모로 측정되었다.

An Wideband GaN Low Noise Amplifier in a 3×3 mm2 Quad Flat Non-leaded Package

  • Park, Hyun-Woo;Ham, Sun-Jun;Lai, Ngoc-Duy-Hien;Kim, Nam-Yoon;Kim, Chang-Woo;Yoon, Sang-Woong
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제15권2호
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    • pp.301-306
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    • 2015
  • An ultra-compact and wideband low noise amplifier (LNA) in a quad flat non-leaded (QFN) package is presented. The LNA monolithic microwave integrated circuit (MMIC) is implemented in a $0.25{\mu}m$ GaN IC technology on a Silicon Carbide (SiC) substrate provided by Triquint. A source degeneration inductor and a gate inductor are used to obtain the noise and input matching simultaneously. The resistive feedback and inductor peaking techniques are employed to achieve a wideband characteristic. The LNA chip is mounted in the $3{\times}3-mm^2$ QFN package and measured. The supply voltages for the first and second stages are 14 V and 7 V, respectively, and the total current is 70 mA. The highest gain is 13.5 dB around the mid-band, and -3 dB frequencies are observed at 0.7 and 12 GHz. Input and output return losses ($S_{11}$ and $S_{22}$) of less than -10 dB measure from 1 to 12 GHz; there is an absolute bandwidth of 11 GHz and a fractional bandwidth of 169%. Across the bandwidth, the noise figures (NFs) are between 3 and 5 dB, while the output-referred third-order intercept points (OIP3s) are between 26 and 28 dBm. The overall chip size with all bonding pads is $1.1{\times}0.9mm^2$. To the best of our knowledge, this LNA shows the best figure-of-merit (FoM) compared with other published GaN LNAs with the same gate length.