• Title/Summary/Keyword: O-plasma treatment

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A Study on the Silicon surface and near-surface contamination by $CHF_3$/$C_2$$F_6$ RIE and its removal with thermal treatment and $O_2$ plasma exposure ($CHF_3$/$C_2$$F_6$ 반응성이온 건식식각에 의한 실리콘 표면의 오염 및 제거에 관한 연구)

  • 권광호;박형호;이수민;곽병화;김보우;권오준;성영권
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.30A no.1
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    • pp.31-43
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    • 1993
  • Thermal behavior and $O_{2}$ plasma effects on residue and penetrated impurities formed by reactive ion etching (RIE) in CHF$_{3}$/C$_{2}$F$_{6}$ have been investigated using X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS) techniques. Decomposition of polymer residue film begins between 200-300.deg. C, and above 400.deg. C carbon compound as graphite mainly forms by in-situ resistive heating. It reveals that thermal decomposition of residue can be completed by rapid thermal anneal above 800.deg. C under nitrogen atmosphere and out-diffusion of penetrated impurities is observed. The residue layer has been removed with $O_{2}$ plasma exposure of etched silicon and its chemical bonding states have been changed into F-O, C-O etc.. And $O_{2}$ plasma exposure results in the decrease of penetrated impurities.

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The study on dry etching characteristics of ZnO thin films using high density plasma (고밀도 플라즈마를 이용한 ZnO 박막의 식각 특성)

  • Heo, Keyong-Moo;Woo, Jong-Chang;Kim, Chang-Il
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.174-174
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    • 2010
  • In this article, the dry etching mechanism of ZnO thin films in $N_2/Cl_2$/Ar gas chemistry was investigated. The ZnO thin films were deposited on Si substrate using Atomic layer deposition. The etching experiments were performed by inductively coupled plasma system. The maximum etch rate was104.5 nm/min and the highest selectivity of ZnO over $SiO_2$ was 3.3. Etching rate was measured by surface profiler. And the chemical reaction on the surface of the etched ZnO thin films was investigated by x-ray photo electrons pectroscopy. As a result of XPS, $Zn2p_{3/2}$ peak shifted toward a higher binding energy and the O-O and N-O bond were obtained from the sample of ZnO thin film which after plasma treatment.

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Influences of Plasma Treatment on the Electrical Characteristics of rf-magnefrom sputtered $BaTa_2O_6$ Thin Films (플라즈마 표면 처리가 $BaTa_2O_6$박막의 전기적 특성에 미치는 효과에 관한 연구)

  • Kim, Young-Sik;Lee, Yun-Hi;Ju, Byeong-Kwon;Sung, Mang-Young;Oh, Myung-Hwan
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.48 no.5
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    • pp.319-325
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    • 1999
  • Direct current(d.c.)leakage current voltage characteristics of radio-frequencymagnetron sputtered BaTa\sub 2\O\sub 6\ film capacitors with aluminum(A1) top and indium tin oxide (ITO) bottom electrodes have been investigatedas a function of applied field and temperature. In order to study surfacetreatment effect on the electrical characteristics of as-deposited film weperformed exposure of oxygen plasma on $BaTa_2O_6$ surface. d. c.current-voltage (I-V), bipolar pulse charge-voltage (Q-V), d. c. current-time (I-t) andcapacitance-frequency (C-f) analysis were performed on films. All ofthe films exhibita low leakage current, a high breakdown field strength (3MV/cm-4.5MV/cm), and high dielectric constant (20-30). From the temperature dependence of leakage current,we can conclude that the dominant conduction mechanism is ascribed toSchottky emission at high electric field (>1MV/cm) and hopping conduction at lowelectric field (<1MV/cm). According to our results, the oxide plasma surfacetreatmenton as-deposited $BaTa_2O_6$ resulted in lowering interfacebarrier height and thus, leakage current when a negative voltage applied to the A1 electrode. This can be explained by reduction of surface contamination via etching surface and filling defects such as oxygen vacancies.

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Luminescence Properties of the OLED with Oxygen Plasma Treated ITO (산소 플라즈마 표면 처리에 의한 OLED 소자의 발광특성)

  • Lim, J.S.;Lim, K.B.;Kim, Y.W.;Hwang, M.H.;Kang, D.H.;Kim, H.G.;Shin, P.K.
    • Proceedings of the KIEE Conference
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    • 2005.07c
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    • pp.1878-1880
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    • 2005
  • In this research, We investigated the effect of $O_2/O_3$ Plasma treatment of indium-tin oxide (ITO) surface on the performance of organic light emitting devices (OLEDs). The OLED had a structure of ITO/N,N'-diphenyl-N,N' -(3-methylphenyl)-1, 1'-biphenyl-4-4'-diamine (TPD)/Tris (8-hydroxyquinolinato) Aluminum $(Alq_3)/Al$. The ITO surface was treated by $O_2/O_3$ plasma with different RF power chamber pressure and exposure time. As a result, the emission efficiency of the OLEDs could be improved obviously.

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Surface Modification with Atmospheric Microwave Agron Plasma Jet Assisted with Admixture of H2O2 and Analysis of Plasma Characteristics

  • Won, I.H.;Shin, H.K.;Kwon, H.C.;Kim, H.Y.;Kang, S.K.;Lee, J.K.
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.544-545
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    • 2013
  • Recently, low-temperature atmospheric-pressure plasmas have been investigated [1,2] for biomedical applications and surface treatments. Experiments for improving hydrophilicity of stainless steel (SUS 304) plate with atmospheric microwave argon and H2O2 mixture plasma jet [3] were carried out and experimental measurements and plasma simulations were conducted for investigating the characteristics of plasma for the process. After 30 s of low power (under 10 W) and low temperature (under $50^{\circ}C$) plasma treatment, the water contact angle decreased rapidly to around $10^{\circ}$ from $75^{\circ}$ and was maintained under $30^{\circ}$ for a day (24 hours). The surface free energy, calculated from the contact angles, increased. The chemical properties of the surface were examined by X-ray Photoelectron Spectroscopy (XPS) and the surface morphology and roughness were examined by Scanning Electron Microscopy (SEM) and Atomic Force Microscopy (AFM) respectively. The characteristics of plasma sources with several frequencies were investigated by Optical Emission Spectroscopy (OES) measurement and one-dimensional Particle-in-Cell (PIC) simulation and zero-dimensional global simulation [4]. The relation between plasma components and the efficacy of the surface modification were discussed.

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The effect of plasma damage on electrical properties of amorphous GaInZnO film

  • Kim, Min-Kyu;Park, Jin-Seong;Jeong, Jae-Kyeong;Jeong, Jong-Han;Ahn, Tae-Kyung;Yang, Hui-Won;Lee, Hun-Jung;Chung, Hyun-Joong;Mo, Yeon-Gon;Kim, Hye-Dong
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.640-643
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    • 2007
  • The effect of plasma damage was investigated on amorphous gallium-indium-zinc oxide (a-GIZO) films and transistors. Ion-bombardment by plasma process affects to turn semiconductor to conductor materials and plasma radiation may degrade to transistor electrical properties. All damages are easily recovered with a $350^{\circ}C$ thermal annealing.

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Hydrophilicity Improvement of Polyamide66/Polyphenylene Blends by Plasma Surface Treatment (Polyamide66/Polyphenylene 블렌드의 플라스마 표면처리를 통한 친수성 향상)

  • Ji Young-Yeon;Kim Sang-Sik
    • Polymer(Korea)
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    • v.30 no.5
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    • pp.391-396
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    • 2006
  • It has been reported that plasma treatments are used to modify surface properties of polymers such as adhesivity hydrophobicity and hydrophilicity. Using plasma treatment, interfacial pro-perty can be introduced to a polymer surface without affecting the desired bulk properties of a material. In this study, commercial polyamide66 (PA66) /polyphenylene (PPE) polymer was modified by plasma treatment under a various gas specious for elimination of organic compound and polymer surface property with hvdrophilicity. PA66/PPE polymer with hydrophilicity was treated by RF plasma vacuum system under a various parameter such as gas specious, processing time and partial pressure. Hydrophilicity of PA66/PPE was confirmed by calculation of the surface free energy from contact angle measurement. The highest surface free energy of $50.03 mJ/m^2$ with the lowest contact angle of $14^{\circ}$ was obtained at plasma process power of 100 W, treatment time of 2 min and $Ar/O_2$ gases of 100 and 200 sccm. Moreover the change of organic compounds on the polymer surface was analyzed by fourier transforms infrared spectrometry (FTIR).

Fabrication of Plasma Resistant Y2O3-Al2O3-SiO2 Coating Ceramics by Melt-Coating Method (용융코팅법에 의한 내플라즈마성 Y2O3-Al2O3-SiO2계 코팅 세라믹스 제조)

  • Park, Eui Keun;Lee, Hyun-Kwuon
    • Korean Journal of Materials Research
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    • v.30 no.7
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    • pp.359-368
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    • 2020
  • This study is aimed at improving the plasma resistance of Al2O3 ceramics on which plasma resistant YAS(Y2O3-Al2O3-SiO2) frit is melt-coated using a simple heat-treatment process. For this purpose, the results of phase analysis and microstructural observations of the prepared YAS frits and the coating layers on the Al2O3 ceramics according to the batch compositions are compared and discussed with regard to the results of plasma resistance test. The prepared YAS frits consist of crystalline or amorphous or co-existing crystalline and amorphous phases according to the batch compositions, depending on the role and content of each raw material. The prepared YAS frit is melt-coated on the densely sintered Al2O3 ceramics, resulting in a dense coating layer with a thickness of at least ~ 80 ㎛. The YAS coating layer consists of crystalline YAG(Y3Al5O12), Y2Si2O7, and Al2O3 phases, and YAS glass phase. Plasma resistance of YAS coated Al2O3 ceramics is strongly dependent on the content of the YAG(Y3Al5O12) and Y2Si2O7 crystalline phases in the coating layer, especially on the content of the YAG phase. Comparing the weight loss of YAS coating ceramics with values obtained for commercial Y2O3, Al2O3, and quartz ceramics, the plasma resistance of the YAS coating ceramics is 6 times higher than that of quartz, 2 times higher than that of Al2O3, and 50 % of the resistance of Y2O3.

Influence of Plasma Treatment on Hydrogen Chloride Removal of Activated Carbon Fibers

  • Park, Soo-Jin;Kim, Byung-Joo;Ryu, Seung-Kon
    • Carbon letters
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    • v.5 no.3
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    • pp.103-107
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    • 2004
  • The atmospheric pressure plasma treatments ($Ar/O_2$ and $Ar/N_2$) of activated carbon fibers (ACFs) were carried out to introduce hydrophilic functional groups on carbon surfaces in order to enhance the hydrogen chloride gas (HCl) adsorption. Surface properties of the ACFs were determined by XPS and SEM. $N_2$/77 K adsorption isotherms were investigated by BET and D-R (Dubinin-Radushkevich) plot methods. The HCl removal efficiency was confirmed by HCl detecting tubes (range:1~40 or 40~1000 ppm). As experimental results, it was found that all plasma-treated ACFs showed the decrease in the pore volume, but the HCl removal efficiency showed higher level than that of the untreated ACFs. This result indicated that the plasma treatments led to the conformation of hydrophilic functional groups on the carbon surfaces, resulting in the increase of the interaction between the ACFs and HCl gas.

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Formation of Al2O3 Film by Activated Reactive Evaporation Method (활성화 반응 증발법에 의한 Al2O3 박막 형성)

  • Park, Yong-Gwon;Choi, Jae-Ha
    • Journal of the Korean Society for Heat Treatment
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    • v.14 no.5
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    • pp.292-296
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    • 2001
  • In this work, an ultra-high vacuum activated reactive evaporation equipment was built. With reaction of Al and oxygen plasma, $Al_2O_3$ was deposited on the surface of etched Al foil. The chamber was evacuated down to $2{\times}10^{-7}$ torr initially. The Ar and $O_2$ gas introduced into the chamber to maintain $5{\times}10^{-5}$ torr during deposition. Ar gas prevents recombining of the ionized oxygen. Evaporation was maintained by electron beam evaporator continuously. Heating filament and electrode were used in order to generate plasma. The substrate bias of -300V was introduced to accelerate deposition of evaporated Al atoms. The composition and morphology of deposited $Al_2O_3$ films were analyzed by x-ray photoelectron spectroscopy(XPS) and atomic force microscopy (AFM), respectively. The Al oxide was formed on the surface of etched Al foil. According to AFM results, the surface morphology of $Al_2O_3$ film indicates uniform feature. Dielectric characteristic was measured as a function of frequency. Measured withstanding voltage and capacitance were 52V and $24{\mu}F/cm^2$, respectively. The obtained $Al_2O_3$ film shows clean condition without contaminants, which could be adapted to capacitor production.

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