• 제목/요약/키워드: Nucleation layers

검색결과 51건 처리시간 0.024초

ICP 표면 처리된 Si 기판 위에 성장된 Ge 층의 초기 성장 상태 연구 (Early stage of heteroepitaxial Ge growth on Si(100) substrate with surface treatments using inductively coupled plasma (ICP))

  • 양현덕;길연호;심규환;최철종
    • 한국결정성장학회지
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    • 제21권4호
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    • pp.153-157
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    • 2011
  • Inductively Coupled Plasma(ICP)를 이용하여 다양한 조건으로 표면 처리한 Si(100) 기관 위에 Low Pressure Chemical Vapor Deposition(LPCVD)를 이용하여 Ge 층을 이종접합 성장하고, Ge 층 성장 초기의 표면 상태를 Scanning Electron Microscopy(SEM)을 통해 분석하였다. ICP를 이용하여 표면 처리된 Si(100) 기판 위에 성장된 Ge 층의 경우 ICP 처리하지 않은 시편보다 Ge 성장율이 약 5배 이상 증가되었다. ICP 처리된 시편의 Ge 성장률 증가는 ICP 표면 처리 공정으로 Si 기관 표면에서 떨어져 나간 missing dimer가 Ge adatom들에 핵을 형성할 자리를 제공하여 Ge island의 형성과 융합을 촉진시키는 것으로 사료된다.

Sol-gel법으로 제조된 $\textrm{PbTiO}_3$ 박막의 온도에 따른 수축 및 응력거동 (In Situ Shrinkage and Stress Development for $\textrm{PbTiO}_3$, Films Prepared by Sol-gel Process)

  • 박상면
    • 한국재료학회지
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    • 제9권7호
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    • pp.735-739
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    • 1999
  • 본 연구에서는 sol-gel법으로 제조된 $PbTiO_3$ (PT) 단층박막내의 실시간 응력과 두께 수축거동, 그리고 다층박막의 미세경도를 온도의 함수로 측정하여 열처리에 따른 PT박막내의 물리화학적 변화를 설명하였다. 단층박막은 상온에서 $220^{\circ}C$까지 급격한 수축을 보였으며 총수축량의 83%가 이 온도구간에서 일어났다. as-spun된 박막 내에는 이미 75MPa의 인장응력이 존재하였으며 13$0^{\circ}C$부터 뚜렷이 증가하여 $250^{\circ}C$에서 147MPa의 최대 인장응력을 나타냈다. 인장응력의 급격한 감소가 일어나는 $370^{\circ}C$부터는 본격적으로 치밀화된 PT박막과 Si 기판과의 열팽창계수 차이가 주로 박막내의 응력을 결정하며, 이것은 다층박막의 미세경도가 $300^{\circ}C$ 이후에서 급격히 증가하는 사실로도 뒷받침된다. 한편 다층박막에서 단층박막과 달리 $550^{\circ}C$까지 열처리후 Perovskite 상이 많이 생성되었으며 이는 박막 두께의 증가에 따른 homogenous 핵생성 site의 증가 때문이라고 생각된다

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Magnetization Process in Vortex-imprinted Ni80Fe20/Ir20Mn80 Square Elements

  • Xu, H.;Kolthammer, J.;Rudge, J.;Girgis, E.;Choi, B.C.;Hong, Y.K.;Abo, G.;Speliotis, Th.;Niarchos, D.
    • Journal of Magnetics
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    • 제16권2호
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    • pp.83-87
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    • 2011
  • The vortex-driven magnetization process of micron-sized, exchange-coupled square elements with composition of $Ni_{80}Fe_{20}$ (12 nm)/$Ir_{20}Mn_{80}$ (5 nm) is investigated. The exchange-bias is introduced by field-cooling through the blocking temperature (TB) of the system, whereby Landau-shaped vortex states of the $Ni_{80}Fe_{20}$ layer are imprinted into the $Ir_{20}Mn_{80}$. In the case of zero-field cooling, the exchange-coupling at the ferromagnetic/antiferromagnetic interface significantly enhances the vortex stability by increasing the nucleation and annihilation fields, while reducing coercivity and remanence. For the field-cooled elements, the hysteresis loops are shifted along the cooling field axis. The loop shift is attributed to the imprinting of displaced vortex state of $Ni_{80}Fe_{20}$ into $Ir_{20}Mn_{80}$, which leads to asymmetric effective local pinning fields at the interface. The asymmetry of the hysteresis loop and the strength of the exchange-bias field can be tuned by varying the strength of cooling field. Micromagnetic modeling reproduces the experimentally observed vortex-driven magnetization process if the local pinning fields induced by exchange-coupling of the ferromagnetic and antiferromagnetic layers are taken into account.

알루미늄 기판 상의 Ni layer가 a-Si의 AIC(Aluminum Induced Crystallization)에 미치는 영향 (Effects of Ni layer as a diffusion barrier on the aluminum-induced crystallization of the amorphous silicon on the aluminum substrate)

  • 윤원태;김영관
    • 한국결정성장학회지
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    • 제22권2호
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    • pp.65-72
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    • 2012
  • 본 연구에서는 비정질 실리콘의 알루미늄 유도 결정화(AIC)가 시도되었다. 결정질 실리콘의 좀 더 큰 입자를 얻기 위해, 선택적인 핵생성(Selective nucleation) 시도는 비정질 실리콘 밑의 실리카($SiO_2$) 층의 습식 파우더 분사 처리와 함께 진행됐다. 또한 니켈 층은 실리콘 원자가 알루미늄 층으로 이동하는 것을 방지하기 위한 확산 방지막(Diffusion barrier)으로 선택되었다. $520^{\circ}C$에서 열처리를 한 후에 XRD 분석을 통해 Si(111) 방향으로 결정화된 결정질 실리콘을 확인했고 니켈은 실리콘과 알루미늄 사이의 확산 방지막으로 매우 효과적인 재료라는 것을 입증하였다. 이 연구는 고성능의 태양전지에 적용하는 결정질 실리콘 막의 좀 더 큰 입자를 얻기 위한 방법 중의 하나라고 기대된다.

LASER 광려기 기상반응에 의한 III-V 족계 광전재기의 Hetero-Epitaxy 고찰 (LASER-Induced Vapour Phase Hetero-Epitaxy of A^{III}\;B^V$ Type Opto-Electronics)

  • 우희조;박승민
    • 한국결정학회지
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    • 제1권2호
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    • pp.99-104
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    • 1990
  • 본 연구에서는 고밀도 광원 활용에 의한 유기금속화합물의 광분해 반응을 이용하여 AmBv 형광 전재료의 Hetero-epitaxy를 고찰하였다. 실제로 ArF Excimer laser(파장 193nm)에 의 하여 III족원으로 trlmethylgallium과 V족원으로 Ammonia의 2분자간 광분해 반응을 이용, (001)면 Sapphire 기판상에 증착시켰다. 생성되는 성막상태는 주사식 전자현미경, X-ray 회절 및 전자선 회절법 (RED)에 의하여 평가하였다. Laser광려기 유무에 따라 결정병합 상태 및 결정형태에 현저한 차이를 관찰할 수 있었으며, 특히 결정격자의 방위성에 큰 영향을 주고 있음이 주목되었다. 광원 조사방법은 수직조사에 의한 기판면 여기보다는 수평조사에 의 한 기상 반응물 여기가 더 효과적 이였다. Laser 광여기에 의한 성막층의 격자형성은 다음 과 같은 2가지 Model중 하나로 설명 할 수 있었다. (001)면 Sapphire//wurzite형 GaN의 (001) 면 또는 (001)면 Sapphire//wurzite형 GaN인의 (001) 면 -t Twinned Zincblende형의 GaN(111)면

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초음파 분무 열분해 증착 중 기판 회전 속도에 따른 플루오린 도핑 된 주석산화물 막의 전기적 및 광학적 특성 (Electrical and Optical Properties of Fluorine-Doped Tin Oxide Films Fabricated at Different Substrate Rotating Speeds during Ultrasonic Spray Pyrolysis Deposition)

  • 이기원;조명훈;안효진
    • 한국재료학회지
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    • 제34권1호
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    • pp.55-62
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    • 2024
  • Fluorine-doped tin oxide (FTO) has been used as a representative transparent conductive oxide (TCO) in various optoelectronic applications, including light emitting diodes, solar cells, photo-detectors, and electrochromic devices. The FTO plays an important role in providing electron transfer between active layers and external circuits while maintaining high transmittance in the devices. Herein, we report the effects of substrate rotation speed on the electrical and optical properties of FTO films during ultrasonic spray pyrolysis deposition (USPD). The substrate rotation speeds were adjusted to 2, 6, 10, and 14 rpm. As the substrate rotation speed increased from 2 to 14 rpm, the FTO films exhibited different film morphologies, including crystallite size, surface roughness, crystal texture, and film thickness. This FTO film engineering can be attributed to the variable nucleation and growth behaviors of FTO crystallites according to substrate rotation speeds during USPD. Among the FTO films with different substrate rotation speeds, the FTO film fabricated at 6 rpm showed the best optimized TCO characteristics when considering both electrical (sheet resistance of 13.73 Ω/□) and optical (average transmittance of 86.76 % at 400~700 nm) properties with a figure of merit (0.018 Ω-1).

초경합금에 나노결정질 다이아몬드 코팅 시 금속 중간층의 효과 (Effect of Metal Interlayers on Nanocrystalline Diamond Coating over WC-Co Substrate)

  • 나봉권;강찬형
    • 한국표면공학회지
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    • 제46권2호
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    • pp.68-74
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    • 2013
  • For the coating of diamond films on WC-Co tools, a buffer interlayer is needed because Co catalyzes diamond into graphite. W and Ti were chosen as candidate interlayer materials to prevent the diffusion of Co during diamond deposition. W or Ti interlayer of $1{\mu}m$ thickness was deposited on WC-Co substrate under Ar in a DC magnetron sputter. After seeding treatment of the interlayer-deposited specimens in an ultrasonic bath containing nanometer diamond powders, $2{\mu}m$ thick nanocrystalline diamond (NCD) films were deposited at $600^{\circ}C$ over the metal layers in a 2.45 GHz microwave plasma CVD system. The cross-sectional morphology of films was observed by FESEM. X-ray diffraction and visual Raman spectroscopy were used to confirm the NCD crystal structure. Micro hardness was measured by nano-indenter. The coefficient of friction (COF) was measured by tribology test using ball on disk method. After tribology test, wear tracks were examined by optical microscope and alpha step profiler. Rockwell C indentation test was performed to characterize the adhesion between films and substrate. Ti and W were found good interlayer materials to act as Co diffusion barriers and diamond nucleation layers. The COFs on NCD films with W or Ti interlayer were measured as less than 0.1 whereas that on bare WC-Co was 0.6~1.0. However, W interlayer exhibited better results than Ti in terms of the adhesion to WC-Co substrate and to NCD film. This result is believed to be due to smaller difference in the coefficients of thermal expansion of the related films in the case of W interlayer than Ti one. By varying the thickness of W interlayer as 1, 2, and $4{\mu}m$ with a fixed $2{\mu}m$ thick NCD film, no difference in COF and wear behavior but a significant change in adhesion was observed. It was shown that the thicker the interlayer, the stronger the adhesion. It is suggested that thicker W interlayer is more effective in relieving the residual stress of NCD film during cooling after deposition and results in stronger adhesion.

Simulation study on effects of loading rate on uniaxial compression failure of composite rock-coal layer

  • Chen, Shao J.;Yin, Da W.;Jiang, N.;Wang, F.;Guo, Wei J.
    • Geomechanics and Engineering
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    • 제17권4호
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    • pp.333-342
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    • 2019
  • Geological dynamic hazards during coal mining can be caused by the failure of a composite system consisting of roof rock and coal layers, subject to different loading rates due to different advancing velocities in the working face. In this paper, the uniaxial compression test simulations on the composite rock-coal layers were performed using $PFC^{2D}$ software and especially the effects of loading rate on the stress-strain behavior, strength characteristics and crack nucleation, propagation and coalescence in a composite layer were analyzed. In addition, considering the composite layer, the mechanisms for the advanced bore decompression in coal to prevent the geological dynamic hazards at a rapid advancing velocity of working face were explored. The uniaxial compressive strength and peak strain are found to increase with the increase of loading rate. After post-peak point, the stress-strain curve shows a steep stepped drop at a low loading rate, while the stress-strain curve exhibits a slowly progressive decrease at a high loading rate. The cracking mainly occurs within coal, and no apparent cracking is observed for rock. While at a high loading rate, the rock near the bedding plane is damaged by rapid crack propagation in coal. The cracking pattern is not a single shear zone, but exhibits as two simultaneously propagating shear zones in a "X" shape. Following this, the coal breaks into many pieces and the fragment size and number increase with loading rate. Whereas a low loading rate promotes the development of tensile crack, the failure pattern shows a V-shaped hybrid shear and tensile failure. The shear failure becomes dominant with an increasing loading rate. Meanwhile, with the increase of loading rate, the width of the main shear failure zone increases. Moreover, the advanced bore decompression changes the physical property and energy accumulation conditions of the composite layer, which increases the strain energy dissipation, and the occurrence possibility of geological dynamic hazards is reduced at a rapid advancing velocity of working face.

단일 스텝 스핀 코팅 방법에서 증발 제어 공정 변경에 따른 페로브스카이트 박막 물성 및 태양 전지 소자 특성 변화에 관한 연구 (Properties of Perovskite Materials and Devices Fabricated Using the Solvent Engineered One-Step Spin Coating Method)

  • 오정석;권남희;차덕준;양정엽
    • 새물리
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    • 제68권11호
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    • pp.1208-1214
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    • 2018
  • 단일 스텝 스핀 코팅 (one-step spin coating) 공정은 $MAPbI_3$ 페로브스카이트 (Perovskite) 박막의 결정화가 우수하여 고효율 태양 전지 제작이 가능하다. 이 공정의 핵심은 솔벤트 증발 제어 공정을 사용하는 것인데, 이는 스핀 코팅 시 $MAPbI_3$ 의 용해도를 증가 시킬 수 있는 용매를 투입하는 (dripping) 방식이다. 본 연구에서 용매의 양, 투입속도 및 시간에 따라 생성되는 $MAPbI_3$의 특성을 분석하고, 이렇게 만들어진 박막을 이용한 태양 전지 특성을 조사하였다. $MAPbI_3$ 박막 형성을 위하여 lead iodide, methyl-ammonium iodide를 N,N-dimethylformamide에 녹이고, N,N-dimethyl sulfoxide를 첨가하여 용액을 만들었으며, 증발 제어 공정을 위한 용매로 diethyl ether (DE)를 사용하였다. DE의 투입 조건에 따라 $MAPbI_3$ 박막 형성 시 핵 생성에 차이가 생기고, 이는 $MAPbI_3$의 결정화, 밀도 및 표면 상태에 영향을 미치는 것으로 나타났으며, 이에 따라 태양 전지의 효율이 달라지는 것을 알 수 있었다. 0.7 mL의 DE의 양, 3.03 mL/sec 투입 속도, 7초(스핀 코팅 시작 후 투입시간)의 솔벤트 증발 제어 공정 결과 최대 13.74% 효율을 가지는 태양 전지 소자를 재현성 있게 관측할 수 있었다.

Direct Imaging of Polarization-induced Charge Distribution and Domain Switching using TEM

  • 오상호
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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    • pp.99-99
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    • 2013
  • In this talk, I will present two research works in progress, which are: i) mapping of piezoelectric polarization and associated charge density distribution in the heteroepitaxial InGaN/GaN multi-quantum well (MQW) structure of a light emitting diode (LED) by using inline electron holography and ii) in-situ observation of the polarization switching process of an ferroelectric Pb(Zr1-x,Tix)O3 (PZT) thin film capacitor under an applied electric field in transmission electron microscope (TEM). In the first part, I will show that strain as well as total charge density distributions can be mapped quantitatively across all the functional layers constituting a LED, including n-type GaN, InGaN/GaN MQWs, and p-type GaN with sub-nm spatial resolution (~0.8 nm) by using inline electron holography. The experimentally obtained strain maps were verified by comparison with finite element method simulations and confirmed that not only InGaN QWs (2.5 nm in thickness) but also GaN QBs (10 nm in thickness) in the MQW structure are strained complementary to accommodate the lattice misfit strain. Because of this complementary strain of GaN QBs, the strain gradient and also (piezoelectric) polarization gradient across the MQW changes more steeply than expected, resulting in more polarization charge density at the MQW interfaces than the typically expected value from the spontaneous polarization mismatch alone. By quantitative and comparative analysis of the total charge density map with the polarization charge map, we can clarify what extent of the polarization charges are compensated by the electrons supplied from the n-doped GaN QBs. Comparison with the simulated energy band diagrams with various screening parameters show that only 60% of the net polarization charges are compensated by the electrons from the GaN QBs, which results in the internal field of ~2.0 MV cm-1 across each pair of GaN/InGaN of the MQW structure. In the second part of my talk, I will present in-situ observations of the polarization switching process of a planar Ni/PZT/SrRuO3 capacitor using TEM. We observed the preferential, but asymmetric, nucleation and forward growth of switched c-domains at the PZT/electrode interfaces arising from the built-in electric field beneath each interface. The subsequent sideways growth was inhibited by the depolarization field due to the imperfect charge compensation at the counter electrode and preexisting a-domain walls, leading to asymmetric switching. It was found that the preexisting a-domains split into fine a- and c-domains constituting a $90^{\circ}$ stripe domain pattern during the $180^{\circ}$ polarization switching process, revealing that these domains also actively participated in the out-of-plane polarization switching. The real-time observations uncovered the origin of the switching asymmetry and further clarified the importance of charged domain walls and the interfaces with electrodes in the ferroelectric switching processes.

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