• 마이크로전자및패키징학회지
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• 제20권4호
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• pp.65-68
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• 2013

A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. It features maskless screen printing process. A selective solder bumping mechanism without the mask is based on the material design of SBM. Maskless screen printing process can implement easily a fine-pitch, low-cost, and lead-free solder-on-pad (SoP) technology. Its another advantage is ternary or quaternary lead-free SoP can be formed easily. The process includes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrate and the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to the pads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 ${\mu}m$ is, successfully, formed.

• Advances in nano research
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• 제15권1호
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• pp.1-13
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• 2023

Ti₃C₂T_x MXene, a 2D material, is known to exhibit unique characteristics that are strongly dependent on surface termination groups. Here, we developed a novel annealing approach with Ca as a reducing agent to simultaneously remove F and O groups from the surface of multilayered MXene powder. Unlike H₂ annealing that removes F effectively but has difficulty in removing O, annealing with Ca effectively removed both O and F. X-ray photoelectron spectroscopy (XPS) and energy dispersive X-ray spectroscopy revealed that the proposed approach effectively removed F and O from the MXene powder. The results of O/N analyses showed that the O concentration decreased by 57.5% (from 2.66 to 1.13 wt%). In addition, XPS fitting showed that the volume fraction of metal oxides (TiO₂ and Al₂O₃) decreased, while surface termination groups (-O and -OH) were enhanced, which could increase the hydrophilic and adsorption properties of the MXene. These findings suggest that when F and O are removed from the MXene powder, the interlayer spacing of its lattice structure increases. The proposed treatment also resulted in an increase in the specific surface area (from 5.17 to 10.98 m²/g), with an increase in oxidation resistance temperature in air from ~436 to ~667 ℃. The benefits of this novel technology were verified by demonstrating the significantly improved cyclic charge-discharge characteristics of a lithium-ion battery with a Ca-treated MXene electrode.

• Membrane and Water Treatment
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• 제9권2호
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• pp.95-104
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• 2018

Copper pollution around the world has caused serious public health problems recently. The heavy metal adsorption on traditional membranes from wastewater is limited by material properties. Different adsorptive materials are embedded in the membrane matrix and act as the adsorbent for the heavy metal. The carbonized leaf powder has been proven as an effective adsorbent material in removing aqueous Cu(II) because of its relative high specific surface area and inherent beneficial groups such as amine, carboxyl and phosphate after carbonization process. Factors affecting the adsorption of Cu(II) include: adsorbent dosage, initial Cu(II) concentration, solution pH, temperature and duration. The kinetics data fit well with the pseudo-first order kinetics and the pseudo-second order kinetics model. The thermodynamic behavior reveals the endothermic and spontaneous nature of the adsorption. The adsorption isotherm curve fits Sips model well, and the adsorption capacity was determined at 61.77 mg/g. Based on D-R model, the adsorption was predominated by the form of physical adsorption under lower temperatures, while the increased temperature motivated the form of chemical adsorption such as ion-exchange reaction. According to the analysis towards the mechanism, the chemical adsorption process occurs mainly among amine, carbonate, phosphate and copper ions or other surface adsorption. This hypothesis is confirmed by FT-IR test and XRD spectra as well as the predicted parameters calculated based on D-R model.

• 대한화장품학회지
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• 제32권1호
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• pp.45-51
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• 2006

화장품에서 색조 화장품 분야에서 분체의 함유율이 높은 투웨이케익, 팩트, 페이스파우더와 같은 파우더류 제품은 함유되는 분체의 물성이 품질에 큰 영향 인자로 작용하기 때문에 분체의 복합화, 금속비누 처리, 아미노산처리, 실리콘처리, 불소 처리등을 통한 품질 향상을 목적으로 표면처리가 시도되어 왔다. 위와 같은 파우더류 제품중에 투웨이케익은 커버력이 가장 요구되는 제품으로서 부착성이나 퍼짐성과 같은 부가품질의 동시 구현이 다른 파우더류 제품보다 어려우며, 화장을 두껍게 느끼거나 답답하다는 사용자들의 잠재불만도 존재하는 제품군이다. 본 연구는 투웨이케익 제품의 중요품질인 부착성과 퍼짐성을 향상시키고, 친화성을 충분히 고려한 새로운 표면처리 방법으로서 피부성분과 구조를 모사하여, 스킨케어에 주로 사용하는 성분들로 나노베시클을 제조하여 그 구조를 파괴하지 않은 상태로 표면 처리하는 방법에 대한 것이다. 분체를 제조하기 위해 먼저, 레시친, 세라마이드, 초산토코페롤, 부틸렌글리롤을 사용하여 고압.유화로 나노유화물을 제조하였고, 이것을 수상에 분산된 체질안료 분산액에 투입, 2가 금속염 용액을 투입한 후, 여과, 건조과정을 통해 나노베시클이 피복된 새로운 기능의 분체를 얻었다. 피복되는 공정에서는 금속염의 농도에 따라 피복량이 결정됨을 확인하였고, 피복된 파우더의 물성에서는 현재 주로 사용하는 실리콘 처리체질안료에 비해 본 연구를 통해 제조된 파우더의 마찰계수가 낮았으며, 외력에 의한 부착성 평가에서도 파우더의 이탈량이 적은 결과를 나타내었다. 또한 이를 함유한 투웨이케익과 함유하지 않은 투웨이케익의 평가에서도 같은 경향의 결과를 나타내었다.

• 한국분말재료학회지
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• 제23권3호
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• pp.213-220
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• 2016

In this study, bulk nickel-carbon nanotube (CNT) nanocomposites are synthesized by a novel method which includes a combination of ultrasonication, electrical explosion of wire in liquid and spark plasma sintering. The mechanical characteristics of the bulk Ni-CNT composites synthesized with CNT contents of 0.7, 1, 3 and 5 wt.% are investigated. X-ray diffraction, optical microscopy and field emission scanning electron microscopy techniques are used to observe the different phases, morphologies and structures of the composite powders as well as the sintered samples. The obtained results reveal that the as-synthesized composite exhibits substantial enhancement in the microhardness and values more than 140 HV are observed. However an empirical reinforcement limit of 3 wt.% is determined for the CNT content, beyond which, there is no significant improvement in the mechanical properties.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.545-550
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• 2002

In order to ensure the signal could be transported cocrrectly, the microwave devices made of Aluminmn alloys must be assembled and brazed flaw-freely. In this paper, a new approach of using contact reactive brazing (CRB) process to realize the compact brazing of Aluminum alloys was put forward. The reason for this is that CRB, which realizes bonding depending on the liquid alloy produced by metallurgy reaction between the materials to be joined, overcomes the limitation of traditional brazing that the macroscopically disorganized filling flow of liquid filler metal would result in defects in brazed seam. Joint ofLF21 (AA3003) with the compactness of over 95% was brazed by the method of CRB using Si powder as an interlayer. At last, the influence of the physical parameter related to the Si powder interlayer on the compactness of the joints was investigated in detail.

• Bulletin of the Korean Chemical Society
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• 제26권4호
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• pp.594-598
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• 2005

Treatment of a solution of $CuCl_2$ in dimethyl phosphate (DMP) with DMSO under nitrogen atmosphere afforded to a light blue fluorescence powder. Slow evaporation of $H_2O$-DMSO solution of this powder resulted in blue-sky crystals of a new polymeric Cu(II) complex, with a unit cell composed of $Cu_2(DMP)_4$(DMSO), (1). The crystal and molecular structure of the complex acquired crystallographically. Compound (1) crystallizes in the monoclinic space group $P2_1$/n with a = 12.8920(11) $\AA$, b = 13.1966(11) $\AA$, c = 14.7926(13) $\AA$, $\alpha$ = 90$^{\circ}$, $\beta$ = 98.943(2)$^{\circ}$, $\gamma$ = 90$^{\circ}$, V= 2486.1(4) ${\AA}^3$, and Z = 4. A square pyramidal environment for the metal center was established by coordination of oxygen atoms of four bridging DMP ligands in the basal positions and binding a tri-centered oxygen atom of DMSO in the apical disposition of Cu(II). The sixth position was also affected by a weak interaction with the sulfur atom of another DMSO. The phosphorous atom in the bridging DMP was arranged in a deformed tetrahedron with (gg) conformation for methyl esters with $C_{2v}$ symmetry.

• ETRI Journal
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• 제33권6호
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• pp.864-870
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• 2011

As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy-dispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.

• 한국분말재료학회지
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• 제29권3호
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• pp.233-239
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• 2022

Aluminum alloys are extensively employed in several industries, such as automobile, aerospace, and architecture, owing to their high specific strength and electrical and thermal conductivities. However, to meet the rising industrial demands, aluminum alloys must be designed with both excellent mechanical and thermal properties. Computer-aided alloy design is emerging as a technique for developing novel alloys to overcome these trade-off properties. Thus, the development of a new experimental method for designing alloys with high-throughput confirmation is gaining focus. A new approach that rapidly manufactures aluminum alloys with different compositions is required in the alloy design process. This study proposes a combined approach to rapidly investigate the relationship between the microstructure and properties of aluminum alloys using a direct energy deposition system with a dual-nozzle metal 3D printing process. Two types of aluminum alloy powders (Al-4.99Si-1.05Cu-0.47Mg and Al-7Mg) are employed for the 3D printing-based combined method. Nine types of Al-Si-Cu-Mg alloys are manufactured using the combined method, and the relationship between their microstructures and properties is examined.

• 한국주조공학회지
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• 제22권5호
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• pp.265-270
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• 2002

A novel jewelry master pattern manufacturing process which reduce manufacturing steps by employing a Duraform rapid prototyping mold and a low melting alloy has been suggested. The novel process follows the steps of 'jewelry 3D CAD design ${\rightarrow}$ Durafrom RP mold ${\rightarrow}$ low melting alloy master pattern' while the previous process follows more complicated steps of 'jewelry idea sketch ${\rightarrow}$ detailed drawing ${\rightarrow}$ wax carving ${\rightarrow}$ flask ${\rightarrow}$ silver master pattern.' An upper and a lower part of molds have been manufactured of Duraform powder, of which melting point is $190^{\circ}C$. A maser pattern was manufactured by pouring a low melting alloy of Pb-Sn-Bi-Cd, so called Woods Metal, of which melting point is $70^{\circ}C$, into the mold. The master pattern is a shape of a disk of 20mm diameter that contains various design factors. The variations of dimensions, surface roughness, surface pore ratio were measured by an optical microscope, a surface roughness profilometer, and a Rockwell hardness tester. The pattern made of were maeasured by an optical microscope, a surface roughness profilometer, and a Rockwell hardness tester. The pattern made of low melting alloy has sufficient surface hardness, and surface pore ratio to be used as the jewelry master pattern.