• The Journal of Korean Institute of Communications and Information Sciences
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• v.31 no.11A
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• pp.1053-1058
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• 2006

In this paper, We proposed a efficient OSA(Optical Sub-Assembly) packaging method in use 1.31/1.49um bi-directional hybrid-integrated PLC chip for low-cost OSA in optical access network system applications as GE-PON in FTTH. Fabricated OSA with passive optical fiber alignment and nonhermetic plastic package method and measured optical coupling efficiency and electric-optical characteristics. Its performance is feasible to satisfy the GE-PON ONU specifications with the results as less than 0.5dB coupling losses within 40um alignment of z-axis and less than -24dBm sensitivity. It also has good temperature characteristics to sustain optical output power more than 1.5mW and 10dB extinction ratio, less than 0.3dB tracking error.