• Textile Coloration and Finishing
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• v.35 no.4
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• pp.274-283
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• 2023

Conductive polymers are polymers that conduct electricity like metal conductors. Unlike typical organic polymers, they are polymers that have the electrical, magnetic, and optical properties of metals or semiconductors. For Example, these conductive polymers include Polypyrrole (PPy), Polyaniline (PANI), and Polythiophene (PT). On the other hand, Insulating polymers do not conduct electricity well while providing insulation, which is the opposite of conductivity. With the exception of conductive polymers, most polymers are non-conductors. Insulating polymers include polyimide (PI), polystyrene (PS), and poly(vinyl alcohol) (PVOH, PVA, or PVAl). Although many different polymers exist, we have simply illustrated the properties and recent developments of conductive and insulating polymers, which have opposite properties.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.205-206
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• 2008

The transparent conductive film was prepared by bar coating method of poly (3, 4-ethylenedioxythiophene) (PEDOT) and poly (sodium 4-stylenesulfonate) grafted multi-walled carbon nanotubes (MWNT-PSS) nanocomposites solution on the polyethylene terephthalate (PET) film. In this case, multi-wall carbon nanotubes was treated by chemical methods to obtain water soluble MWNT-PSS and then blending with PEDOT. The non-covalent bonding of polymer to the MWNT surface was confirmed by Fourier transform infrared (FT-IR), thermal gravimetric analysis (TGA) and Transmission electro microscope (TEM) investigation also showed a polymer-wrapped MWNT structure. Furthermore, the electrical, transmission properties of the transparent conductive film were investigated and compared with control samples are raw PEDOT films.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.33-38
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• 2007

We studied a bonding at low temperature using polymer bump and Non-Conductive Adhesive (NCA), and studied the reliability of the polymer bump/Al pad joints. The polymer bumps were formed on oxidized Si substrates by photolithography process, and the thin film metals were formed on the polymer bumps using DC magnetron sputtering. The substrate used was AL metallized glass. The polymer bump and Al metallized glass substrates were joined together at $80^{\circ}C$ under various pressure. Two NCAs were applied during joining. Thermal cycling test ($0^{\circ}C-55^{\circ}C$, cycle/30 min) was carried out up to 2000 cycles to evaluate the reliability of the joints. The bondability was evaluated by measuring the contact resistance of the joints through the four point probe method, and the joints were observed by Scanning Electron Microscope (SEM). The contact resistance of the joints was $70-90m{\Omega}$ before the reliability test. The joints of the polymer bump/Al pad were damaged by NCA filler particles under pressure above 200 MPa. After reliability test, some joints were electrically failed since thinner metal layers deposited at the edge of bumps were disconnected.

• Composites Research
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• v.20 no.6
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• pp.1-7
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• 2007

Expanded graphite/carbon fiber hybrid conductive polymer composites were fabricated by the preform molding technique. The conductive fillers were mechanically mixed with a phenol resin to provide an electrical property to composites. The conductive filler loading was fixed at 60wt.% to accomplish a high electrical conductivity. Expanded graphites were excellent in forming a conductive networking by direct contacts between them while it was hard to get the high flexural strength over 40MPa with using only expanded graphite and phenol resin. In this study, carbon fibers were added in composites to compensate the weakened flexural strength. The effect of carbon fibers on the mechanical and electrical properties was examined according to the weight ratio of carbon fiber. As the carbon fiber ratio increased, the flexural strength increased until the carbon fiber ratio of 24wt.%, and then decreased afterward. The electrical conductivity gradually decreased as the increase of the carbon fiber ratio. This was attributed to the non-conducting regions generated among the carbon fibers and the reduction of the direct contact areas between expanded graphites.

• Composites Research
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• v.19 no.2
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• pp.7-12
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• 2006

Graphite particle/carbon fiber hybrid conductive polymer composites were fabricated by the compression molding technique. Graphite particles were mixed with an epoxy resin to impart the electrical conductivity in the composite materials. In this study, graphite reinforced conductive polymer composites with high filler loadings were manufactured to accomplish high electrical conductivity above 100S/cm. Graphite particles were the main filler to increase the electrical conductivity of composites by direct contact between graphite particles. While high filler loadings are needed to attain good electrical conductivity, the composites becomes brittle. So carbon fiber was added to compensate weakened mechanical property. With increasing the carbon fiber loading ratio, the electrical conductivity gradually decreased because non-conducting regions were generated in the carbon fiber cluster among carbon fibers, while the flexural strength increased. In the case of carbon fiber 20wt.% of the total system, the electrical conductivity decreased 27%, whereas the flexural strength increased 12%.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Korean Journal of Materials Research
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• v.30 no.10
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• pp.522-532
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• 2020

Conductive polymer composites with high electrical and mechanical properties are in demand for bipolar plates of phosphoric acid fuel cells (PAFC). In this study, composites based on natural graphite/fluorinated ethylene propylene (FEP) and different ratios of carbon black are mixed and hot formed into bars. The overall content of natural graphite is replaced by carbon black (0.2 wt% to 3.0 wt%). It is found that the addition of carbon black reduces electrical resistivity and density. The density of composite materials added with carbon black 3.0 wt% is 2.168 g/㎤, which is 0.017 g/㎤ less than that of non-additive composites. In-plane electrical resistivity is 7.68 μΩm and through-plane electrical resistivity is 27.66 μΩm. Compared with non-additive composites, in-plane electrical resistivity decreases by 95.7 % and through-plane decreases by 95.9 %. Also, the bending strength is about 30 % improved when carbon black is added at 2.0 wt% compared to non-additive cases. The decrease of electrical resistivity of composites is estimated to stem from the carbon black, which is a conductive material located between melted FEP and acts a path for electrons; the increasing mechanical properties are estimated to result from carbon black filling up pores in the composites.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1666-1669
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• 2006

Plextronics develops conductive polymer technology (trademarked $Plexcore^{TM}$) that will enable the broad market commercialization of printed electronic devices. This talk will emphasize advances to our $Plexcore^{TM}$ HIL technology - a soluble non-acidic hole injection layer (HIL) technology for OLEDs . which is designed to dramatically improve device efficiency and lifetime of flat panel displays and solid state white-lighting.