• 정보과학회 논문지
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• 제43권5호
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• pp.524-530
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• 2016

기존보다 데이터를 빠르게 접근하기 위한 노력과 비-휘발성 메모리의 발전은 메모리 파일 시스템 연구에 큰 기여를 해왔다. 메모리 파일 시스템은 파일 입출력의 고성능을 위해서 기존에 사용하는 읽기-쓰기 입출력보다 오버헤드가 적은 메모리 맵 파일 입출력을 사용하도록 제안하고 있다. 하지만 메모리 맵 파일 입출력을 사용하게 되면서 페이지 테이블을 구축할 때 발생하는 오버헤드가 전체 입출력 성능의 큰 부분을 차지하게 되었다. 또한 같은 파일이 반복적으로 접근될 때마다 페이지 테이블을 매번 삭제하기 때문에, 오버헤드가 불필요하게 중복되어서 발생한다는 점을 발견했다. 본 논문이 제안하는 매핑 캐시는 이러한 중복되는 오버헤드를 제거하기 위해서, 매핑이 해제될 때 파일의 페이지 테이블을 제거하지 않고 저장하고 있다가 다시 접근될 때 이를 재활용할 수 있도록 고안한 기법이다. 매핑 캐시는 기존 파일 입출력 성능보다 2.8배, 그리고 웹서버 전체 성능보다 12% 향상을 보였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.390-390
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• 2012

Information technology industries has grown rapidly and demanded alternative memories for the next generation. The most popular random access memory, dynamic random-access memory (DRAM), has many advantages as a memory, but it could not meet the demands from the current of developed industries. One of highlighted alternative memories is magnetic random-access memory (MRAM). It has many advantages like low power consumption, huge storage, high operating speed, and non-volatile properties. MRAM consists of magnetic-tunnel-junction (MTJ) stack which is a key part of it and has various magnetic thin films like CoFeB, FePt, IrMn, and so on. Each magnetic thin film is difficult to be etched without any damages and react with chemical species in plasma. For improving the etching process, a high density plasma etching process was employed. Moreover, the previous etching gases were highly corrosive and dangerous. Therefore, the safety etching gases are needed to be developed. In this research, the etch characteristics of CoFeB magnetic thin films were studied by using an inductively coupled plasma reactive ion etching in $CH_4/O_2/Ar$ gas mixes. TiN thin films were used as a hardmask on CoFeB thin films. The concentrations of $O_2$ in $CH_4/O_2/Ar$ gas mix were varied, and then, the rf coil power, gas pressure, and dc-bias voltage. The etch rates and the selectivity were obtained by a surface profiler and the etch profiles were observed by a field emission scanning electron microscopy. X-ray photoelectron spectroscopy was employed to reveal the etch mechanism.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.120-120
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• 2011

Graphene is a carbon based material and it has great potential of being utilized in various fields such as electronics, optics, and mechanics. In order to develop graphene-based logic systems, graphene field-effect transistor (GFET) has been extensively explored. GFET requires supporting devices, such as volatile memory, to function in an embedded logic system. As far as we understand, graphene has not been studied for volatile memory application, although several graphene non-volatile memories (GNVMs) have been reported. However, we think that these GNVM are unable to serve the logic system properly due to the very slow program/read speed. In this study, a GVM based on the GFET structure and using an engineered graphene channel is proposed. By manipulating the deposition condition, charge traps are introduced to graphene channel, which store charges temporarily, so as to enable volatile data storage for GFET. The proposed GVM shows satisfying performance in fast program/erase (P/E) and read speed. Moreover, this GVM has good compatibility with GFET in device fabrication process. This GVM can be designed to be dynamic random access memory (DRAM) in serving the logic systems application. We demonstrated GVM with the structure of FET. By manipulating the graphene synthesis process, we could engineer the charge trap density of graphene layer. In the range that our measurement system can support, we achieved a high performance of GVM in refresh (>10 ${\mu}s$) and retention time (~100 s). Because of high speed, when compared with other graphene based memory devices, GVM proposed in this study can be a strong contender for future electrical system applications.

• 한국컴퓨터정보학회논문지
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• 제22권4호
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• pp.25-32
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• 2017

Recently, the use of NAND flash memory is being increased as a secondary device to displace conventional magnetic disk. NAND flash memory, as one among non-volatile memories, has many advantages such as low power, high reliability, low access latency, and so on. However, NAND flash memory has disadvantages such as erase-before-write, unbalanced operation speed, and limited P/E cycles, unlike conventional magnetic disk. To solve these problems, NAND flash memory mainly adopted FTL (Flash Translation Layer). In particular, garbage collection technique in FTL tried to improve the system lifetime. However, previous garbage collection techniques have a sensitive property of the system lifetime according to write pattern. To solve this problem, we propose BSGC (Balanced Selection-based Garbage Collection) technique. BSGC efficiently selects a victim block using all intervals from the past information to the current information. In this work, SFL (Search First linked List), as the proposed block allocation policy, prolongs the system lifetime additionally. In our experiments, SFL and BSGC prolonged the system lifetime about 12.85% on average and reduced page migrations about 22.12% on average. Moreover, SFL and BSGC reduced the average response time of 16.88% on average.

• 한국전자통신학회논문지
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• 제7권5호
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• pp.1061-1066
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• 2012

디지털 메모리는 신뢰성, 속도 그리고 상대적인 단순한 제어회로로 인해 지금까지 저장장치로서 널리 사용되어 왔다. 그러나 디지털 메모리 저장능력은 공정의 선폭감소의 한계로 인해 결국 한계에 다다르게 될 것이다. 이러한 저장 능력을 획기적으로 증가시키는 방안의 하나로서 메모리의 셀에 저장하는 데이터의 형태를 디지털에서 아날로그로 변화시키는 것이다. 한 개의 셀과 프로그래밍을 위한 주변회로로 구성된 아날로그 메모리가 0.16um 표준 CMOS 공정에서 제작되었다. 제작된 아날로그 메모리는 저밀도 불활성 메모리, SRAM과 DRAM에서 리던던시 회로 제어, ID나 보안코드 레지스터, 영상이나 음성 저장장치 등에 응용될 것이다.

• 한국정보과학회논문지:컴퓨팅의 실제 및 레터
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• 제16권7호
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• pp.789-793
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• 2010

최근 플래시 메모리 기반 비휘발성 캐시가 저장장치의 성능과 전력 소모 측면에서 효과적인 해법으로 떠오르고 있다. 비휘발성 캐시로 저장장치의 성능을 향상시키고 전력 소모를 줄이기 위해, 가격이 싸고 용량이 큰 multi-level-cell (MLC) 플래시 메모리를 사용하는 것이 좋다. 그러나 MLC 플래시 메모리의 수명은 single-level-cell (SLC) 플래시 메모리보다 훨씬 짧기 때문에 전체 저장장치의 수명이 짧아질 수 있다. 이러한 약점을 최소화하기 위해 SLC 플래시 메모리와 MLC플래시 메모리를 결합한 형태의 비휘발성 캐시를 고려해볼 수 있다. 본 논문에서는 SLC와 MLC를 결합한 플래시 메모리를 버퍼로 사용하는 새로운 하이브리드 하드디스크 구조를 제안한다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 춘계학술발표대회
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• pp.28.2-28.2
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• 2011

Resistance random access memory (ReRAM) is a promising candidate for next-generation nonvolatile memory because of its advantageous qualities such as simple structure, superior scalability, fast switching speed, low-power operation, and nondestructive readout. We investigated the resistive switching behavior of tantalum oxide that has been widely used in dynamic random access memories (DRAM) in the present semiconductor industry. As a result, it possesses full compatibility with the entrenched complementary metal-oxide-semiconductor processes. According to previous studies, TiN is a good oxygen reservoir. The TiN top electrode possesses the specific properties to control and modulate oxygen ion reproductively, which results in excellent resistive switching characteristics. This study presents fully room temperature fabricated the TiN/$TaO_x$/Pt devices and their electrical properties for nonvolatile memory application. In addition, we investigated the TiN electrode dependence of the electrical properties in $TaO_x$ memory devices. The devices exhibited a low operation voltage of 0.6 V as well as good endurance up to $10^5$ cycles. Moreover, the benefits of high devise yield multilevel storage possibility make them promising in the next generation nonvolatile memory applications.

• 한국결정학회지
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• 제11권2호
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• pp.95-101
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• 2000

Ferroelectric SrBi2Ta2O9 (SBT) thin films of Pt/Ti/SiO2 electrode were fabricated using a sintered SBT target with various Bi2O3 content by rf magnetron sputtering. Good hysteresis loop characteristics were observed in the SBT thin films deposited with 50mol% excess Bi target. SBT thin films crystallized from 650℃ however, good hysteresis loop can be obtained in the film annealed above 700℃. pt/TiO2/SiO2 and Pt/SiO2 electrodes were also used to investigate the Pt electrode dependence of SBT thin films. SBT thin films showed random oriented polycrystalline structure and similar morphology regardless of electrodes with quite different surface morphology. A 0.2㎛ thick SBT film annealed at 750℃ exhibited the remanent polarization (2Pr) of μC/㎠ and coercive voltage(Vc) of 1V at an applied voltage of 5V.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2011년도 자성 및 자성재료 국제학술대회
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• pp.29-30
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• 2011

We have demonstrated the fabrication of sub 30 nm MTJ pillars with PMA characteristics. The multi-step IBE process performed at $45^{\circ}$ and $30^{\circ}$, using NER resulted in almost vertical side profiles. There deposition on the sidewalls of the NER prevented lateral etching of the resist hard mask allowing vertical MTJ side profile formation without any reduction in the lithographically defined resist lateral dimensions. For the 28nm STT-MTJ pillars, the measured TMR ratio was 13 % with resistance of 1 $k{\Omega}$, which was due to remaining redeposition layers less than 0.1 nm thick. With further optimization in multi-step IBE conditions, it will be possible to fabricate fully operating sub 30 nm perpendicular STT-MTJ structures for application to future non-volatile memories.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.203-204
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• 2005

PRAM (Phase change Random Access Memory) is one of the most promising candidates for next generation Non-volatile Memories. The Phase change material has been researched in the field of optical data storage media. Among the phase change materials $Ge_2Sb_2Te_5$(GST) is very well known for its high optical contrast in the state of amorphous and crystalline. However, the characteristics required in solid state memory are quite different from optical ones. In this study, the structural properties of GST thin films with composition were investigated for PRAM. The 100-nm thick GeTe and $Sb_2Te_3$ films were deposited on $SiO_2$/Si substrates by RF sputtering system. In order to characterize the crystal structure and morphology of these films, we performed x-ray diffraction (XRD) and atomic force microscopy (AFM).