• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.545-546
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.749-750
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• 2011

• Textile Coloration and Finishing
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• v.25 no.4
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• pp.287-291
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• 2013

Nowadays, terms such as 'Smart Textile', 'Intelligent Textile' and 'Wearable Computing' are commonly used in everyday contexts. And radio-frequency identification (RFID) is the use of a wireless non-contact system that uses radio-frequency electromagnetic fields to transfer data from a tag attached to an object, for the purposes of automatic identification and tracking. These products are required technologies which are textile treatments, printing, ink, etc. Durability of textile substrates is an essential marker for conductive ink printing process. Especially, heat stability is important, since conductive ink should be processable (annealing, curing) at temperatures below $150^{\circ}C$. This study was application of RFID on textiles. The textile pre-treatment processes should be carried out to use RFID antenna on textiles.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.6
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• pp.1186-1193
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• 2009

Wearable ECG monitoring is regarded as one of the most essential part in the ubiquitous healthcare environment and subsequently day-life monitoring of a heart condition has been pursued especially for the elder people. However, there are many problems to accomplish this task such as; i) implementation of long-term monitoring device, ii) development of non-irritating electrode on skin and iii) stable signal acquisition. With these aims, we have focused on implementing a non-irritating electrode with an endurable monitoring device for day-life. To accomplish our tasks, we basically developed four different types of textile electrodes that are adapted by both shape and the composed material; flat or convex shape and Ag-conductive paste material or not. It turns out to be that a convex shape and Ag-paste textile electrode has the best performance in terms of both signal-to-noise ratio (SNR) and Impedance/Phase characteristics. Furthermore, ECG amplifier (35 ${\times}$ 35 mm) has developed to resolve the ECG signal and transfer the signal to desktop computing device or portable one by RF serial communication.

• Proceedings of the KIEE Conference
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• 2008.10b
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• pp.371-372
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• 2008

Many kinds of electrodes have been developed in various forms and shapes for measurement of bio potential signal. Textile electrode has benefit of collect long tenn data monitoring because of it is non-consciousness, convenient and do not occur skin irritation. However, It is very difficult to acquire available data due to high impedance of electrode and unstable skin-electrode contact which generate motion artifact. Also snap button which usually used as mediator between textile and measurement device cause change of electrical characteristics. In this paper, we inflated textile electrode to stabilize contact and add conductive silver paste between textile and snap button to improve conductance. To compare the performance of two methods, flat or inflated and add conductive paste or not, four types of electrodes are tested on each impedance and SNR by ECG measurement. In result, the first type electrode which flat and non-conductive paste showed the worst performance and the last type electrode which is inflated shape and contain conductive paste show the best performance.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.64.1-64.1
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• 2011

LCD 디스플레이 등에 사용되는 글래스 패널 위에 bare si die를 직접 실장하는 COG 플립칩 패키지의 경우 Au 범프와 ITO 패드 간의 전기적 접속 및 접합부 신뢰성 확보를 위해 접속소재로서 ACF (anisotropic conductive film)가 사용되고 있다. 그러나 ACF는 고가이고 접속피치 미세화에 따라 브릿지 형상에 의한 쇼트 등의 문제가 발행할 수 있어 NCP (non-conductive paste)의 상용화가 요구되고 있다. 본 연구에서는 NCP를 적용한 COG 패키지에 있어서 온도, 압력 등의 열압착 본딩 조건과 NCP 물성이 Au-ITO 접합부의 전기적 및 기계적 특성에 미치는 영향을 조사하였다. NCP는 에폭시 레진과 경화제, 촉매제를 사용하여 다양하게 포뮬레이션을 하였고 DSC (Differential Scanning Calorimeter), TGA (Thermogravimetric Analysis), DEA (Dielectric Analysis) 등의 열분석장비를 이용하여 NCP의 물성과 경화 거동을 확인하였다. 테스트 베드는 면적 $5.2{\times}7.2\;mm^2$, 두께 650 ${\mu}m$, 접속피치 200 ${\mu}m$의 Au범프가 형성된 플립칩 실리콘 다이와 접속패드가 ITO로 finish된 글래스 기판을 사용하였다. 글래스 기판과 실리콘 칩은 본딩 전 PVA Tepla사의 Microwave 플라즈마 장비로 Ar, $O_2$ 플라즈마 처리를 하였으며, Panasonic FCB-3 플립칩 본더를 사용하여 본딩하였다. 본딩 후 접합면의 보이드를 평가하고 die 전단강도로 접합강도를 측정하였다.

• Journal of the Korean Graphic Arts Communication Society
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• v.29 no.2
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• pp.1-13
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• 2011

The recent spotlight on electronic touch-screen display, a rapid breakthrough in the information society is evolving. Touch panel input device such as a keyboard or mouse without the use of, the on-screen character or a specific location or object on the person's hand touches a particular feature to identify the location of a panel is to be handled. The touch screen on the touch panel is used in the Ag paste is used mostly for low-curable paste. The thermal-curing paste according to the drying process of thermal energy consumption and improve the working environment of organic solvents have problems. In this study, Ag paste used in the non-thermal curing friendly and cost-effective UV curable paste was prepared. Current commercially available thermal-curable binder, was used instead of the flow characteristics of UV-curable oligomers and monomers with functional groups to give a single conductive Ag paste with the addition of a pattern could be formed. Ag paste as a result, thermal-curing adhesive, hardness, resistance and excellent reproduction of fine patterns and was available with screen printing environmentally friendly could see its potential as a patterning technology.

• Smart Structures and Systems
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• v.17 no.1
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• pp.123-134
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• 2016

The evolution of the electro-mechanical impedance (EMI) of a piezoelectricity (PZT) sensor was investigated to determine the setting times of cement paste in this study. The PZT sensor coated with non-conductive acrylic resin was embedded in fresh cement paste and the EMI signatures were continuously monitored. Vicat needle test and semi-adiabatic calorimetry test were also conducted to validate the EMI sensing technique. Significant changes in the EMI resonance peak magnitude and frequency during the setting period were observed and the setting times determined by EMI sensing technique were relevant to those measured by Vicat needle test and semi-adiabatic calorimetry test.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.9-14
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• 2007

In this study, the thermal reliability on flip chip package with non-conductive pastes (NCPs) was evaluated under accelerated conditions. As the number of thermal shock cycle and the dwell time of temperature and humidity condition increased, the electrical resistance of the flip chip package with NCPs increased. These phenomenon was occurred by the crack between Au bump and Au bump and the delamination between chip or substrate and NCPs during the thermal shock and temperature and humidity tests. And the variation of electrical resistance during temperature and humidity test was larger than that during thermal shock test. Therefore it was identified that the flip chip package with NCPs was sensitive to environment with moisture.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.25-29
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• 2009

High temperature high humidity and thermal shock reliability tests were performed for the board level COB(chip-on-board) flip chip packages using self-formulated and commercial NCPs(non-conductive pastes) to ensure the performance of NCP flip chip packages. It was considered that the more smaller fused silica filler in prototype NCPs is more favorable for high temperature high humidity reliability. The failure of NCP interconnection was affected by the expansion of epoxy due to moisture absorption rather than the fatigue due to thermal stress. It was considered that the NCP having more higher adhesive strength seems to be more favorable to increase the thermal shock reliability.