• Journal of the Microelectronics and Packaging Society
• /
• v.27 no.3
• /
• pp.29-34
• /
• 2020

The behavior of brittle fracture of electroless nickel immersion gold (ENIG) /Sn-3.0wt.%Ag-0.5wt.%Cu (SAC305) solder joints was evaluated. The pH of the electroless nickel plating solution for ENIG surface treatment was changed from 4.0 to 5.5. As the pH of the Ni plating solution increased, pin hole in the Ni-P layer increased. The thickness of the interfacial intermetallic compound (IMC) of the solder joint increased with pH of Ni plating solution. The high speed shear strength of the SAC305 solder joint on ENIG surface finish decreased with the pH of the Ni plating solution. In addition, the brittle fracture rate of the solder joint was the highest when the pH of the Ni plating solution was 5.

• Bulletin of the Korean Chemical Society
• /
• v.32 no.5
• /
• pp.1630-1634
• /
• 2011

Electroless plating of metallic nickel on carbon fiber surfaces was carried out to control specific electric resistivity of the fibers, and the effects of the nickel content and coating thickness on the electric properties were studied. The structural and surface properties of the carbon fibers were characterized using X-ray diffraction (XRD), scanning electron microscopy (SEM), and X-ray photoelectron spectroscopy (XPS). The specific resistivity of the fibers was measured using a four-point probe testing method. From the XPS results, the oxygen and Ni atomic ratio of the fibers was greatly enhanced as the plating time increased. Additionally, it was observed that the specific electric resistivity decreased considerably in the presence of metallic nickel particles and with the formation of nickel layers on carbon fibers.

• Journal of the Korean institute of surface engineering
• /
• v.36 no.3
• /
• pp.263-271
• /
• 2003

Optimal conditions of electroless nickel plating in acid baths has been studied for industrial applications of a developed EN solution. The phosphorus content in the deposition ranges from 8 to $12\;wt.\%$. The investigated EN plating parameters are ion concentrations of nickel and hypophosphite, concentration of reducing and complexing agent, temperature, and pH. The average plating rate of Ni-P deposition was ca. $14{\mu}m/h$. The EN solution used shows a deposition rate of $10{\mu}m/h$ up to seven metal turnovers.

• Journal of the Korean institute of surface engineering
• /
• v.32 no.3
• /
• pp.219-223
• /
• 1999

A new additive for semi-brightness finish in nickel electroplating, having a quarternary ammonium salt structure, has been developed in this study. The effectiveness of the new additive was tested in laboratory-scale eletroplating tests as well as in a full-scale factory plating line. An examination of the plated surface showed that the new additive is as good as the one produced by the most commonly used additive in the nickel plating industry. The plated surface was examined by SEM, EPMA, and Reflectance Spectroscopy, and was found to be compatible to the one obtained with commercial additives. The new additive has a shelf life comparable with those of other commercially available additives. The additive developed in this study has an excellent potential to be used commercially.

• Composites Research
• /
• v.28 no.6
• /
• pp.361-365
• /
• 2015

The influence of MWCNTs on fracture toughness properties of MWCNTs/Nickel-Pitch Fibers/epoxy composites (MWCNTs/Ni-PFs/epoxy) was investigated according to MWCNTs content. Nickel-Pitch-based carbon fibers (Ni-PFs) were prepared by electroless nickel-plating. The surface properties of Ni-PFs were determined by scanning electron microscopy (SEM) and X-ray photoelectron spectrometry (XPS). The fracture toughness of MWCNTs/Ni-PFs/epoxy was assessed by critical stress intensity factor ($K_{IC}$) and critical strain energy release rate ($G_{IC}$). From the results, it was found that the fracture toughness properties of MWCNTs/Ni-PFs/epoxy were enhanced with increasing MWCNTs content, whereas the value decreased above 5 wt.%. MWCNTs content. This was probably considered that the MWCNTs entangled with each other in epoxy due to an excess of MWCNTs.

• Korean Chemical Engineering Research
• /
• v.59 no.2
• /
• pp.269-275
• /
• 2021

In this study, ordered mesoporous silica-supported Ni catalysts were prepared for catalytic partial oxidation of methane (CPOM) by using electroless nickel plating method. Unlike conventionally impregnated catalysts, the electrolessly-plated nickel catalyst showed that nickel was highly dispersed and formed stably on silica-supported surface. It was verified by TEM-EDS analysis. During the activity tests, the electrolessly-plated nickel was barely sintered and the amount of carbon deposition was very small. Consequently, the catalyst was far less deactivated, while the sintering was significantly observed in the cases of the catalysts prepared by the conventional impregnation method. Regarding the palladium-promoted catalysts, the reducibility of nickel was increased, and the reaction performances were enhanced in terms of CH4 conversion and H2/CO ratio of produced syngas.

• Proceedings of the IEEK Conference
• /
• 2001.10a
• /
• pp.292-295
• /
• 2001

A Study on the precipitation characteristics of nickel hydroxide as well as carbonate and sulfide is carried out to determine the proper treatment condition of the wastewater induced from nickel-plating industry. The nickel concentrations in the effluent could be kept lower than 5ppm when the value of pH was maintained higher than 10. The precipitation of nickel salts by alkaline addition to the nickel containing model wastewater was conducted by using proper amount of sodium hydroxide, sodium carbonate, sodium bicarbonate and sodium sulfide. In case of the sulfide treatment, the residual nickel concentration in the clear water after precipitates removed showed the lowest value. The influences of the precipitation condition upon the particle size of the crystals precipitated were also investigated. In spite of the various precipitation conditions were adopted, the particle size of the precipitated crystals showed no great differences. The sedimentation rates of the precipitated particle bed were observed and the free sedimentation period was terminated within 20 minutes. Although the hindered sedimentation as well as bed compaction progressed subsequently, the bed heights were maintained almost the same level after two hours of sedimentation.

• Journal of the Korean institute of surface engineering
• /
• v.33 no.2
• /
• pp.126-134
• /
• 2000

This study investigated the bath compositions and plating conditions and crystal structure used for achieving nickel-thallium-phosphorus deposits by means electroless plating. The electroless nickel-thallium-phosphorus deposits were achieved with a bath using sodium hypophosphite as the reducing agent and sodium citrate as the complexing agent. The depositing rate was 10.5mg.$cm^{2-1}$ .$hr^{-1 }$ from the optimistic bath composition, 0.1M nickel sulfate, 0.005M thallium sulfate, 0.2M sodium hypophosphite, and 0.05M sodium citrat and the recommended plating conditions, pH 5.5 and $90^{\circ}C$. The composition of alloy deposits determined by X-ray analysis (EDS) that the Thallium was increased with major increasing concentration of complexing agent and thallium ion in bath solution, it decreased according to the increasing concentrations of reduction agent in the bath solution, Bit Phosphorus showed a contrary to the thallium. It was observed from X-ray diffraction analysis, Scanning Electron Microscopy and Transmission Electron Microscopy. The crystalline structure of deposits was amorphous at the first deposited state but it was changed $Ni-T1-Ni_{5}$ $P_2$ polycrystalline when subjected to 1 hour heat treatment of more than $350^{\circ}C$. TEM observation demonstrated that the microstructure was identical to the result of the XRD at as deposited but it became $Ni-Tl-Ni_{5}$ $P_2$ polycrystalline when heated. And grain size was 10-50nm.

• Journal of the Microelectronics and Packaging Society
• /
• v.14 no.3
• /
• pp.51-55
• /
• 2007

Nickel iron (Ni-Fe) alloy coating was investigated. The effects of the current density, current type, pulse duration and bath compositions on the morphologies and surface hardness of nickeliron deposits as well as the chemical compositions were investigated. The morphologies, surface hardness and chemical compositions of nickel-iron deposits were varied with current density, current type and bath compositions. The surface hardness was increased up to $550{\sim}600Hv$ when PC plating was employed. Crackless coating was obtained when saccharin was added. The change of composition with thickness was analyzed with EDS and FESEM.

• Proceedings of the KIEE Conference
• /
• 1999.11d
• /
• pp.909-911
• /
• 1999

Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed circuit boards (PCB) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor metals, such as Al and Cu, and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure, wear resistance, corrosion protection and thermal stability. In this study fundamental aspects of electroless nickel deposition were studied with effect of complexeing agents of different kinds. Then, the property of electroless deposit are controlled by the composition of the deposition solution, the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.