• 제목/요약/키워드: Nickel film

검색결과 244건 처리시간 0.028초

Effect of Vacuum Annealing on Thin Film Nickel Silicide for Nano Scale CMOSFETs

  • Zhang, Ying-Ying;Oh, Soon-Young;Kim, Yong-Jin;Lee, Won-Jae;Zhong, Zhun;Jung, Soon-Yen;Li, Shi-Guang;Kim, Yeong-Cheol;Wang, Jin-Suk;Lee, Hi-Deok
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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    • pp.10-11
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    • 2006
  • In this study, the Ni/Co/TiN (6/2/25 nm) structure was deposited for thermal stability estimation. Vacuum (30 mTorrs) annealing was carried out to compare with furnace annealing in nitrogen ambient. The proposed Ni/Co/TiN structure exhibited low temperature silicidation and wide range of rapid thermal process (RTP) windows. The sheet resistance was too high to measure after furnace annealing at $600^{\circ}C$ due to the thin thickness (15 nm) of the nickel silicide. However, the sheet resistance maintained stable characteristics up to $600^{\circ}C$ for 30 min after vacuum annealing. Therefore, the low resistance of thin film nickel silicide was obtained by vacuum annealing at $600^{\circ}C$.

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P-I-N 역구조 페로브스카이트 태양전지 응용을 위한 Nickel oxide 홀전달층의 열처리 온도 연구 (Annealing Temperature of Nickel Oxide Hole Transport Layer for p-i-n Inverted Perovskite Solar Cells)

  • 김기성;김미정;김효정;양정엽
    • Current Photovoltaic Research
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    • 제11권4호
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    • pp.103-107
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    • 2023
  • A Nickel oxide (NiOx) thin films were prepared via sol-gel process on a transparent conductive oxide glass substrate. The NiOx thin films were spin-coated in ambient air and subsequently annealed for 30 minutes at temperatures ranging from 150℃ to 450℃. The structural and optical characteristics of the NiOx thin films annealed at various temperatures were measured using X-ray diffraction, field emission scanning electron microscopy, and ultraviolet-visible spectroscopy. After optimizing the NiOx coating conditions, perovskite solar cells were fabricated with p-i-n inverted structure, and its photovoltaic performance was evaluated. NiOx thin films annealed at 350℃ exhibited the most favorable characteristics as a hole transport layer, resulting in the highest power conversion efficiency of 17.88 % when fabricating inverted perovskite solar cells using this film.

복합 유도전류-누설자속법과 고밀도 홀센서배열에 의한 니켈 코팅 인코넬 시험편의 비파괴검사 (NDT of a Nickel Coated Inconel Specimen Using by the Complex Induced Current - Magnetic Flux Leakage Method and Linearly Integrated Hall Sensor Array)

  • 전종우;이진이;박덕근
    • 비파괴검사학회지
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    • 제27권5호
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    • pp.375-382
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    • 2007
  • 전자기적인 방법을 이용한 비파괴검사는 금속의 표면 및 표면 근방의 균열을 탐상하는데 매우 유용하다. 그러나, 강자성체, 상자성체 또는 강자성체와 상자성체 조직이 혼재되는 경우가 발생하여 기존의 비파괴검사법에 의하면 탐상신호의 해석에 어려움이 많다. 또한, 경우에 따라서는 국부적인 자성체의 존재를 유사결함으로 오해 또는 큰 결함을 국부적인 자성체의 존재로 오해할 수 있다. 한편, 원자력 발전소의 구조물 소재로 중요하게 사용되고 있는 Inconel은 결함 발생시 Nickel로 피막 처리한 후 연장 사용하게 된다. 이때, 상자성체인 Inconel과 강자성체인 Nickel의 혼재에 의하여 결함을 탐상하기 곤란하다. 본 연구에서는 Inconel 부재, Nickel 코팅부위 및 경계면에 존재하는 결함을 탐상하기 위한 방법으로써, 복합 유도전류-누설자속법과 고밀도 홀센서 배열을 이용한 라인스캔형 자기카메라를 제안하고, 탐상 가능 결함의 깊이 및 정량 평가 가능성에 대하여 보고한다.

전주가공을 이용한 로터리스크린의 후막제작에 관한 연구 (A Study on the Manufacturing of Thick Film for Rotary Screen using Electroforming)

  • 권혁홍;박상호;범민욱
    • 소성∙가공
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    • 제20권2호
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    • pp.93-98
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    • 2011
  • Electroforming is a kind of metal molding technology. After gilding on the possession object(conductivity, nonconductivity) separate it with possession object and produce a part or duplicate. This process has an excellent ability of duplicating detailed figure. To simplify the manufacturing process of a rotary screen, this study was adopted electroforming technology and produced silicon rubber mandrel. Furthermore, to indicate the optimal condition for the acquisition of high-qualified rotary screen product, the experiment was executed with pH, time, sulfamate nickel solution according to density which were the main factors to decide the condition, then compared it with the product made by original "S" company in Holland. As a result, the figure of hole was more obvious and correct. Also the open size increased by more than 2-3%.

저온 화학기상증착법 및 급속가열 공정을 이용한 그래핀의 합성 (Graphene Synthesis by Low Temperature Chemical Vapor Deposition and Rapid Thermal Anneal)

  • 임성규;문정훈;이희덕;유정호;양준모;왕진석
    • 한국전기전자재료학회논문지
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    • 제22권12호
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    • pp.1095-1099
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    • 2009
  • As a substitute material for silicon, we synthesized few layer graphene (FLG) by CVD process with a 300-nm-thick nickel film deposited on the silicon substrate and found out the lowest temperature for graphene synthesis. Raman spectroscopy study showed that the D peak (wave length : ${\sim}1,350\;cm^{-1}$) of graphene was minimized and then the 2D one (wave length : ${sim}2,700\;cm^{-1}$) appeared when rapid thermal anneal is carried out with the $C_2H_2$ treated nickel film. This study demonstrates that a high quality FLG formed at a low temperature of $400^{\circ}C$ is applicable as CMOS devices and transparent electrode materials.

프르브유닛 소자용 블레이드형 팁 제조방법 (A Fabrication Method of Blade Type Tip for Probe Unit Device)

  • 이근우;이재홍;김창교
    • 전기학회논문지
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    • 제56권8호
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    • pp.1436-1440
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    • 2007
  • Beryllium copper has been known to be an important material for the various fields of industry because it can be used for mechanical and electrical/electronic components that are subjected to elevated temperatures (up to $400^{\circ}C$ for short times). Blade type tip for probing the cells of liquid crystal display(LCD) was fabricated using beryllium copper foil. The dry film resist was employed as a mask for patterning of the blade type tip. The beryllium copper foil was etched using hydrochloric acidic iron-chloride solution. The concentration, temperature, and composition ratio of hydrochloric acidic iron-chloride solution affect the etching characteristics of beryllium copper foil. Nickel with the thickness of $3{\mu}m$ was electroplated on the patterned copper beryllium foil for enhancing its hardness, followed by electroplating gold for increasing its electrical conductivity. Finally, the dry film resist on the bridge was removed and half of the nickel was etched to complete the blade type tip.

유기첨가제에 의한 전기도금 니켈-구리 박막의 물성변화 (Property Change by Organic Additives in Electroplated Nickel-copper Thin Films)

  • 이정주;홍기민
    • 한국자기학회지
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    • 제15권3호
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    • pp.198-201
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    • 2005
  • 전기도금 방법으로 제작된 니켈과 니켈-구리 합금박막에 미치는 유기첨가제(organic additive)의 영향을 조사하였다. 유기첨가제를 가하여 도금하는 니켈 박막의 경우 순수한 전해액만을 이용하여 도금한 박막과는 다른 결정성을 갖는다 도금조건을 일정하게 한 후 니켈-구리의 합금 박막용 전해액에 유기첨가제를 가하면 구리와 니켈의 조성비율이 변화하는데 유기첨가제의 성분과 농도에 따라 니켈의 함유율이 $65\~95\%$ 영역에서 조절이 가능하다. 유기첨가제에 의한 이러한 물성의 변화는 자성의 변화를 유도하여 도금 박막의 자기저항의 증가와 감소에도 기여하는 것으로 나타났다.