• 제목/요약/키워드: Nickel Electroless Plating

검색결과 159건 처리시간 0.026초

Roles of Nickel Layer Deposition on Surface and Electric Properties of Carbon Fibers

  • Kim, Byung-Joo;Choi, Woong-Ki;Bae, Kyong-Min;Moon, Cheol-Whan;Song, Heung-Sub;Park, Jong-Kyoo;Lee, Jae-Yeol;Im, Seung-Soon;Park, Soo-Jin
    • Bulletin of the Korean Chemical Society
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    • 제32권5호
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    • pp.1630-1634
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    • 2011
  • Electroless plating of metallic nickel on carbon fiber surfaces was carried out to control specific electric resistivity of the fibers, and the effects of the nickel content and coating thickness on the electric properties were studied. The structural and surface properties of the carbon fibers were characterized using X-ray diffraction (XRD), scanning electron microscopy (SEM), and X-ray photoelectron spectroscopy (XPS). The specific resistivity of the fibers was measured using a four-point probe testing method. From the XPS results, the oxygen and Ni atomic ratio of the fibers was greatly enhanced as the plating time increased. Additionally, it was observed that the specific electric resistivity decreased considerably in the presence of metallic nickel particles and with the formation of nickel layers on carbon fibers.

Surface Modification by Atmospheric Pressure DBDs Plasma: Application to Electroless Ni Plating on ABS Plates

  • Song, Hoshik;Choi, Jin Moon;Kim, Tae Wan
    • Transactions on Electrical and Electronic Materials
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    • 제14권3호
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    • pp.133-138
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    • 2013
  • Acrylonitrile-butadiene-styrene (ABS) plastic is a polymer material extensively used in electrical and electronic applications. Nickel (Ni) thin film was deposited on ABS by electroless plating, after its surface was treated and modified with atmospheric plasma generated by means of dielectric barrier discharges (DBDs) in air. The method in this study was developed as a pre-treatment for electroless plating using DBDs, and is a dry process featuring fewer processing steps and more environmentally friendliness than the chemical method. After ABS surfaces were modified, surface morphologies were observed using a scanning electron microscope (SEM) to check for any physical changes of the surfaces. Cross-sectional SEM images were taken to observe the binding characteristics between metallic films and ABS after metal plating. According to the SEM images, the depths of ABS by plasma are shallow compared to those modified by chemically treatment. The static contact angles were measured with deionized (DI) water droplets on the modified surfaces in order to observe for any changes in chemical activities and wettability. The surfaces modified by plasma showed smaller contact angles, and their modified states lasted longer than those modified by chemical etching. Adhesion strengths were measured using 3M tape (3M 810D standard) and by 90° peel-off tests. The peel-off test revealed the stronger adhesion of the Ni films on the plasma-modified surfaces than on the chemically modified surfaces. Thermal shock test was performed by changing the temperature drastically to see if any detachment of Ni film from ABS would occur due to the differences in thermal expansion coefficients between them. Only for the plasma-treated samples showed no separation of the Ni films from the ABS surfaces in tests. The adhesion strengths of metallic films on the ABS processed by the method developed in this study are better than those of the chemically processed films.

금속 수소화물 전극제조에 있어서 알카리 무전해 구리 도금법의 응용 (Application of an electroless copper coating in alkaline bath to preparation of the metal hydride electrode)

  • 최전;박충년
    • 한국수소및신에너지학회논문집
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    • 제3권2호
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    • pp.9-15
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    • 1992
  • Electroless copper plating method using an alkaline bath have been employed in copper coating of the (LM)Ni4.5Co0.1MnO.2A10.2 hydrogen storage alloy powders for electrode preparation. The plating were conducted without any pretreatment of alloy powders. For the preparation of the electrodes, about 0.12g of the copper coated alloy powder (copper to alloy ratio 1/3 by weight) was compacted with pressure of 6 tons/cm2 at room temperature. The disk-type compacts had a diameter of 10mm and thickness of about 0.24mm. The electrode characteristics were examined through SEM observations and electrochemical measurements in a half cell. The electrochemical measurement showed that the maximum discharge capacity of the electrodes prepared by using alkaline bath were 245mAh per gram of coated alloy (327mAh per gram of alloy) and appeared a considerable degradation with increasing number of cycles. The decrease of the discharge capacity after 100 cycles was about 30% It can be suggested that, with a slight of improvement, this electroless copper plating method could be applied to the preparation of the rare earth-nickel based alloy electrode.

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Nickel Phosphide Electroless Coating on Cellulose Paper for Lithium Battery Anode

  • Kang, Hyeong-Ku;Shin, Heon-Cheol
    • Journal of Electrochemical Science and Technology
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    • 제11권2호
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    • pp.155-164
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    • 2020
  • Here we report our preliminary results about nickel phosphide (Ni-P) electroless coating on the surface of cellulose paper (CP) and its feasibility as the anode for lithium (Li) batteries. In particular, CP can act as a flexible skeleton to maintain the mechanical structure, and the Ni-P film can play the roles of both the anode substrate and the active material in Li batteries. Ni-P films with different P contents were plated uniformly and compactly on the microfiber strands of CP. When they were tested as the anode for Li battery, their theoretical capacity per physical area was comparable to or higher than hypothetical pure graphite and P film electrodes having the same thickness. After the large irreversible capacity loss in the first charge/discharge process, the samples showed relatively reversible charge/discharge characteristics. All samples showed no separation of the plating layer and no detectable micro-cracks after cycling. When the charge cut-off voltage was adjusted, their capacity retention could be improved significantly. The electrochemical result was just about the same before and after mechanical bending with respect to the overall shape of voltage curve and capacity.

금속 전극 알루미나 박막 캐패시터의 전기적 특성에 미치는 미세구조의 영향 (Effect of Microstructure on Electrical Properties of Thin Film Alumina Capacitor with Metal Electrode)

  • 정명선;주병권;오영제;이전국
    • 한국재료학회지
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    • 제21권6호
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    • pp.309-313
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    • 2011
  • The power capacitors used as vehicle inverters must have a small size, high capacitance, high voltage, fast response and wide operating temperature. Our thin film capacitor was fabricated by alumina layers as a dielectric material and a metal electrode instead of a liquid electrolyte in an aluminum electrolytic capacitor. We analyzed the micro structures and the electrical properties of the thin film capacitors fabricated by nano-channel alumina and metal electrodes. The metal electrode was filled into the alumina nano-channel by electroless nickel plating with polyethylene glycol and a palladium catalyst. The spherical metals were formed inside the alumina nano pores. The breakdown voltage and leakage current increased by the chemical reaction of the alumina layer and $PdCl_2$ solution. The thickness of the electroless plated nickel layer was 300 nm. We observed the nano pores in the interface between the alumina layer and the metal electrode. The alumina capacitors with nickel electrodes had a capacitance density of 100 $nF/cm^2$, dielectric loss of 0.01, breakdown voltage of 0.7MV/cm and leakage current of $10^4{\mu}A$.

STS 304L powder 상의 무전해 니켈 도금 (Electroless nickel plating on STS 304L powder)

  • 박소연;이종권
    • 한국산학기술학회:학술대회논문집
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    • 한국산학기술학회 2006년도 춘계학술발표논문집
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    • pp.184-187
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    • 2006
  • Nickel was plated electrolessly on 304L stainless steel powder. To obtain uniform coating and dispension of powder, the bath was continuously agitated with magnetic stirrer. The various pH and bath temperatures were studied. The conditions were in the range of $pH4{\sim}10$ and $45{\sim}65^{\circ}C$, respectively. The coating morphologies were examined by SEM/EDS tests. The optimum condition was pH9 at $55^{\circ}C$.

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알루미늄에 니켈-질화붕소-인과 니켈-질화붕소-붕소의 3원계 복합도금 (Composite Coating of Nickel-Boron Nitride-Phosphours and Nickel-Boron Nitride-Boron Ternary System on Aluminum)

  • 곽우섭;윤병하;김대용
    • 한국표면공학회지
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    • 제19권3호
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    • pp.83-91
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    • 1986
  • Codeposited of boron nitride(BN) particle dispersed into electroless nickel-phosphours (Ni-P) and nickel-boron(Ni-B) platings were studied for the purpose of developing the wear resistance and lubricity. BN can be codeposited from electroless nickel plating bath with $NaH_2PO_2$ and $NaBH_4$ as the reducing agents. Most dispersolids were distributed uniformly in the Ni-P and Ni-B matrix. Abrasion loss decreased with increasing amount of codeposits and reached a constant value 2.4 percent by volume percent of BN particle. The wear resistance and the friction coefficient of the heat treated BN composite coatings were improved about three times than that of as-coatings. The BN composite coatings were more wear resistance than hard chromium. Ni-B-BN composite coatings showed lower wear resistance and friction coefficient than Ni-P-BN. The BN content of the deposite was found to be 2.4 v/o for these optium conditions.

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무전해 니켈도금과 무전해복합도금(Ni-P-X, X: SiC, $Al_2$O$_3$, Diamond)의 내마모성 비교 (The Wear Resistance of Electroless Nickel and Electroless Composite(Ni-P-X, X: SiC, $Al_2$O$_3$, Diamond) Coating Layers)

  • 김만;장도연;정용수;노병호;이규환
    • 한국표면공학회지
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    • 제27권4호
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    • pp.193-206
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    • 1994
  • A wear behavior of electroless (Ni-P-X, X: SiC, $Al_2O_3$, Diamond) composite coating layers, formed under various conditions on commerical grade low carbon steel, has been investigated using Taber abrasion tester and scanning electron microscope. Several factors, which are type of particles, co-deposited content, particle size, distribution of particles and heat-treatment, influenced the wear resistance. The wear resistance of the composited coating layers after heat-treatment at $400^{\circ}C$ for 1 hr was increased 70 times with diamond, 15 times with SiC and 8 times with $Al_2O_3$, compared with the electroless nickel plating layer without heat-treatment.

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Influence of Bath Temperature on Electroless Ni-B Film Deposition on PCB for High Power LED Packaging

  • Samuel, Tweneboah-Koduah;Jo, Yang-Rae;Yoon, Jae-Sik;Lee, Youn-Seoung;Kim, Hyung-Chul;Rha, Sa-Kyun
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.323-323
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    • 2013
  • High power light-emitting diodes (LEDs) are widely used in many device applications due to its ability to operate at high power and produce high luminance. However, releasing the heat accumulated in the device during operating time is a serious problem that needs to be resolved to ensure high optical efficiency. Ceramic or Aluminium base metal printed circuit boards are generally used as integral parts of communication and power devices due to its outstanding thermal dissipation capabilities as heat sink or heat spreader. We investigated the characterisation of electroless plating of Ni-B film according to plating bath temperature, ranging from $50^{\circ}C$ to $75^{\circ}C$ on Ag paste/anodised Al ($Al_2O_3$)/Al substrate to be used in metal PCB for high power LED packing systems. X-ray diffraction (XRD), Field-Emission Scanning Electron Microscopy (FE-SEM) and X-ray Photoelectron Spectroscopy (XPS) were used in the film analysis. By XRD result, the structure of the as deposited Ni-B film was amorphous irrespective of bath temperature. The activation energy of electroless Ni-B plating was 59.78 kJ/mol at the temperature region of $50{\sim}75^{\circ}C$. In addition, the Ni-B film grew selectively on the patterned Ag paste surface.

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