• Korean Journal of Materials Research
• /
• v.18 no.1
• /
• pp.5-11
• /
• 2008

Thermally evaporated 10 nm-Ni/1 nm-Au/(30 nm-poly)Si structures were fabricated in order to investigate the thermal stability of Au-inserted nickel silicide. The silicide samples underwent rapid thermal annealing at $300{\sim}1100^{\circ}C$ for 40 seconds. The sheet resistance was measured using a four-point probe. A scanning electron microscope and a transmission electron microscope were used to determine the cross-sectional structure and surface image. High-resolution X-ray diffraction and a scanning probe microscope were employed for the phase and surface roughness. According to sheet resistance and XRD analyses, nickel silicide with Au had no effect on widening the NiSi stabilization temperature region. Au-inserted nickel silicide on a single crystal silicon substrate showed nano-dots due to the preferred growth and a self-arranged agglomerate nano phase due to agglomeration. It was possible to tune the characteristic size of the agglomerate phase with silicidation temperatures. The nano-thick Au-insertion was shown to lead to self-arranged microstructures of nickel silicide.

• Korean Journal of Metals and Materials
• /
• v.48 no.1
• /
• pp.62-70
• /
• 2010

Leaching and solvent extraction experiments have been performed to develop a hydrometallurgical process for the recovery of nickel and cobalt from nickel laterite ore with high magnesium content. Most of the nickel and magnesium in the laterite ore dissolved at leaching conditions of $80^{\circ}C$ and 100 g/L sulfuric acid concentration. while half of the cobalt and iron were leached at the same conditions. Solvent extraction experiments were carried out with D2EHPA and saponifed D2EHPA from a synthetic solution containing Ni, Co, and Mg. The extraction percentage of Co, Mg. and Ni by D2EHPA was very low in a pH range of 4.4 to 7.3. while the extraction percentage sharply increased by using saponified D2EHPA. The stripping percentage of the metals from the saponified D2EHPA increased with sulfuric acid concentration and reached 99.9% at 1 M $H_2SO_4$ solution.

• Membrane and Water Treatment
• /
• v.10 no.3
• /
• pp.239-244
• /
• 2019

Plating wastewater containing various heavy metals can be produced by several industries. Specifically, we focused on the removal of copper (Cu2+) and nickel (Ni+) ions from the plating wastewater because all these ions are strictly regulated when discharged into watershed in Korea. The application of both nanofiltration (NF) and reverse osmosis (RO) technologies for the treatment of wastewater containing copper and nickel ions to reduce fresh water consumption and environmental degradation was investigated. In this work, the removal of copper (Cu2+) and nickel (Ni+) ions from synthetic water was studied on pilot scale remove by before using two commercial nanofiltration (NF) and reverse osmosis(RO) spiral-wound membrane modules (NE2521-90 and RE2521-FEN by Toray Chemical). The influence of main operating parameters such as feed concentration on the heavy metals rejection and permeate flux of both membranes, was investigated. Synthetic plating wastewater samples containing copper ($Cu^{2+}$) and nickel ($Ni^{2+}$) ions at various concentrations(1, 20, 100, 400 mg/L) were prepared and subjected to treatment by NF and RO in the pilot plant. The results showed that NF, RO process, with 98% and 99% removal for copper and nickel, respectively, could achieve high removal efficiency of the heavy metals.

• Progress in Superconductivity
• /
• v.7 no.1
• /
• pp.58-63
• /
• 2005

We investigated the surface oxidation behavior of cube-textured polycrystalline nickel at various oxidation conditions. Cube-textured NiO film was formed on a cube-textured polycrystalline nickel regardless of oxidation conditions but different growth behavior of NiO crystals was observed depending on the oxidation conditions. The introduction of water vapor into $O_2$ did not affect the texture evolution, but rough and porous microstructure was developed. Microstructure of NiO film tends to be denser as the oxygen partial pressure increases. It is interesting that (111) peak of theta - two theta diffraction pattern started to get stronger in air atmosphere and (111) plane became the major texture in the substrate oxidized in high purity argon gas. Small amount of high index crystallographic plane NiO peak crystal was observed when $N_{2}O$ was used as an oxidant while only (200) plane crystal was formed in dry $O_2$ atmosphere. Flat and smooth surface was changed into rough faceted one when ramping rate to oxidation temperature was faster. The grain size of NiO was decreased when the oxygen partial pressure was low. It was also observed that the modification of nickel surface suppressed the development of (200) texture.

• 한국신재생에너지학회:학술대회논문집
• /
• 2011.11a
• /
• pp.100-100
• /
• 2011

Nanomaterial architecture with highly ordered, vertically oriented $TiO_2$ nanotube arrays shows a good promise for diverse technological applications. As inspired from the literature reports that Nickel modification can improve the photocatalytic activity of $TiO_2$, it was planned to coat Ni into the $TiO_2$ matrix. In this study, first $TiO_2$ nanotubes(TiNTs) were prepared by anodization (60V,3min) in HF-free aqueous electrolyte on ultrasonically cleaned polished titanium sheet substrates ($1{\times}7cm^2$). The typical thickness of the sintered TiNT ($500^{\circ}C$for10min) was ~1 micronas confirmed from the FESEM study. In the next part, as-anodized and sintered TiNT/Ti photoanodes were used to coat Ni by AC electrodeposition from aqueous 0.1M nickel sulphate solution. During AC electrodeposition, conditions such as 1V DC offset voltage, 9V amplitude (peak-to-peak) and 750 Hz frequency were fixed constant and the deposition time was varied as 0.5 min, 1 min, 2 min and 10 min. The photoelectrochemical performance of pristine and Ni modified TiNT/Ti photoanodes was measured in 1N NaOH electrolyte under 1 SUN illumination in the potential range of -1V and 1.2V versus Ag/AgCl reference electrode. The photocurrent performance of TiNT/Ti photoanode decreased upon Ni modification and the results were confirmed after repeated experiments. This suggests us that Ni modification inhibits the photoelectrochemical performance of $TiO_2$ nanotubes.

• The Journal of Advanced Prosthodontics
• /
• v.6 no.3
• /
• pp.215-223
• /
• 2014

PURPOSE. This study aimed to develop a copper-aluminium-nickel alloy which has properties comparable to that of dental alloys used for dental post and core applications with the reasonable cost. MATERIALS AND METHODS. Sixteen groups of experimental copper alloys with variants of 3, 6, 9, 12 wt% Al and 0, 2, 4, 6 wt% Ni were prepared and casted. Their properties were tested and evaluated. The data of thermal, physical, and mechanical properties were analyzed using the two-way ANOVA and Tukey's test (${\alpha}$=0.05). The alloy toxicity was evaluated according to the ISO standard. RESULTS. The solidus and liquidus points of experimental alloys ranged from $1023^{\circ}C$ to $1113^{\circ}C$ and increased as the nickel content increased. The highest ultimate tensile strength ($595.9{\pm}14.2$ MPa) was shown in the Cu-12Al-4Ni alloy. The tensile strength was increased as the both elements increased. Alloys with 3-6 wt% Al exhibited a small amount of 0.2% proof strength. Accordingly, the Cu-9Al-2Ni and Cu-9Al-4Ni alloys not only demonstrated an appropriate modulus of elasticity ($113.9{\pm}8.0$ and $122.8{\pm}11.3$ GPa, respectively), but also had a value of 0.2% proof strength ($190.8{\pm}4.8$ and $198.2{\pm}3.4$ MPa, respectively), which complied with the ISO standard requirement (>180 MPa). Alloys with the highest contents of nickel (6 wt% Ni) revealed a widespread decolourisation zone (5.0-5.9 mm), which correspondingly produced the largest cell response, equating positive control. CONCLUSION. The copper alloys fused with 9 wt% Al and 2-4 wt% Ni can be considered for a potential use as dental post and core applications.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.23 no.2
• /
• pp.114-118
• /
• 2013

Separation/recovery of valuable metals such as nickel or tin from copper based alloys has recently attracted from the viewpoints of environmental protection and resource recycling. In this report, preliminary study on concentration and separation of nickel from copper based alloy dross using selective adsorption by chelate resin was performed. The chelate resin used in this study has absorbed copper ions more easily than nickel ions in the metal solution, which could allow the concentration/separation of the nickel from the copper base alloy solution. The final molar ratios of Ni and Cu ions in the two concentrated solutions were 70 and 99 % respectively after three-time flowing the solution through the chelate resin column.

• Bulletin of the Korean Chemical Society
• /
• v.27 no.12
• /
• pp.1989-1996
• /
• 2006

The $NiSO_4/CeO_2-ZrO_2 $catalysts containing different nickel sulfate and $CeO_2$ contents were prepared by the impregnation method, where support, $CeO_2-ZrO_2$was prepared by the coprecipitation method using a mixed aqueous solution of zirconium oxychloride and cerium nitrate solution followed by adding an aqueous ammonia solution. No diffraction line of nickel sulfate was observed up to 20 wt %, indicating good dispersion of nickel sulfate on the surface of $CeO_2-ZrO_2$. The addition of nickel sulfate (or $CeO_2$) to $ZrO_2$ shifted the phase transition of $ZrO_2$ from amorphous to tetragonal to higher temperatures because of the interaction between nickel sulfate (or $CeO_2$) and $ZrO_2$. A catalyst (10-$NiSO_4/1-CeO_2-ZrO_2$) containing 10 wt % $NiSO_4$ and 1 mole % $CeO_2$, and calcined at $600{^{\circ}C}$ exhibited a maximum catalytic activity for ethylene dimerization. The catalytic activities were correlated with the acidity of catalysts measured by the ammonia chemisorption method. The role of $CeO_2$was to form a thermally stable solid solution with zirconia and consequently to give high surface area, thermal stability and acidity of the sample.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.20 no.4
• /
• pp.308-317
• /
• 2007

We fabricated thermally-evaporated 10 nm-Ni/(poly)Si and 10 nm-$Ni_{0.5}Co_{0.5}$/(Poly)Si structures to investigate the microstructure of nickel silicides at the elevated temperatures required lot annealing. Silicides underwent rapid annealing at the temperatures of $600{\sim}1100^{\circ}C$ for 40 seconds. Silicides suitable for the salicide process formed on top of both the single crystal silicon actives and the polycrystalline silicon gates. A four-point tester was used to investigate the sheet resistances. A transmission electron microscope and an Auger depth profilescope were employed for the determination of vortical microstructure and thickness. Nickel silicides with cobalt on single crystal silicon actives and polycrystalline silicon gates showed low resistance up to $1100^{\circ}C$ and $900^{\circ}C$, respectively, while the conventional nickle monosilicide showed low resistance below $700^{\circ}C$. Through TEM analysis, we confirmed that a uniform, $10{\sim}15 nm$-thick silicide layer formed on the single-crystal silicon substrate for the Co-alloyed case while a non-uniform, agglomerated layer was observed for the conventional nickel silicide. On the polycrystalline silicon substrate, we confirmed that the conventional nickel silicide showed a unique silicon-silicide mixing at the high silicidation temperature of $1000^{\circ}C$. Auger depth profile analysis also supports the presence of this mixed microstructure. Our result implies that our newly proposed NiCo-alloy composite silicide process may widen the thermal process window for the salicide process and be suitable for nano-thick silicides.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.7 no.6
• /
• pp.1056-1063
• /
• 2006

Thermal evaporated 10 nm-Ni/l nm-Ir/(or polycrystalline)p-Si(100) and 10 nm-$Ni_{50}Co_{50}$/(or polycrystalline)p-Si(100) films were thermally annealed using rapid thermal annealing fur 40 sec at $300{\sim}1200^{\circ}C$. The annealed bilayer structure developed into Ni(Ir or Co)Si and resulting changes in sheet resistance, microstructure, phase and composition were investigated using a four-point probe, a scanning electron microscopy, a field ion beam, an X-ray diffractometer and an Auger electron spectroscope. The final thickness of Ir- and Co-inserted nickel silicides on single crystal silicon was approximately 20$\sim$40 nm and maintained its sheet resistance below 20 $\Omega$/sq. after the silicidation annealing at $1000^{\circ}C$. The ones on polysilicon had thickness of 20$\sim$55 nm and remained low resistance up to $850^{\circ}C$. A possible reason fur the improved thermal stability of the silicides formed on single crystal silicon substrate is the role of Ir and Co in preventing $NiSi_2$ transformation. Ir and Co also improved thermal stability of silicides formed on polysilicon substrate, but this enhancement was lessened due to the formation of high resistant phases and also a result of silicon mixing during high temperature diffusion. Ir-inserted nickel silicides showed surface roughness below 3 nm, which is appropriate for nano process. In conclusion, the proposed Ir- and Co- inserted nickel silicides may be superior over the conventional nickel monosilicides due to improved thermal stability.