• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1342-1344
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• 1994

Silver-Nickel alloy has been used as a electrical contact material for low voltage, low current. Since the solubility between Ag and Ni is very low, it is difficult to produce Ag-Ni alloy by using conventional melting method and disperse Ni powder homogeneously in Ag matrix. In this study we have been produced fine Ag-Ni alloy powder by using coprecipitation method. Firstly, we have produced silver-nickel nitrate solution by dissolving the Ag and Ni ingot in nitric acid solution and then, coprecipitate (Ag, Ni)carbonate dropping Ag-Ni nitrate solution to sodium carbonate solution. (Ag, Ni) carbonate is heat-treated in $H_2$ atmosphere, $400^{\circ}C$ and it has been analysed by TGA, SEM, XRD, ICP. It is represented Silver-Nickel alloy powder in the particle range of $0.1{\sim}0.5{\mu}m$.

• The Journal of Korean Academy of Prosthodontics
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• v.37 no.6
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• pp.741-755
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• 1999

As a material of metal-ceramic prosthesis, nickel as a form of Ni-Cr alloy has been used for many dental prostheses in many cases. However, several problems in use of the alloy have been revealed (ex : tissue stimulation, skin allergy, hypersensitivity, cytotoxicity and carcinogenecity). Little is known about nickel with respect to the relationship between Ni-prosthesis and gaining of Ni-resistance in oral microorganisms. The present study was undertaken to check wheather use of Ni-prosthesis leads to occurrence of Ni-resistant microorganisms. So this study may suggest the possible relationships between the oral microorganisms and nickel-resistance in oral environment. Bacteria were isolated from the gingival crevicular fluid on the pateints wearing Ni-Cr prosthesis. The isolated bacteria were tested for their Ni-resistance in nickel containing media at different concentration from 3mM to 110mM. E. coli HB101 was used as control. The Ni-resistant bacteria were isolated and biochemically identified. The Ni-resistant bacteria were tested several bio-chemical, molecular-biological tests. Performed tests were ; measuring the growth curve, antibiotic test, growth ability test in liquid media, isolation of the chromosome and plasmid, digestion of DNA by restriction enzyme, electrophoresis of chromosome and plasmid DNA, identification of Ni-resistant genes by the DNA hybridization. The results were as follows: 1) The bacteria isolated from gingival crevicular fluid on the patients wearing Ni-Cr alloy pros-thesis showed nickel-resistance. 2) The isolated microorganisms grew at nickel containing media of high concentrations (60mM-110mM). 3) Based on the biochemical tests, the isolated microorganisms were identified as Enterococcus faecalis(13 cases), Klebsiella pneumoniae(1 case) and Enterobacter gergeviae(1 case). 4) Enterococcus faecalis expressed not only nickel resistance but also the multi-drug resistance to several antibiotics ; chloramphenicol, kanamicin, streptomycin, lincomycin, clindamycin. However, all strain showed the sensitivity against the tetracycline. 5) DNA hybridization result suggest that there is no homology between the previousely known gene of nickel resistance in Klebsiella pneumoniae and chromosomal DNA of Enterococcus faecalis.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.260-260
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• 2009

In high-efficiency crystalline silicon solar cell, If high-efficiency solar cells are to be commercialized, It is need to develop superior contact formation method and material that can be inexpensive and simple without degradation of the solar cells ability. For reason of plated metallic contact is not only high metallic purity but also inexpensive manufacture. It is available to apply mass production. Especially, Nickel, Copper are applied widely in various electronic manufactures as easily formation is available by plating. Ni is shown to be a suitable barrier to Cu diffusin as well as desirable contact metal to silicon. Nickel monosilicide has been suggested as a suitable silicide due to its lower resistivitym lower sintering temperature and lower layer stress than $TiSi_2$. In this paper, Nickel as a seed layer and diffusion barrier is plated by electroless plating to make nickel monosilicide.

• Journal of the Korean Society of Industry Convergence
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• v.19 no.4
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• pp.198-205
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• 2016

For the study on the ion exchange of nickel hexacyanoferrate(NiHCNFe) electrode with the several cations, the film of hexacyanoferrate was prepared on the bare nickel surface by the electrochemical and chemical methods in the solution composed with 5mM K3Fe(CN)6 and 100mM KNO3. To compare the capability of the ion exchange of NiHCNFe film electrode, the repeated cyclic voltammograms were measured in the 0.5M cation nitrate solutions at $25^{\circ}C$ and pH7. It was found that the capacity of the electrochemically derivatized NiHCNFe reduced in the rate of 0.5~0.7%/cycle and was nearly exhausted at the 150th potential cycle. Better result was obtained from that the capacity loss of the chemically assembled NiHCNFe was less than 0.02%/cycle for 5,000cycles. Furthermore, the residual capacity was more than 30% at the 5,000th cycle.

• Journal of the Korean Chemical Society
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• v.58 no.1
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• pp.9-16
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• 2014

In a borate buffer solution, the growth kinetics and the electronic properties of passive film on nickel were investigated, using the potentiodynamic method, chronoamperometry, and single- or multi-frequency electrochemical impedance spectroscopy. The oxide film formed during the passivation process of nickel has showed the electronic properties of p-type semiconductor, which follow from the Mott-Schottky equation. It was found out that the passive film ($Ni(OH)_2$) of Ni formed in the low electrode potential changes to NiO and NiO(OH) while the electrode potential increases.

• Resources Recycling
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• v.12 no.3
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• pp.38-45
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• 2003

ionic equilbria of nickel chloride in hydrochloric acid solutions were analyzed by considering chemical equilibria, mass and charge balance equations. The activity coefficients of solutes were calculated by using Bromley equation. It was found that most of species containing nickel existed as $Ni^{2+}$ 와 $NiCl^{+}$. The mole fractions of nickel hydroxides were very low in the con-centration ranges considered in this study and the mole fraction of$Ni_4$ $(OH)_{4}^{4+}$ increased greatly with the pH of the solution. The pH values of $NiCl_2$ $-HCl-NaOH-H_2$O system at $25^{\circ}C$ calculated in this study agreed well with those experimentally measured up to ionic strength of 9.4m.

• Korean Journal of Metals and Materials
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• v.47 no.5
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• pp.322-329
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• 2009

60 nm- and 20 nm-thick hydrogenated amorphous silicon (a-Si:H) layers were deposited on 200 nm $SiO_2/Si$ substrates using ICP-CVD (inductively coupled plasma chemical vapor deposition). A 10 nm-Ni layer was then deposited by e-beam evaporation. Finally, 10 nm-Ni/60 nm a-Si:H/200 nm-$SiO_2/Si$ and 10 nm-Ni/20 nm a-Si:H/200 nm-$SiO_2/Si$ structures were prepared. The samples were annealed by rapid thermal annealing for 40 seconds at $200{\sim}500^{\circ}C$ to produce $NiSi_x$. The resulting changes in sheet resistance, microstructure, phase, chemical composition and surface roughness were examined. The nickel silicide on a 60 nm a-Si:H substrate showed a low sheet resistance at T (temperatures) >$450^{\circ}C$. The nickel silicide on the 20 nm a-Si:H substrate showed a low sheet resistance at T > $300^{\circ}C$. HRXRD analysis revealed a phase transformation of the nickel silicide on a 60 nm a-Si:H substrate (${\delta}-Ni_2Si{\rightarrow}{\zeta}-Ni_2Si{\rightarrow}(NiSi+{\zeta}-Ni_2Si)$) at annealing temperatures of $300^{\circ}C{\rightarrow}400^{\circ}C{\rightarrow}500^{\circ}C$. The nickel silicide on the 20 nm a-Si:H substrate had a composition of ${\delta}-Ni_2Si$ with no secondary phases. Through FE-SEM and TEM analysis, the nickel silicide layer on the 60 nm a-Si:H substrate showed a 60 nm-thick silicide layer with a columnar shape, which contained both residual a-Si:H and $Ni_2Si$ layers, regardless of annealing temperatures. The nickel silicide on the 20 nm a-Si:H substrate had a uniform thickness of 40 nm with a columnar shape and no residual silicon. SPM analysis shows that the surface roughness was < 1.8 nm regardless of the a-Si:H-thickness. It was confirmed that the low temperature silicide process using a 20 nm a-Si:H substrate is more suitable for thin film transistor (TFT) active layer applications.

• Journal of the Korean institute of surface engineering
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• v.46 no.6
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• pp.235-241
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• 2013

In this study, the effects of alloying elements and thermal aging on the contact resistance of electroplated gold alloy layers were investigated by surface analysis using X-ray photoelectron spectroscopy (XPS). The contact resistance of Au-Ag alloy was lower than that of Au-Ni or Au-Co alloy after thermal aging. The XPS results show that nickel and oxygen present as nickel oxides such as NiO and $Ni_2O_3$ on the surface of gold layers after thermal aging. The increase in the contact resistance after thermal aging is attributable to the nickel oxide layer formed on the surface of the gold layers. The content of nickel diffused from the underlayer during the thermal aging was high in the order of Au-Co, Au-Ni and Au-Ag alloy because the area of grain boundary was large in the order of Au-Ag, Au-Ni and Au-Co alloy.

• Journal of Powder Materials
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• v.24 no.3
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• pp.242-247
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• 2017

In this study, the electroless nickel plating method has been investigated for the coating of Ni nanoparticles onto fine Al powder as promising energetic materials. The adsorption of nickel nanoparticles onto the surface of Al powders has been studied by varying various process parameters, namely, the amounts of reducing agent, complexing agent, and pH-controller. The size of nickel nanoparticles synthesized in the process has been optimized to approximately 200 nm and they have been adsorbed on the Al powder. TGA results clearly show that the temperature at which oxidation of Al mainly occurs is lowered as the amount of Ni nanoparticles on the Al surface increases. Furthermore, the Ni-plated Al powders prepared for all conditions show improved exothermic reaction due to the self-propagating high-temperature synthesis (SHS) between Ni and Al. Therefore, Al powders fully coated by Ni nanoparticles show the highest exothermic reactivity: this demonstrates the efficiency of Ni coating in improving the energetic properties of Al powders.

• Particle and aerosol research
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• v.10 no.4
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• pp.177-182
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• 2014

In this study, nickel-coated aluminum (Ni/Al) powders were synthesized for the utilization of energetic applications. Oxide materials present at the surface of Al powders of $45{\mu}m$ in averaged size were removed by using sodium hydroxide(NaOH) solution which is used for controlling pH. Nickel material is coated into the surface of oxide-removed Al powders by electroless-plating process. The microstructure of fabricated Ni/Al powders shows that nickel layers with a few hundreds nm were very homogeneously formed onto the surface of Al powders. The oxidation behavior of Ni/Al exihibit somewhat faster oxidation rate than that of pure Al with surface oxidation. Also, the higher exothermic reaction was observed from the Ni/Al powders. From the result of this, nickel coating is very promising method to obtain highly reactive and safe Al powders for energetic applications.