• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1057-1058
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• 2006

The preparation of $Ti_{50}Cu_{28}Ni_{15}Sn_7$ metallic glass composite powders was accomplished by the mechanical alloying of a pure Ti, Cu, Ni, Sn and carbon nanotube (CNT) powder mixture after 8 h milling. In the ball-milled composites, the initial CNT particles were dissolved in the Ti-based alloy glassy matrix. The bulk metallic glass composite was successfully prepared by vacuum hot pressing the as-milled CNT/$Ti_{50}Cu_{28}Ni_{15}Sn_7$ metallic glass composite powders. A significant hardness increase with the CNT additions was observed for the consolidated composite compacts.

• 한국태양에너지학회:학술대회논문집
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• 2009.04a
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• pp.230-234
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• 2009

It is significant technique to increase competitiveness that solar cells have a high energy conversion efficiency and cost effectiveness. When making high efficiency crystalline Si solar cells, evaporated Ti/Pd/Ag contact system is widely used in order to reduce the electrical resistance of the contact fingers. However, the evaporation process is no applicable to mass production because high vacuum is needed. Furthermore, those metals are too expensive to be applied for terrestrial applications. Ni/Cu/Ag contact system of silicon solar cells offers a relatively inexpensive method of making electrical contact. Ni silicide formation is one of the indispensable techniques for Ni/Cu/Ag contact sytem. Ni was electroless plated on the front grid pattern, After Ni electroless plating, the cells were annealed by RTP(Rapid Thermal Process). Ni silicide(NiSi) has certain advantages over Ti silicide($TiSi_2$), lower temperature anneal, one step anneal, low resistivity, low silicon consumption, low film stress, absence of reaction between the annealing ambient. Ni/Cu/Ag metallization scheme is an important process in the direction of cost reduction for solar cells of high efficiency. In this article we shall report an investigation of rapid thermal silicidation of nickel on silngle crystalline silicon wafers in the annealing range of $350-390^{\circ}C$. The samples annealed at temperatures from 350 to $390^{\circ}C$ have been analyzed by SEM(Scanning Electron Microscopy).

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2000.02a
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• pp.104-108
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• 2000

In this study, the fatigue test at room temperature and residual resistivity measurement test at 12K were carried out, respectively, using a 0 strand Cu-Ni/NbTi/Cu composite cable, in order to investigate how the annealing treatment effects on critical properties due to fatigue damage. Through a fatigue test of a 0 strand Cu-Ni/NbTi/Cu composite cables, a conventional S-N curve was obtained even though there existed a possibility of fretting among strands. From the resistivity measurement of a NbTi strand after fatigue tests, it was found that the RRR for annealed cables was 3 times more than that for as-received one, but with increase of the repeated number the RRR decreased which was resulted from the accumulation of damage such as lattice defects dislocation within the Cu stabilizer.

• Korean Journal of Materials Research
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• v.11 no.3
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• pp.171-177
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• 2001

The thermal and mechanical properties of amorphous Z $r_{62-x}$N $i_{10}$C $u_{20}$A $l_{8}$ $Ti_{x}$ (x=3, 6, 9at%) alloys were investigated. The crystallization process was confirmed as amorphous longrightarrow amorphous + Z $r_2$A $l_3$+ Zr + (Ni,Ti) longrightarrow Z $r_2$Cu + Al + (Ni,Ti) for 3at%Ti, amorphous longrightarrow amorphous + Al longrightarrow $Al_2$Ti + NiZr + CuTi for 6at%Ti and amorphous longrightarrow amorphous + Zr + Al longrightarrow Zr + $Al_2$Zr + Al $Ti_3$+ CuTi for 9at%Ti. lickers hardness ( $H_{v}$ ) increased with increasing volume fraction( $V_{f}$ ) of pricipitates for all concerned compositions. Tensile fracture strength ($\sigma_{f}$ ) showed a maximum value 1219MPa at $V_{f}$ = 38% for 3at%Ti, 1203MPa at $V_{f}$ = 2% for 6at%Ti and 1350MPa at $V_{f}$ = 5% for 9at%Ti. The $\sigma_{f}$ was rapidly decreased after showing the maximum value. The $V_{f}$ corresponding to rapidly decreased $\sigma_{f}$ coincided with the $V_{f}$ transited from ductile to brittle fracture surface.ace.

• Journal of the Korean Ceramic Society
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• v.37 no.4
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• pp.381-387
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• 2000

Si3N4/stainless steel 316 joints with Ni buffer layer were fabricated by direct active brazing method (DIB) using Ag-Cu-Ti brazing alloy only and double brazing method (DOB) using Ag-Cu brazing alloy with Si3N4 pretreated with Ag-Cu-Ti brazing alloy. For the joint brazed by DIB method, Ti was segregated at the Si3N4/brazing alloy interface, but was not enough to form a stable joint interface. In addition, large amounts of Ni-Ti inter-metallic compounds were formed in tehbrazing alloy near the joint interface, which could deplete the contents of Ti involved in the interfacial reaction. However, for the joint brazed by DOB method, segregation of Ti at the joint interface were enough to enhance the formation of stable interfacial reaction products such as TiN and Ti-Si-Ni-N-(Cu) multicompounds, which restricted the formation of Ni-Tio inter-metallic compounds in the brazing alloy during brazing with Ni buffer layer. Fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was much improved by using DOB method rather than DIB method. It could be deduced that the differences of fracture strength of the joint with Ni buffer layer depending on brazing process adapted were directly affected by the formation of stable joint interface and the change in microstructure of the brazing alloy near the joint interface. It was found that fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was gradually reduced as the thickness of interface. It was found that fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was gradually reduced as the thickness of Ni buffer layer in the joint was increased from 0.1 mm to 10 mm. It seems to due to the increased residual stress in the joint as the thickness of Ni buffer layer is increased. The maximum fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was 386 MPa, and the fracture of joint was originated at Si3N4/brazing alloy joint interface and propagated into Si3N4 matrix.

• Membrane Journal
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• v.34 no.2
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• pp.146-153
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• 2024

In this experiment, a Ti-based flat hydrogen separation membrane was designed and manufactured. In order to find a Ti-based hydrogen separation membrane of a new composition, the correlation between the physical-chemical properties and hydrogen permeability of various alloys was investigated. Based on this, two types of new alloy films (Ti_14.2Zr_66.4Ni_12.6Cu_6.8 (70 ㎛), Ti_17.3Zr_62.7Ni₂₀ (80 ㎛)) was designed and manufactured. The manufactured flat hydrogen separation membrane was tested for hydrogen permeation using mixed gas (H₂, N₂) and sweep gas (Ar) at 300~500℃ and 1~4 bar. The Ti_14.2Zr_66.4Ni_12.6Cu_6.8 alloy film has a maximum flux of 16.35 mL/cm² min at 500℃ and 4 bar, and the Ti_17.3Zr_62.7Ni₂₀ alloy film has a maximum flux of 10.28 mL/cm² min at 450℃ and 4 bar.

• Journal of the Korean Society for Heat Treatment
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• v.12 no.2
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• pp.145-156
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• 1999

The distribution of the second phase, the change of transformation temperature and mechanical properties with thermomechanical treatment conditions were investigated by metallography, calorimetry, EDS, tensile test and fractography in a Cu-Al-Ni-Ti-Mn alloy. The cast structure revealed Ti-rich precipitates($X_L$ phase) between dendrite arms, which have been identified as $(Cu,Ni)_2TiAl$ intermetallic compounds. By homogenizing above $900^{\circ}C$, the $X_L$ phase was melted in the matrix, while the Xs phase was precipitated in matrix and the volume fraction of it was increased. When hot-rolled specimen was betatized below $750^{\circ}C$, recrystallization could not be observed. However, the specimen betatized above $800^{\circ}C$ was recrystallized and the grain size was about $50{\mu}m$, while Xs phase was precipitated in matrix. With raising betatizing temperature, $M_s$ and $A_s$ temperatures were fallen and transformation hysteresis became larger. The strain of the specimen betatized at $800^{\circ}C$ was 8.2% as maximum value. The maximum shape recovery rate could be obtained in the specimen betatized at $800^{\circ}C$ but it was decreased due to the presence of Xs phase with increasing betatizing temperature.

• Journal of the Korean institute of surface engineering
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• v.50 no.3
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• pp.164-169
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• 2017

Ni-Cr-X ternary interlayers were investigated to improve the adhesion of Cu/Ni-Cr/Polyimide flexible copper clad laminates. The ternary compounds are sputtered Ni-Cr-X films (where X is one of Nb, V, Mo, or Ti), and the effect of third elements on the adhesion was evaluated and investigated chemically and mechanically. The feel strength was higher in the order of Ni-Cr-Nb > Ni-Cr-V > Ni-Cr > Ni-Cr-Mo > Ni-Cr-Ti. Nb, which has a comparable standard electrode potential to Cr, increased the adhesion, while Ti, with a low standard electrode potential, degraded the adhesion. The Ni-Cr-Nb interlayer was amorphous, while Ni-Cr-Ti was partially crystalline. The similar morphology structure of the Ni-Cr-Nb interlayer with polyimide resulted in a better adhesion.

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.05a
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• pp.135-135
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• 2001

• Journal of Korea Foundry Society
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• v.22 no.6
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• pp.288-292
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• 2002

Ni-base amorphous alloys were manufactured using melt-spinning and Cu-mold die casting methods. Amorphous formability, the supercooled liquid region before crystallization and mechanical properties were examined. The reduced glass transition temperature and the supercooled liquid region of $Ni_{51} Nb_{20} Zr_9 Ti_9 Co_8 Cu_3$alloy were 0.621 and 46 K respectively. $Ni_{51} Nb_{20} Zr_9 Ti_9 Co_8 Cu_3$ alloy was produced in the rod shape 3mm diameter using the Cu-mold die casting. Hardness, compression strength, elongation and elastic modulus of the alloy were 850 DPN, 2.75 GPa, 1.8% and 150 GPa respectively. Moreover, compression strength of 2.75 GPa was the highest value in the amorphous bulk alloy produced up to now.