• Title/Summary/Keyword: NiTiCu

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Geochemical Characteristics of Surface Sediments in the Eastern Part of the Yellow Sea and the Korean West Coast (황해 동부 대륙붕과 한반도 서해안 표층퇴적물의 지구화학적 특성)

  • 조영길;이창복;박용안;김대철;강효진
    • The Korean Journal of Quaternary Research
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    • v.7 no.1
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    • pp.69-91
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    • 1993
  • A total of 76 surface sediment samples, collected from the Korean west coast and the eastern Yellow Sea areas, were analyzed for their elemental composition in order to understand the geochemical characteristics of these deposits. The analyzed elements included 9 major elements (Al, Fe, Na, K, Mg, Ca, Ti, P, Mn), 8 minor elements (Sr, Ba, V, Cr, Co, Ni, Cu, Zn), organic carbon and calcium carbonate. Contents of most analyzed elements, excluding K and Ba, were generally low compared to those of average crust. Contents of most elements, except K and Ca, also correlated with sediment grain size, though the degree of relationship varied widely from one element to another. For fine-grained sediments, a distinction could be made between those in the central Yellow Sea and those in the Keum Estuary based on their characteristic elemental composition: the former were rich in Fe, Na, K, Mg, Ca and V, and the latter in Mn, Co and Ni. The element/aluminium ratios, on the other hand, showed that the central Yellow Sea muds were enriched in Fe, Mg, V, Ni, Cu and Zn and depleted in K, Mn, Ba and Sr relative to the mud located near the Korean Peninsula. Based on the analysis of these results, as well as of the influences of particular mineral phases or pollution effects, we could suggest geochemical criteria which can be used in distinguishing muds from the two different sources, the Keum River and the Yellow River: the former by the higher Mn content and the latter by the higher Mg and V contents, relative to each other.

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Electorchemical Reduction Behavior of Aliphatic Acetylenic Alcohol (Aliphatic Acetylenic Alcohol의 電極反應過程)

  • Kim Won Taik;Kim, Jin Il;Kwak Tai-Young;Lee Ju-Seong
    • Journal of the Korean Chemical Society
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    • v.23 no.3
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    • pp.180-185
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    • 1979
  • Electrochemical reduction behavior from 2-butyne-1, 4-diol (BID) to 2-butene-1,4-diol (BED) by the use of various cathodes, such as Ti, Zr, Ni, Pt, Cu, Ag, Au, Zn, Hg, Pb and graphite has been studied. It has been found that cathodic polarization curve with metal of IB subgroup such as Cu, Ag and Au consisted of one wave in BID-alkaline solution, whereas it was not formed any wave in BED solution. Therefore, it was found that the cathode which was the most suitable in order to proceed in this reaction was Cu, Ag and Au. At cyclic voltammetry using a silver cathode in BID-alkaline solution, the current of the peak was proportional to square root of the sweep rate of potential and also proportional to concentration of BID. Activation energy was calculated for 3.75 kcal/mole from the plot of log $I_l$ vs. 1/T. Consequently, the reduction current of BID with a silver cathode in alkaline solution was found the diffusion current.

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Synthesis and Characterization of Layer-Patterned Graphene on Ni/Cu Substrate

  • Jung, Daesung;Song, Wooseok;Lee, Seung Youb;Kim, Yooseok;Cha, Myoung-Jun;Cho, Jumi
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.618-618
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    • 2013
  • Graphene is only one atom thick planar sheet of sp2-bonded carbon atoms arranged in a honeycomb crystal lattice, which has flexible and transparent characteristics with extremely high mobility. These noteworthy properties of graphene have given various applicable opportunities as electrode and/or channel for various flexible devices via suitable physical and chemical modifications. In this work, for the development of all-graphene devices, we performed to synthesize alternately patterned structure of mono- and multi-layer graphene by using the patterned Ni film on Cu foil, having much different carbon solid solubilities. Depending on the process temperature, Ni film thickness, introducing occasion of methane and gas ratio of CH4/H2, the thickness and width of the multi-layer graphene were considerably changed, while the formation of monolayer graphene on just Cu foil was not seriously influenced. Based on the alternately patterned structure of mono- and multi-layer graphene as a channel and electrode, respectively, the flexible TFT (thin film transistor) on SiO2/Si substrate was fabricated by simple transfer and O2 plasma etching process, and the I-V characteristics were measured. As comparing the change of resistance for bending radius and the stability for a various number of repeated bending, we could confirm that multi-layer graphene electrode is better than Au/Ti electrode for flexible applications.

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Correlation between Mineralogical and Chemical Compositions of the Micro-Textures in Manganese Nodules (망간단괴 미세조직에 따른 광물조성과 화학조성의 상관관계)

  • 최헌수;장세원;이성록
    • Journal of the Mineralogical Society of Korea
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    • v.13 no.4
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    • pp.205-220
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    • 2000
  • 북동태평양 C-C지역의 우리나라 광구에서 산출되는 망간단괴의 내부조직을 크게 주상조직 층상대, 첨상조직 층상대, 첨상조직 괴상대, 첨상조직 다공질대 및 괴상조직 괴상대로 구분하였다. 주상조직 층상대에서는 버나다이트(vernadite)가 가장 우세하게 산출되며, 첨상조직 층상대에서는 부서라이크(buserite)가 함께 산출된다. 첨상조직 괴상대는 부서라이트의 산출이 두드러지며, 부분적으로 토도로카이트(todorokite)가 수반된다. 첨상조직 다공질대는 첨상체 또는 구상체로 이루어지며 부분적으로 괴상조직으로 교대되는데 주로 토도로카이트와 부서라이트로 구성되어 있다. 괴상조직을 갖는 괴상대에서는 토도로카이트와 버네사이트(birnessite)가 부서라이트와 함께 산출된다. 각 조직대별로 미세조직을 이루는 엽리들에 대해 전자현미분석을 실시하였다. 엽리의 화학조성을 구성하는 요인은 상관계수 군집분석에 의해 Mn-K의 Mn군, Cu-Ni-Zn-Mg(Ca-Na)의 Cu-Ni-Mg군 Fe-Co-Ti(Ca-P)의 Fe군과 Si-Al의 Si군 등 네 개군으로 구분된다. 각 조직대는 세 개 또는 네 개의 군으로 구성되며 이들 각군은 단괴에서 산출되는 광물과 밀접한 관계를 가진다. Mn군은 토도로카이트, Cu-Ni-Mg군은 부서라이트, Fe군은 함코발트수산화철광물, 그리고 Si군은 규산염광물에서 주로 기인하는 것으로 생각된다. 엽리의 화학조성은 이들 광물의 조합과 구성광물의 화학조성에 따라 지배되고 한 조직대내에서도 여러종류의 조합을 보이는데 이는 각 조직대의 엽리들의 성인과 밀접한 관련이 있는 것으로 생각된다.

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Geochemical Composition of Volcanic Ash from Historical Eruptions of Mt. Baekdu, Korea (역사시대에 분화한 백두산 화산재의 화학 성분)

  • Yun, Sung-Hyo;Koh, Jeon Seon;Chang, Cheolwoo
    • The Journal of the Petrological Society of Korea
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    • v.27 no.1
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    • pp.37-47
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    • 2018
  • Volcanic ash samples of historical eruptions from Mt. Baekdu were analyzed for major oxides, trace and rare earth elements by a variety of analytical techniques. The results indicate that the ashes consist of approximately 58.8~71.1 wt.% $SiO_2$, 9.6~16.8 wt.% $Al_2O_3$, 4.5~6.9 wt.% $Fe_2O_{3t}$, 0.1~1.7 wt.% MgO, 0.3~1.6 wt.% CaO, 5.2~6.3 wt.% $Na_2O$, 4.3~5.9 wt.% $K_2O$ and less than 1.2 wt.% $TiO_2$. Thirty two trace metals including Ba, Cu, Cr. Co, Ni, Sr, V, Zn, and Zr were analyzed. The ashes can be divided two groups: group A(1 ka Millennium pumice, 1668 and $190{\underline{3}}$ pumice) and group B(1702 pumice) according to the relative enrichment of HREEs. The abundances of heavy metals such as Cu, Co, Mn, and Zn were relatively low. As compared to the Sakurajima volcanic ash, Baekdusan volcanic ash has low concentrations of Y, Nb, Pb, U, Sc, V, Ni and Cu and high concentrations of Zr, Ba, Hf, Cr, Co, Zn and rare-earth (except Eu).

The surface propery change of multi-layer thin film on ceramic substrate by ion beam sputtering (이온빔 스퍼터링법에 의한 다층막의 표면특성변화)

  • Lee, Chan-Young;Lee, Jae-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.259-259
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    • 2008
  • The LTCC (Low Temperature Co-fired Ceramic) technology meets the requirements for high quality microelectronic devices and microsystems application due to a very good electrical and mechanical properties, high reliability and stability as well as possibility of making integrated three dimensional microstructures. The wet process, which has been applied to the etching of the metallic thin film on the ceramic substrate, has multi process steps such as lithography and development and uses very toxic chemicals arising the environmental problems. The other side, Plasma technology like ion beam sputtering is clean process including surface cleaning and treatment, sputtering and etching of semiconductor devices, and environmental cleanup. In this study, metallic multilayer pattern was fabricated by the ion beam etching of Ti/Pd/Cu without the lithography. In the experiment, Alumina and LTCC were used as the substrate and Ti/Pd/Cu metallic multilayer was deposited by the DC-magnetron sputtering system. After the formation of Cu/Ni/Au multilayer pattern made by the photolithography and electroplating process, the Ti/Pd/Cu multilayer was dry-etched by using the low energy-high current ion-beam etching process. Because the electroplated Au layer was the masking barrier of the etching of Ti/Pd/Cu multilayer, the additional lithography was not necessary for the etching process. Xenon ion beam which having the high sputtering yield was irradiated and was used with various ion energy and current. The metallic pattern after the etching was optically examined and analyzed. The rate and phenomenon of the etching on each metallic layer were investigated with the diverse process condition such as ion-beam acceleration energy, current density, and etching time.

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Formation of Low Temperature and Ultra-Small Solder Bumps with Different Sequences of Solder Layer Deposition (솔더 층의 증착 순서에 따른 저 융점 극 미세 솔더 범프의 볼 형성에 관한 연구)

  • 진정기;강운병;김영호
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.1
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    • pp.45-51
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    • 2001
  • The effects of wettability and surface oxidation on the low temperature and ultra-fine solder bump formation have been studied. Difference sequences of near eutectic In-Ag and eutectic Bi-Sn solders were evaporated on Au/Cu/Cr or Au/Ni/Ti Under Bump Metallurgy (UBM) pads. Solder bumps were formed using lift-off method and were reflowed in Rapid Thermal Annealing (RTA) system. The solder bumps in which In was in contact with UBM in In-Ag solder and the solder bumps in which Sn was in contact with UBM in Bi-Sn solder showed better bump formability during reflow than other solder bumps. The ability to form spherical solder bumps was affected mainly by the wettability of solders to UBM pads.

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Micro Forming of Bulk Metallic Glass using the Deformation Behavior in the Supercooled Liquid Region (과냉각 액체 영역에서의 변형거동을 이용한 벌크 비정질 합금의 미세성형 기술 개발)

  • 옥명렬;서진유;홍경태
    • Transactions of Materials Processing
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    • v.13 no.1
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    • pp.9-14
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    • 2004
  • Recently, various bulk metallic glasses (BMG's) having good mechanical and chemical properties were developed. BMG's can easily be deformed in the supercooled liquid region, via viscous flow mechanism. By using the viscous flow, the very low pressure is needed to deform the materials. In this study, we investigated the structural transition and deformation behavior of Vitreloy 1 (Zr/sub 41.2/Ti/sub 13.8/Cu/sub 12.5/Ni/sub 10/Be/sub 22.5/) using TMA and DSC. We applied the results to the micro forming process. The forming condition was chosen based on the viscosity data from TMA, and Si wafer with micro patterns on the surface was used as a forming die. The deformed surface was analyzed by SEM and 3D Surface Profiling System. The alloy showed good replication of the patterns. Quantitative measurement of roughness was useful to evaluate the replication. Surface condition of the deformed surface was determined by the initial surface condition.

Polarization Behavior of Li4Ti5O12 Negative Electrode for Lithiumion Batteries

  • Ryu, Ji-Heon
    • Journal of Electrochemical Science and Technology
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    • v.2 no.3
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    • pp.136-142
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    • 2011
  • $Li_4Ti_5O_{12}$ is prepared through a solid-state reaction between $Li_2CO_3$ and anatase $TiO_2$ for applications in lithium-ion batteries. The rate capability is measured and the electrode polarization is analyzed through the galvanostatic intermittent titration technique (GITT). The rate characteristics and electrode polarization are highly sensitive to the amount of carbon loading. Polarization of the $Li_4Ti_5O_{12}$ electrode continuously increases as the reaction proceeds in both the charge and discharge processes. This relation indicates that both electron conduction and lithium diffusion are significant factors in the polarization of the electrode. The transition metal (Cu, Ni, Fe) ion added during the synthesis of $Li_4Ti_5O_{12}$ for improving the electrical conductivity also greatly enhances the rate capability.