• Journal of the Korean Society for Heat Treatment
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• v.10 no.1
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• pp.20-29
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• 1997

Pure copper is widely used for base material for electrical and electronic parts because of its good electrical conductivity. However, it has such a low strength that various alloying elements are added to copper to increase its strength. Nevertheless, alloying elements which exist as solid solution elements in copper matrix severely reduce the electrical conductivity. The reduction of electrical conductivity can be minimized and the strengthening can be maximized by TMT(Thermo-Mechanical Treatment) in copper alloys. In this research, the effects of TMT on mechanical and electrical properties of Cu-Ni-Al-Si-P, Cu-Ni-Al-Si-P-Zr and Cu-Ni-Si-P-Ti alloys aged at various temperatures were investigated. The Cu alloy with Ti showed the hardness of Hv 225, electrical conductivity of 59.8%IACS, tensile strength of 572MPa and elongation of 6.4%.

• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1165-1167
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• 1995

The Cu-Si alloy has been proposed as a new matrix materal for filamentary Nb-Ti wires in AC use. The Cu-Si alloy shows approprite mechanical and electrical properties, and is economically more favourable than the Cu-Ni alloy matrix used currently. Moreover, the addition of Si to Cu prevents the formation of intermetallic compounds around the filaments. After we investigated resistivity and hardness of Cu-Si alloy as matrix materal, investigated CuSi/NbTi interface reactions and superconductivities of superconducting wires that were made by various heat treatment.

• Korean Journal of Materials Research
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• v.15 no.11
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• pp.697-704
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• 2005

The deformation behavior of a bulk amorphous and crystallized amorphous $Zr_{22.5}Ti_{14}Cu_{12.5}Ni_{10}Be_{22.5}$ alloy extracted from a commercial golf club head was characterized at room temperature ana $300^{\circ}C$. At room temperature, amorphous specimens revealed higher yield stress and ductility than partially crystallized alloy specimens. Amorphous alloy displayed some plasticity before fracture, which resulted from strain hardening and repeated crack initiation and propagation. The fracture is mainly localized on one major shear band, and the compressive fracture angle of the amorphous specimen between the stress axis and the fracture plane was about $40^{\circ}$ Scanning electron microscope observations revealed mainly a vein-like structure in the amorphous alloy But the fracture surface of partially crystallized amorphous alloy consisted of vein-like and featureless fracture structure. The partially crystallized alloy extracted from the thick part of the club fractured in the elastic region, at a much lower stress level than the amorphous, suggesting that relatively coarse crystal particles formed during cooling cause the brittle fracture.

• 연구논문집
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• s.22
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• pp.127-139
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• 1992

The mechnial properties such as fracture strength, ductility and fatigue strength of Cu shape memory alloy are lower than those of Ti-Ni SMA, because of their high elastic anisotropy and large grain size. And in order to improve the mechanical property of Cu SMA, some techniques such as casting method by addition of refining element, powder metallurgy and rapid solidification process have been studied on the refinement of the grain size of Cu SMA. This study was carried out to refine the grain size of CuAlNi SMA by applying the melt spinning method. According to this study, the conclusions are as follows; - grain size of the melt-spun ribbon was about $1\mum$ - there was not change in grain size, although increasing of hot pressing temperature -grain size of the hot-extruded specimen was about $30-40\mum$, it is more refiner than that of castings

• Journal of the Korean Magnetics Society
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• v.6 no.5
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• pp.323-328
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• 1996

NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$) trilayers were formed on the $4^{\circ}$ tilt-cut Si(111) substrate by rf magnetron sputtering method. With a Cu($50\;{\AA}$) underlayer, NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$) trilayers developed in-plane magnebc anisotropy and in-plane perpendicular alignment of easy axes in two magnetic components of NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$) trilayers has been found. The easy axis of Co layer consisbng of NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$) trilayers turned out to be along $4^{\circ}$ tilt Si <112> direcbon and that of NiFe layer along Si <110> direction. [NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$)]/Cu($50\;{\AA}$)/Si(111, $4^{\circ}$ tiIt-cut) trilayers showed about 2.2 % MR ratio at room temperature and large plateau in MR curves, which are more improved MR characteristics than those in [NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$)]/Cu($50\;{\AA}$)/glass trilayers with no appreciable magnetic anisotropy.

• Progress in Superconductivity and Cryogenics
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• v.3 no.1
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• pp.1-5
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• 2001

In order to investigate the effect of fatigue damage on the properties of RRR in this study. fatigue tests at room temperature and residual resistivity measurement tests at 12K were carried out using annealed 9 strand Cu-Ni/NbTi/Cu composite cables Through fatigue tests of NbTi composite cables. a conventional S-N curve could be obtained even though there existed a possibility of fretting among strands, From the resistivity measurement of a NbTi strand after fatigue test, it was found that the RRR of xii·gin strand for annealed cables was 3 times more than that for as-received one. With increasing of fatigue cycles at a sress amplitude level. the RRR decreased. which was resulted from the accumulation of damage such as lattice defects and dislocation within the Cu stabilizer.

• Journal of Powder Materials
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• v.1 no.2
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• pp.145-152
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• 1994

Atomizing mode and powder characteristics of CuA1Ni base shape memory alloy in rotating disk atomization were investigated in accordance with disk materials and additional elements. Produced powders were classified into two types of spherical and flake shape. In the case of CuAlNiBTi and CuAlNiZr alloy, high yield rate and fine powder were obtained. This tendency was same when we used oxide coated disks. We concluded that this results were steno from the wetting characteristics change between molten metal and disk surface. Especially, due to the reactive properties of Ti and Zr with ceramic disk, the change of atomizing appearance and powder characteristics were noticeable.

• Journal of the Korean Society for Heat Treatment
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• v.20 no.1
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• pp.17-21
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• 2007

In this study, brazing characteristics of the dissimilar Ti and Cu metals using a Zr-base amorphous filler ($Zr_{41.2}Ti_{13.8}Cu_{12.5}Ni_{10.0}Be_{22.5}$ in at.%) have been investigated for various bonding temperatures. In the sample brazed at $790^{\circ}C$ for 10 min., the Ti-rich phases in the joint were observed, while the Cu-rich phases were obtained in the sample brazed at $825^{\circ}C$ for 10 min.. Such a different microstructure and composition in the joints could be explained by the degree of the dissolution reaction. At $790^{\circ}C$, the reaction between the Zr-rich liquid phase and the Ti base metal was actively occurred to form Ti-rich liquid phase in the joint. As the temperature increased to $825^{\circ}C$, however, the reaction between the Ti-rich liquid phase and the Cu base metal was promoted to form the Cu-rich liquid phase in the joint finally. Such a different interface reaction is attributed to the reactivity or solubility between the Zr as a main element in the filler and the Ti and Cu as a base metal element.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.66-66
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• 2009

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites(diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature 940 $^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.

• Journal of Welding and Joining
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• v.28 no.3
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• pp.49-58
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• 2010

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites (diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature $940^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.