• Title/Summary/Keyword: NiO - CuO

Search Result 608, Processing Time 0.032 seconds

A study on the single buffer layers for the application of $YBa_{2}$$Cu_{3}$$O_{7-\delta}$ coated conductors (Y$Ba_{2}$$Cu_{3}$$O_{7-\delta}$ coated conductors의 응용을 위한 단일완충층에 대한 연구)

  • ;;;Donggi Shi
    • Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
    • /
    • 2003.10a
    • /
    • pp.120-122
    • /
    • 2003
  • BaZrO$_3$and SrTiO$_3$(STO) thin films were Pulsed laser deposited on biaxially textured Ni and Ni-W alloy substrates to be used as single buffer layer for coated conductor. The texture of the films were analysed using the GADDS (general area detector diffraction system). Both films deposited on the metal tape were strongly (001) oriented, and in-plane textured (Δø (BZO) =9$^{\circ}$, Δø (STO) = 10$^{\circ}$).

  • PDF

Influence of Doping Elements on the. Formation of Superconducting Phase in the Bi-Sr-Ca-Cu-O System (Bi-Sr-Ca-Cu-O 계에 서 초전도상 형성에 미치는 도우핑 원소의 영향)

  • 양승호;정지인;박용필
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 1999.11a
    • /
    • pp.217-220
    • /
    • 1999
  • We investigated the effects of doping elements on the Bi-Sr-Ca-Cu-0 ceramics. The doping elements can be classified into groups depending on their supeconducting characteristics in the Bi -Sr-Ca-Cu -O structure. The first group of doping elements(Co, Fe, Ni and Zn) substitute into the copper site and can reduce the critical temperatures of the 2223 and 2212 phases. The second group of doping elements(Y and La) substitute into the Ca site and cause the disappearance of the 2223 phase and increase the critical temperatures in the 2212 phase.

  • PDF

Phase Transformation and Reversible Shape Memory Effect of Ti-Ni-Cu Alloys (Ti-Ni-Cu 합금의 상변태 및 가역형상기억효과)

  • Hong, S.W.;Lee, O.Y.;Kim, D.K.
    • Journal of the Korean Society for Heat Treatment
    • /
    • v.5 no.3
    • /
    • pp.149-156
    • /
    • 1992
  • Transformation behavior and reversible shape memory effct of Ti-Ni-Cu alloys with various Cu content has been investigated by means of electrical resistivity measurement, differential scanning calorimetry. X-ray diffraction and strain gage sensor. The transformation sequence in Ti-Ni-Cu alloys substituted by Cu for Ni up to 5at.% occurs to $B2{\leftrightarrow}B19^{\prime}$ and it proceeds in two stages by addition of 10 at.%Cu. i.e. $B2{\leftrightarrow}B19{\leftrightarrow}B19^{\prime}$. But the content of Cu increases up to 20at.%, it has been transformed in one stage ; $B2{\leftrightarrow}B19$. The shape change of Ti-40Ni-10Cu alloy which was constrain aged in circular form bended in $B2{\leftrightarrow}B19$ transformation but it spreaded out in $B19{\leftrightarrow}B19^{\prime}$ transformation. The amount of reversible shape change (${\Delta}{\varepsilon}$) of Ti-47Ni-3Cu alloy constrain aged at $400^{\circ}C$ after solution treatment has a maximum value of about $5.6{\times}10^{-3}$, but that of cold rolled and constrain aged specimens exhibits a little value independent of Cu concentrations.

  • PDF

The Adhesion Strength and Interface Chemical Reaction of Cu/Ni/Polyimide System (Cu/Ni/Polyimide 시스템의 접착력 및 계면화학반응)

  • Choi, Chul-Min;Chae, Hong-Chul;Kim, Myung-Han
    • Korean Journal of Materials Research
    • /
    • v.17 no.12
    • /
    • pp.664-668
    • /
    • 2007
  • The magnetron sputtering was used to deposit Ni buffer layers on the polyimide surfaces to increase the adhesion strength between Cu thin films and polyimide as well as to prevent Cu diffusion into the polyimide. The Ni layer thickness was varied from 100 to $400{\AA}$. The adhesion strength increased rather significantly up to $200{\AA}$ of Ni thickness, however, there was no significant increase in strength over $200{\AA}$. The XPS analysis revealed that Ni thin films could increase the adhesion strength by reacting with the polar C=O bonds on the polyimide surface and also it could prevent Cu diffusion into the polyimide. The Cu/Ni/ polyimide multilayer thin films showed a high stability even at the high heating temperature of $200^{\circ}C$, however, at the temperature of $300^{\circ}C$, Cu diffused through the Ni buffer layer into polyimide, resulting in the drastic decrease in adhesion strength.

Electro-Magnetic Properties & Manufacturing Process of (NiCuZn)-Ferrites for Multilayer chip inductor by Wet Process (습식합성법을 이용한 칩인덕터용 (NiCuZn)-Ferrites의 제조공정과 전자기적 특성)

  • 허은광;김정식
    • Proceedings of the International Microelectronics And Packaging Society Conference
    • /
    • 2002.05a
    • /
    • pp.165-168
    • /
    • 2002
  • 본 연구에서는 칩인덕터 코어 소재로 사용되는 (NiCuZn)-ferrite를 습식합성법을 이용하여 나노크기의 초미세 분말을 합성하였으며, 합성된 (ZiCuZn)-ferrite 의 제조공정 및 전파기적 특성에 관하여 고찰하였다. 조성은 (N $i_{0.4-x}$C $u_{x}$Z $n_{0.6}$)$_{1+w}$ (F $e_2$ $O_4$)$_{1-w}$에서 x의 값을 0.05~0.25 범위로 변화시켰으며, w 값은 0.03으로 고정하였다. 소결은 8$50^{\circ}C$에서 9$50^{\circ}C$의 범위에서 진행하였다. 나노크기의(NiCuZn)-ferrite를 사용함으로서 시약급 원료로 제조된 것보다 소결온도를 낮출 수 있었고, 밀도가 높은 페라이트 소결체를 얻을 수 있었다. 또한 초투자율, 품질계수 등 전자기적 특성이 우수하게 나타났다. 그 밖에 습식합성법으로 합성한 (NiCuZn)-ferrite 의 결정성, 미세구조 등을 XRD, SEM 을 이용하여 고찰하였다.하였다.다.

  • PDF

Separation for the Determination of $^{59/63}Ni$ in Radioactive Wastes (방사성 폐기물 내 $^{59/63}Ni$ 정량을 위한 분리)

  • Lee, Chang-Heon;Jung, Kie-Chul;Choi, Kwang-Soon;Jee, Kwang-Young;Kim, Won-Ho
    • Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
    • /
    • v.3 no.4
    • /
    • pp.309-317
    • /
    • 2005
  • A study on the separation of $^{99}Tc,\;^{94}Nb,\;^{55}Fe,\;^{90}Sr\;and\;^{59/63}Ni$ in various radioactive wastes discharged from nuclear power plants has been performed for a use in their quantification which is indispensible for the evaluation of the radionuclide inventory Ni was recovered along with Ca, Mg, Al, Cr, Ti, Mn, Ce, Na, K, and Cu through the sequential separation procedure of Re(as a surrogate of $^{99}Tc$), Nb, Fe and Sr by anion exchange and Sr-Spec extraction chromatography. In this research, chemical separation of Ni from the co-existing elements was investigated by cation exchange and Ni-Spec extraction chromatography. Precipitation behaviour of Ni and the co-existing elements with dimethylglyoxime(DMG) was investigated in ammonium $citrate/ethanol-H_2O$ and tartaric $acid/acetone-H_2O$ in order to purify separated Ni fractions and to prepare $^{59/63}Ni$ source for the radioactivity measurement using a gas proportional counter. Recovery of Ni separated through ion exchange chromatographic separation procedure was $92.1\%$ with relative standard deviation of $0.9\%$. In addition, recovery of Ni with DMG in the tartaric $acid/acetone-H_2O$ was $85.6\%$ with relative standard deviation of $1.9\%$.

  • PDF

Growth Conditions of $SrTiO_3 $ Film on Textured Metal Substrate for $YBa_2CU_3O_{7-\delta}$ Coated Conductor ($YBa_2CU_3O_{7-\delta}$ coated Conductor 완충층으로의 응용을 위한 $SrTiO_3 $ 박막의 성장 조건)

  • Chung, J.K.;Ko, R.K.;Song, K.J.;Park, C.;Kim, C.J.
    • Korean Journal of Crystallography
    • /
    • v.14 no.2
    • /
    • pp.51-55
    • /
    • 2003
  • SrTiO₃ (STO) thin fims were deposited on the biaxially textured Ni-3 wt%W alloy substrates to be used as a single buffer layer for YBa₂CU₃O/sub 7-8/(YBCO) coated conductor. Thin films of YBCO and STO were deposited using pulsed laser. The deposition condition for epitaxial growth of STO on the textured metal was identified, and YBCO coated conductor with a single STO buffer layer with critical current density of 1.2 MA㎠ at 77 K under zero magnetic field and critical temperature of 86 K, was fabricated.