• 한국초전도ㆍ저온공학회논문지
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• 제18권1호
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• pp.37-40
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• 2016

We have investigated the addition effect of NiO magnetic nanoparticles on crystal structure, microstructure as well as superconducting properties of $MgB_2$. NiO-added $MgB_2$ samples were prepared by the solid-state reaction method. The superconducting transition temperature ($T_c$) of 37.91 K was obtained for pure $MgB_2$, and $T_c$ was found to decrease systematically on increasing the addition level of NiO. X-ray diffraction (XRD) analysis revealed that no substitution of Ni for Mg in the lattice of $MgB_2$ was occurred. The microstructural analysis shows that the pure $MgB_2$ sample consists of plate shape $MgB_2$ grains, and the grains get refined to smaller size with the addition of NiO nanoparticles. At 5 K, high values of critical current density ($J_c$) were obtained for small amount NiO-added $MgB_2$ samples as compared to pure sample. The enhancement in $J_c$ could be attributed to the refinement of $MgB_2$ grains which leads to high density of grain boundaries in NiO-added $MgB_2$ samples.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.204.1-204.1
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• 2014

스마트폰과 같은 통신기기 및 각종 전자제품에 있어 크기의 축소와 간소화 추세에 따라 인쇄회로기판(PCB)의 초미세회로설계 기술이 요구됨에 따라, 인쇄회로기판과 첨단 전자부품 사이의 접합 신뢰성을 향상시키기 위해 무전해 니켈 도금이 널리 사용되고 있다. 일반적으로, 무전해 Ni도금은 강산, 강염기성 용액을 이용하여 수행되고 있다. 따라서, 공정과정 중에 기판의 손상을 초래하기도 할뿐만 아니라, 환경적으로도 문제시 되고 있다. 본 연구에서는 친환경적 도금공정의 개발을 위해 중성에서 N-(B)무전해 도금을 시행하였다. 중성의 무전해 도금공정은 어떠한 기판을 사용하여도 기판의 손상없이 도금이 가능하다는 장점을 가지고 있고, Boron(B)은 Ni을 비정질화 시키는 물질로 알려져 있다. B가 첨가된 무전해 Ni도금 박막에 있어 B의 영향을 알아보기 위하여 중성조건에서 B를 포함한 DMAB의 첨가량을 조절하였다. Ni-(B) 무전해 도금 시 도금조의 온도는 $40^{\circ}C$로 하였고, 무전해 도금액의 pH는 7(중성)로 유지하였다. Cu Foil기판을 사용하여 DMAB의 양에 따라 성장된 Ni-B무전해 도금 박막의 특성을 분석하기 위해 X-ray Diffraction (XRD), Field Emission Scanning Electron Microscope (FE-SEM), Optical microscope (OM), X-ray Photoelectron Spectroscopy (XPS), X-ray Absorption Spectroscopy (XAS)을 이용하였다.

• 열처리공학회지
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• 제21권1호
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• pp.26-32
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• 2008

Effects of annealing treatment on microstructure and mechanical property of co-sputtered TiNi thin films were studied. As-deposited films showed amorphous state. However, above annealing temperature of $500^{\circ}C$ martensite phase (B19'), precipitate phase ($Ti_2Ni$) and a small amount of parent phase ($B_2$) were present, and phase transformation behaviors were three multi-step phase transformations $B19^{\prime}{\rightarrow}B_2$ and $B_2{\rightarrow}R-phase$ and $R-phase{\rightarrow}B19^{\prime}$. Increase of martensite transformation temperature, increase of microhardness and Young's modulus of TiNi films annealed above $500^{\circ}C$ were discussed in terms of precipitate phase.

• Journal of Welding and Joining
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• 제30권6호
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• pp.106-112
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• 2012

This study was carried out to investigate the effect of bonding temperature and holding time on microstructure and mechanical properties in brazing joints of Ni-base superalloy using MBF-30 (Ni-4.5Si-3.2B [wt.%]). The heating rate was $20^{\circ}C$/min to the bonding temperatures $1050^{\circ}C$, $1070^{\circ}C$, $1090^{\circ}C$ under high vacuum condition. The holding times were 100s, 400s, 900s and 1600s. $Ni_3B$ phases and proeutectic Ni were observed in the interlayer of Ni-201. Then, Ni3B and Ni3Si were found in the middle region of brazing joint. Cr-boride phase appeared in the interlayer of Inconel-625. Tensile strength and elongation were decreased at $1050^{\circ}C$-1600s, $1070^{\circ}C$-900s and $1090^{\circ}C$-400s. After observation the fracture specimens, There was Ni3B which is very brittle phase in the grain boundary of Ni201.

• Transactions on Electrical and Electronic Materials
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• 제12권1호
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• pp.28-31
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• 2011

Transformation behavior and shape memory characteristics of Ti-(45-x)Ni-5Cu-xCr (x=0.5-2.0) alloys have been investigated by means of electrical resistivity measurements, differential scanning calorimetry, X-ray diffraction and thermal cycling tests under constant load. Two-stage B2-B19-B19' transformation occurred in Ti-(45-x)Ni-5Cu-xCr alloys. The B2-B19 transformation was separated clearly from the B19-B19' transformation in Ti-44.0Ni-5Cu-1.0Cr and Ti-43.5Ni-5Cu-1.5Cr alloys. A temperature range where the B19 martensite exists was expanded with increasing Cr content because decreasing rate of Ms (85 K / % Cr) was larger than that of Ms' (17 K / % Cr). Ti-(45-x)Ni-5Cu-xCr alloys were deformed in plastic manner with a fracture strain of 68% ~ 43% depending on Cr content. Substitution of Cr for Ni improves the critical stress for slip deformation in a Ti-45Ni-5Cu alloy due to solid solution hardening.

• 한국분말재료학회지
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• 제6권4호
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• pp.270-276
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• 1999

Ti-Ni-Cu alloy powders were fabricated by ball milling, and the properties of these powders were characterized. Mixed 50Ti-(50-x)Ni-xCu powders of 5 to 10at.%Cu composition were milled for 100 hours using SUS 1/4" balls in argon atmosphere. Ball to powder ratio was 20:1 and rotating speed was 100 rpm. Tensile strength, microstructure and phase transformation of ball milled Ti-(50-x)Ni-xCu powders were studied. After 100 hours milling, Ti, Ni and Cu elements were alloyed completely and an amorphous phase was formed. Amorphous phase was crystallized to martensite(B 19') and austenite(B2) after heat treatment for 1 hour at $850^{\circ}C$. As the Cu contents were increased, tensile strength of extruded 6061Al/TiNiCu was decreased, and B19'martensite phases In the TiNi particles were the causes of high tensile stress of extruded 6061Al/TiNiCu.NiCu.

• 한국재료학회지
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• 제14권8호
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• pp.552-557
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• 2004

Thin Ni-B films, 1 ${\mu}m$ thick, were electrolessly deposited on Cu bus electrode fabricated by electro deposition. The purpose of these films is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier against copper contamination of dielectric layer in AC-plasma display panel. The layers were heat treated at $580^{\circ}C$(baking temperature of dielectric layer) with and without pre-annealing at $300^{\circ}C$($Ni_{3}B$ formation temperature) for 30 minutes. In the layer with pre-annealing, amount of Cu diffusion was lower about 5 times than that in the layer without pre-annealing. The difference of Cu concentration could be attributed to Cu diffusion before $Ni_{3}B$ formation at grain boundaries. However, the diffusion behavior of the layer with pre-annealing was similar to that of the layer without pre-annealing after $Ni_{3}B$ formation. With increasing annealing time, Cu concentration of both layers increased due to grain growth.

• 한국자기학회지
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• 제16권4호
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• pp.193-196
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• 2006

제일원리적 국소 스핀밀도 근사에 의한 계산방법을 이용하여 Ni 나노와이어에 대한 전자구조와 자기적 성질을 연구하였다. 단위 세포당 Ni 원자의 개수(n = 1 − 4)에 따른 구조적 특성에 따라 각각의 나노와이어에 대한 결합에너지와 자기모멘트를 계산하였다. 계산결과 지그재그-사각형 $Ni_4$ 나노와이어가 에너지적으로 가장 안정하였다. 또한 Ni 나노와이어의 자기모멘트는 선형 나노와이어 Ni1가 $1.34 {\mu_B}/atom$ 로 가장 큰 값을 나타냈으며, 단위 세포당 원자 개수가 증가될수록 자기모멘트는 감소하여 사각형 나노와이어 $Ni_4$의 자기모멘트가 $0.91 {\mu_B}/atom$ 로 가장 작은 값을 나타냈다. $Ni_n$(n = 1 − 4)의 각각의 구조들에 대한 상태밀도, 에너지 띠 등의 전자구조 계산결과를 제시하고 논의 검토하였다.

• 한국분말재료학회지
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• 제9권5호
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• pp.352-358
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• 2002

The effects of boron or manganese added as $B_4C$, Mn, $TiB_2$, B on TiC-30vo1.%$Ni_3Al$ cermet sintered at 1380 and $1400^{\circ}C$ for 1 hour, were examined in relation with shrinkage, relative density, microstructure, lattice parameter, hardness and fracture toughness ($K_{IC}$). The results are summarized as follows: 1) The highest shrink-age showed about 30.5% in the specimen added B$_4$C and the maximum relative density was about 99% in the specimen added $TiB_2$; 2) The grains of TiC were grown during sintering and made the surrounding structure by adding boron and manganese. The largest grain size showed about $2.8\mutextrm{m}$ in the specimen with boron sintered at $1400^{\circ}C$;3) The lattice parameter of TiC was about $4.325\AA$ and $Ni_3Al$ about $3.592\AA$ by adding other elements; 4) The highest hardness was about $1100kgf/\textrm{mm}^2$ in the specimen with B4C; 5) The fracture toughness ($K_{IC}$) showed about $15MNm^{-3/2}$ in the specimen added $TiB_2$.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2008년도 추계학술대회 초록집
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• pp.140-140
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• 2008

Ni-B 합금 도금은 여러 가지 Boron 화합물을 이용한 무전해 도금에 비중을 두고 많은 연구가 이루어졌다. 전해 도금은 무전해 도금과 비교하여 욕조성이 단순하고 관리가 용이하며 하며 넓은 범위의 Boron 함량을 조절할 수 있는 이점이 있다. 본 연구에서는 낮은 Boron 함량의 Ni-B 합금층을 전기도금하여 여러 가지 물성을 연구하였다.