• 한국환경복원기술학회지
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• 제11권5호
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• pp.1-11
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• 2008

This study was carried out to provide primary data set for cleaning of contamination site. By having hydroponic culture on Salix alba and S. caprea seedling treated with Ni solution, the result of Ni accumulation came out as followings : In a treatment of Ni to the Salix alba and S. caprea, Ni accumulation increased in its root, leaves, and stem, as Ni concentration became higher until $10.0{\mu}mol$. But in a $100.0{\mu}mol$ treatment, the seedlings died after 4 weeks. Ni accumulation in the Salix alba and S. caprea was the highest in its roots, second-highest in leaves, and the lowest in stems. In the case of $10.0{\mu}mol$ treatment of Ni solution, Ni accumulation in roots were above 500.0mg/L, and leaves were above 20.0mg/L. But it was lower than 13.0mg/L in stems. Ni accumulation in the plant increased more when nutrient solution containing Ni was weekly changed than just refilling the same amount of nutrient solution that evaporated Ni accumulation in Salix alba was higher than S. caprea when the nutrient solution had been refilled only.

• 한국결정성장학회:학술대회논문집
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• 한국결정성장학회 2000년도 Proceedings of 2000 International Nano Crystals/Ceramics Forum and International Symposium on Intermaterials
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• pp.243-248
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• 2000

Effect of NiO addition on microstructure, stability of tetragonal phase and mechanical properties was investigated. (Y, Ni)-TZP solid solution was obtained by pressureless sintering. The fracture toughness was increased by solid solution of NiO. Neither reaction phase nor glassy phase was observed at the grain boundaries. From these results, it was determined that solid solution of NiO was destabilized tetragonal phase of Y-TZP. Y-TZP/Ni nanocomposite that contained nano-sized Ni particles was also fabricated by internal reduction method. Some evaluations and discussions were carried out for both (Y, Ni)-TZP solid solution and Y-TZP/Ni nanocomposite.

• 한국산림과학회지
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• 제99권3호
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• pp.292-297
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• 2010

본 연구는 Ni 오염지를 정화하기 위한 기초자료를 제공하고자 Ni 수용액에서 Salix reichardtii를 수경재배 한 후 수용액의 pH 변화와 부위별 Ni 축적량을 분석하여 다음과 같은 결과를 얻었다. 영양액의 pH는 Ni의 처리농도가 낮아 S. reichardtii의 생장속도가 높을수록 많이 낮아졌고 Ni의 농도가 높아 생장속도가 저조할수록 적게 낮아졌다. 부위별 Ni의 축적량은 뿌리가 가장 높고 다음이 잎, 줄기의 순이었으며 오래된 줄기 내 축적량이 가장 낮았다. 즉, 식물체의 조직이 유연하고 생활세포가 많을수록 Ni축적량이 많은 것으로 나타났다. 또한 Ni의 처리 50 ${\mu}mol$/L까지 는 농도가 높아질수록 체내 축적량은 높아졌으나 100.0 ${\mu}mol$/L처리구에서는 식물체가 고사되어 체내 축적량이 오히려 감소되는 경향이었다. Ni가 농도별로 함유된 영양액에서 수경재배 한 결과 Ni를 고농도로 처리할수록 S. reichardtii의 생장은 저조하였으며, Ni 100.0 ${\mu}mol$/L처리구에서는 4주후 거의 고사수준이었다.

• 한국표면공학회지
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• 제44권3호
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• pp.117-123
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• 2011

We investigated the spectroscopic and electrochemical properties of the citrate-based CuNi solution at different solution pH and analyzed various surface properties of CuNi codeposition layer. By combining UV-Visible spectroscopic data with potentiodynamic polarization curves, it could be found that the complexation of $Ni^{2+}$-citrate pair was completed at lower solution pH than $Cu^{2+}$-citrate pair and was affected by the coexistent $Cu^{2+}$ ions, while the complexation between $Cu^{2+}$ ions and citrate was not sensitive to the presence of $Ni^{2+}$ ions. Also, the electron transfer from cathode to $Cu^{2+}$-citrate and$Ni^{2+}$-citrate was hindered by strong complexation between $Cu^{2+}/Ni^{2+}$ ions and citrate and so apparent codeposition current densities were reduced as the solution pH increases. CuNi codeposited layers had a higher Cu content when they were prepared at high pH solution due to the suppression of Ni deposition, and when codeposition was executed in an agitated condition due to the acceleration of mass transfer of $Cu^{2+}$ ions in the solution. Actually, solution pH had little effect on the surface morphology and deposits orientation, but greatly influenced the corrosion resistance in 3.5% NaCl solution by modifying the chemical composition of CuNi layers and so pH 3 was expected as the most suitable solution pH in the viewpoint of corrosion coatings.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2014년도 추계학술대회 논문집
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• pp.214-214
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• 2014

Computational analysis of aqueous solution stability of Fe-Cr-Ni system to find an electroplating condition of Fe-Cr-Ni layer. Aqueous sulfate solution with iron, chromium and nickel ions was selected by using a numerical S/W with which aqueous solution stability was analyzed. Several possible conditions to perform electro-forming of Fe-Cr-Ni were selected with thermo-dynamical data. The Fe-Cr-Ni system was electro-formed which composition and microstructure of the electroplated Fe-Cr-Ni significantly depended on the solution temperature and electro-potential. The final composition of Fe-3%Cr-48%Ni with less than $30{\mu}m$ thick was well electroplated.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1994년도 하계학술대회 논문집 C
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• pp.1342-1344
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• 1994

Silver-Nickel alloy has been used as a electrical contact material for low voltage, low current. Since the solubility between Ag and Ni is very low, it is difficult to produce Ag-Ni alloy by using conventional melting method and disperse Ni powder homogeneously in Ag matrix. In this study we have been produced fine Ag-Ni alloy powder by using coprecipitation method. Firstly, we have produced silver-nickel nitrate solution by dissolving the Ag and Ni ingot in nitric acid solution and then, coprecipitate (Ag, Ni)carbonate dropping Ag-Ni nitrate solution to sodium carbonate solution. (Ag, Ni) carbonate is heat-treated in $H_2$ atmosphere, $400^{\circ}C$ and it has been analysed by TGA, SEM, XRD, ICP. It is represented Silver-Nickel alloy powder in the particle range of $0.1{\sim}0.5{\mu}m$.

• Journal of Information Display
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• 제2권2호
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• pp.7-12
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• 2001

A viscous Ni solution was coated over amorphous Si thin film for evenly spread of Ni metal source. The Ni s. prepared by dissolving $NiCl_2$ into IN HCI and mixing with propylene glycol. $NiCl_2$ and Ni were deposited on the amorphous film after oven dry and they enabled to obtain a uniform crystallization. The crystallization using the viscous Ni solution was a Ni-silicide mediated process, the same process used with Ni metal layer. The crystallization temperature was lowered to $480^{\circ}C$ by the synergy effect of silicide-mediated crystallization and microwave-induced crystallization. Lateral crystallization was also enhanced such that the velocity of lateral crystallization by microwave annealing became faster than by furnace annealing.

• Journal of Electrochemical Science and Technology
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• 제9권2호
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• pp.93-98
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• 2018

$MnO_2$, a metal oxide used as an electrode material in electrochemical capacitors (EDLCs), has been applied in binary oxide and conducting polymer hybrid electrodes to increase their stability and capacitance. We developed a method for electrodepositing Mn-Ni oxide/PANI, Mn-Ni oxide/PEDOT, and Mn-Ni-Ru oxide/PEDOT films on carbon paper in a single step using a mixed bath. Mn-Ni oxide/PEDOT and Mn-Ni-Ru oxide/PEDOT electrodes used in an electro-osmotic pump (EOP) have shown better efficiency compared to Mn-Ni oxide and Mn-Ni oxide/PANI electrodes through testing in water as a pumping solution. EOP using a Mn-Ni-Ru oxide/PEDOT electrode was also tested in a 0.5 mM $Li_2SO_4$ solution as a pumping solution to confirm the effect of the $Li^+$ insertion/de-insertion reaction of Ruthenium oxide on the EOP. Experimental results show that the flow rate increases with the increase in current in a 0.5 mM $Li_2SO_4$ solution compared to that obtained when water was used as a pumping solution.

• 한국표면공학회지
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• 제52권2호
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• pp.78-83
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• 2019

Chloride baths for electrodeposited Ni thin films were fabricated by dissolving metal Ni powders with the mixed solution consisting of HCl and de-ionized water. Current efficiency, residual stress, surface morphology and microstructure of Ni films with the change of metal ion ($Ni^{2+}$) concentrations in the plating solution were studied. Current efficiency was measured to be more than 90% with increasing $Ni^{2+}$ concentrations in the plating solution. Residual stress of Ni thin film was increased from about 400 to 780 MPa with increasing $Ni^{2+}$ concentration from 0.2 to 0.5 M. It is gradually decreased to 650 MPa at 0.9 M $Ni^{2+}$ concentration. Smooth surface morphologies were observed over 0.3 M $Ni^{2+}$ concentration, but nodule surface morphology at 0.2 M. Ni films consist of FCC(111), FCC(200), FCC(220) and FCC(311) peaks in XRD patterns. Preferred orientation of FCC(111) was observed and its intensity was slightly decreased with increasing $Ni^{2+}$ concentration. The average grain size was slightly increased at 0.3 M $Ni^{2+}$ concentration and then slightly decreased with increasing $Ni^{2+}$ concentration.

• 자원리싸이클링
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• 제10권2호
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• pp.27-33
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• 2001

무전해 Ni-Cu-P폐 도금액의 재사용에 대해 소정의 조건에서 조사하였다. 아연화처리한 후 니켈 촉매의 처리는 니켈 촉매처리를 하지 않았을 때 보다 도금시간이 연장되었다 Batch type에서 새로 제조한 도금액에 폐 도금액을 50% 첨가하여도 무전해 Ni-Cu-P 폐 도금액의 재사용이 가능하였다. 새로 제조한 도금액에 소모된 도금액의 성분을 연속적으로 보충하여 도금하면(Continuous type), 보충하지 않았을 경우(B기ch type)보다 도금시간이 10배 연장되었다. 새로 제조한 도금액에 폐 도금액 50%를 첨가하여 소모된 도금액의 성분을 연속적으로 보충할 경우(Continuous type)의 도금시간은 보충하지 않았을 경우(Batch type)의 도금시간 보다 3.7배 연장되었다. 도금층의 불량과 급격한 도금속도의 감소는 도금층의 Ni과 Cu의 성분 변화에 큰 영향을 미쳤다.