• 마이크로전자및패키징학회지
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• 제21권3호
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• pp.51-56
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• 2014

솔더조인트의 신뢰성에는 인쇄회로기판의 표면처리 특성이 많은 영향을 미치고 있다. 본 연구에서는 ENEPIG 표면처리에서 Sn-4.0wt%Ag-0.5wt%Cu (SAC405) 솔더와 Pd 촉매 처리 시간에 따른 high speed shear 에너지 및 파괴 모드를 연구하였다. 또한 Pd 촉매 처리 시간과 무전해 Ni-P 도금의 표면 거칠기 (Ra)와의 관계를 규명하였다. Pd 촉매 처리 시간이 길어질수록 Ni-P nodule의 면적은 넓어지고, Ni-P 도금의 표면 거칠기 (Ra)는 감소한다. 이러한 영향으로 질산 기상 처리한 시편의 high speed shear 평가후 quasi-brittle과 brittle 모드의 점유율은 감소한다. 이는 Pd 촉매 처리 시간의 증가가 SAC405 솔더조인트의 신뢰도를 향상시키는 역할을 한다는 것을 나타낸다.

• 청정기술
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• 제20권2호
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• pp.136-140
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• 2014

본 연구에서 폴리프로필렌을 모재로 사용하여 Co/Ni/P/Mn 4가지 금속을 무전해도금 방법으로 코팅하였다. 이 때 도금욕의 시약의 양을 조절함으로써 폴리프로필렌 위에 도금된 금속의 조성을 다르게 조정하였다. 이러한 조건으로 만들어진 도금 금속에 대하여 두께, 전기적 표면 저항, 주사형 전자현미경을 사용한 표면상태, 에너지 분산형 분석기를 통한 금속조성을 측정하였다. 인 함량이 높을수록 전지저항이 커지는 것이 관찰되어 인 함량과 전지전도성간의 상관성이 있는 것이 관찰되었다. 또한 코팅 금속의 수용액에서의 부식성을 3.5 wt% 염화나트륨 용액과 5.0 wt% 황산용액에서 비교한 결과 인을 많이 포함할수록 내식성이 강함을 알 수 있었다.

• 전기화학회지
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• 제10권2호
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• pp.88-93
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• 2007

Nano-sized Sn particles were coated with Ni-P layer using an electroless deposition method and their anodic performance was tested for lithium secondary batteries. Uniform coating layers were obtained, of which the thickness was controlled by varying the $Ni^{2+}$ concentration in the plating bath. It was found that the Ni-P layer plays two important roles in improving the anodic performance of Sn powder electrode. First, it prevents the inter-particle aggregation between Sn particles during the charge/discharge process. Second, it provides an electrical conduction pathway to the Sn particles, which allows an electrode fabrication without an addition of conductive carbon. A pseudo-optimized sample showed a good cyclability and high capacity ($>400mAh\;g^{-1}$) even without conductive carbon loading.

• 한국표면공학회지
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• 제40권1호
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• pp.32-38
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• 2007

Ni coating layers were formed using a newly developed electroless Ni plating solution. The properties of Ni coating layer such as internal stress, hardness, surface roughness, crystallinity, solderability and surface morphology were investigated using various tools. Results revealed that internal stress decreased with plating time and reached $40N/mm^2$ at 20 minutes of the plating time. Hardness increased with increasing P content and thickness. Surface roughness of the pad decreased with Ni and Ni/Au plating. Crystallinity decreased with increasing P content. Solderability based on wettability decreased with Ni and Ni/Au plating. Based on surface morphology, it is expected that Ni coating layer formed using a newly developed electroless Ni plating solution is lower than that formed using a commercial electroless Ni plating solution in possibility of black pad occurrence.

• 한국자기학회지
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• 제12권6호
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• pp.212-217
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• 2002

비자성층을 사이에 둔 두 강자성층의 보자력 차이를 이용하여 거대자기저항특성을 나타내는 Ta/CoFe/Cu/NiFe/Ta 구조의 pseudo 스핀밸브를 DC 마그네트론 스퍼터링 방법으로 제조하였다. Ta/CoFe/Cu/NiFe/Ta 구조에서 CoFe층의 두께 변화에 따른 자화 특성 및 자기저항 특성을 조사하였으며, 이 구조에서 CoFe층의 두께가 60 $\AA$일 때 자기저항비는 3.82%이고 CoFe층과 NiFe층 사이의 보자력 차이는 27.4 Oe이다. Ta/CoFe/Cu/NiFe/Ta 구조를 갖는 pseudo 스핀밸브에서 CoFe층과 NiFe층의 보자력 차이는 CoFe층의 두께가 20 $\AA$에서 40 $\AA$까지 증가함에 따라 증가하였으며 40 $\AA$ 이상에서는 감소하였다. 이와 같은 결과는 박막의 결정성 및 포화 자기변형(λ$_{s}$)의 변화에 의한 것으로 판단된다. Cu층과 NiFe층 사이에 CoFe층을 삽입한 Ta/CoFe/Cu/NiFe/Ta 구조에서 삽입층인 CoFe층의 두께 변화에 따른 자화특성 및 자기저항 특성을 조사한 결과 CoFe두께가 10$\AA$시 자기저항비가 6.7 %이며. 삼층막 구조 보다 자기저항비가 약 1.5배 이상 증가함을 알 수 있었다.

• 한국자기학회지
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• 제11권5호
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• pp.211-216
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• 2001

합성형 반강자성체(synthetic antiferromagnet)인 CoFe/Ru/CoFe/FeMn을 사용하고 자유층으로 NiFe/CoFe 이중 층을 사용한 탑 스핀밸브 구조를 직류 마그네트론 방식으로 제조하여, 구속층의 두께변화에 따른 자기적 특성과 층간교환자계(interlayer coupling field)의 변화를 조사하였다. Si/Ta(50 )/NiFe(34 )CoFe(16 )/Cu (26 )/CoFe(Pl )/Ru(7 )/CoFe(P2 )/FeMn(100 )/Ta(50 ) 합성형 탑 스핀 밸브 시료에서 고정층의 두께 변화에 따른 자기저항 특성을 조사한 결과 자기저항비가 Pl-P2가 +25 에서 -25 으로 변화시 자기저항비는 완만하게 감소하나, Pl-P2가 영 근처에서는 자화방향의 큰 이탈(canting)에 의하여 자기저항비가 급격히 감소함을 알 수 있다. 합성형 탑 스핀 밸브의 고정층의 두께에 따른 층간교환자계의 변화에 관한 모델을 제시하였으며, 이 모델과 실험에서 구한 결과가 일치함을 확인 할 수 있었다. 단지 Pl-P2근처 영역에서는스핀 플롭 혹은 스핀의 큰 이탈에 의하여 모델의 결과에서 벗어남을 확인하였다.

• 제어로봇시스템학회논문지
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• 제14권4호
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• pp.361-364
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• 2008

Tips of probe card were fabricated using MEMS technology. P-type silicon wafer with $SiO_2$ layer was used as a substrate for fabricating the probe card. Ni-Cr and Au used as seed layer for electroplating Ni were deposited on the silicon wafer. Line patterns for probing devices were formed on silicon wafer by electroplating Ni through mold which formed by MEMS technology. Bridge structure was formed by wet-etching the silicon substrate. AZ-1512 photoresist was used for protection layer of back side and DNB-H100PL-40 photoresist was used for patterning of the front side. The mold with the thickness of $60{\mu}m$ was also formed using THB-120N photoresist and probe tip with thickness of $50{\mu}m$ was fabricated by electroplating process.

• 한국재료학회지
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• 제14권11호
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• pp.769-774
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• 2004

15 nm-Co/15 nm-Ni/P-Si(100)[Type I] and 15 nm-Ni/15 nm-Co/P-Si(100)(Type II) bilayer structures were annealed using a rapid thermal annealer for 40sec at $700/sim1100^{\circ}C$. The annealed bilayer structures developed into composite NiCo silicides and resulting changes in sheet resistance, composition and microstructure were investigated using Auger electron spectroscopy and transmission electron microscopy. Prepared NiCoSix films were further treated in a sequential annealing set up from $900\sim1100^{\circ}C$ with 30 minutes. The sheet resistances of NiCoSix from Type I maintained less than $7\;{\Omega}/sq$. even at the temperature of $1100{\circ}C$, while those of Type II showed about $5\;{\Omega}/sq$. with the thinner and more uniform thickness. With the additive post annealing, the sheet resistance for all the composite silicides remained small up to $900^{\circ}C$. The proposed NiCoSix films were superior over the conventional single-phased silicides and may be easily incorporated into the sub-0.1 ${\mu}m$ process.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 추계학술대회논문집
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• pp.276-279
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• 2004

The factors affecting Ni-Co alloy electroforming were investigated to determine the optimum bath composition and electroplating parameters, like pH, temperature, and current density, suitable for high speed fabrication of a micro mold with longer lifetime. To obtain alloy deposits having uniform thickness and composition, electroplating parameters were finely tuned with home-made electroforming apparatus. Ni-Co alloy deposits had linearly increased Co with $Co^{2+}$ ion concentration in electroplating bath, and showing $412H_v$ of Victors hardness at $23wt\%$ of Co content. For Ni-Co alloy, sulfonate and diol related organic additives were very effective to alleviate its residual stress and surface roughness. The maximum deposition rate was $106{\mu}m/hr$ at 10ASD and the tensile strength of alloy deposit was 2 times larger than that of Ni only case.

• Corrosion Science and Technology
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• 제23권3호
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• pp.215-220
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• 2024

Recently, the demand for Zn-Ni electrogalvanized steel sheets for home appliances and automobiles is increasing. Products should have a thick plating (30 to 40 g/m²) on both side with a thin thickness (≤ 0.8 mm) and the highest surface quality. By a high current density operation, current is concentrated in the edge part of the steel sheet, resulting in large surface dent defects due to dendritic plating. This can lead to a low productivity due to low line speed operation. To solve this problem, this study aimed to identify factors influencing dendritic plating. A cylindrical electroplating device was manufactured. Effects of cut edge shape and thickness of steel plate, current density, temperature, flow rate, electrolyte concentration, and pH on dendrite generation of Zn-Ni electroplating were examined. To investigate effect of edge shape of the steel sheet, the steel sheet was manufactured using three processing methods: shearing, polishing after shearing, and laser. Relative effects thickness and cut edge processing methods of the steel plate, current density, temperature, flow rate, electrolyte concentration, and pH of plating solution on dendrite plating were investigated. To prevent dendrite plating, an edge mask was manufactured and its application effect was investigated.